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Thin Films Engineer Jobs in Oregon (NOW HIRING)

Senior Thin Films Engineer

Hillsboro, OR · On-site

$113K - $156K/yr

Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field * 5+ years semiconductor industry experience with strong focus on thin film deposition ...

Senior Thin Films Engineer

Hillsboro, OR

$60.25 - $77.50/hr

Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field * 5+ years semiconductor industry experience with strong focus on thin film deposition ...

... thin films using thermal ALD, plasma ALD, plasma CVD, epitaxy, or LPCVD reactors. * Demonstrated ... engineering, or physics. * Hands-on experience through internships, research, or academic projects ...

... thin films using thermal ALD, plasma ALD, plasma CVD, epitaxy, or LPCVD reactors. * Demonstrated ... engineering, or physics. * Hands-on experience through internships, research, or academic projects ...

Work closely with peers, supervisor, and engineering team to deeply understand root cause failure ... Thin Films CVD Equipment including Novellus Concept Two (C-2) and/or Mattson Aspen II and/or SPTS ...

Senior Engineer, Field Process As a Senior Engineer, Field Process, you will help expand ASM ... Experience processing, developing, or characterizing thin films in thermal ALD, plasma ALD, plasma ...

Senior Engineer, Field Process As a Senior Engineer, Field Process, you will help expand ASM ... Experience processing, developing, or characterizing thin films in thermal ALD, plasma ALD, plasma ...

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Thin Films Engineer information

See Oregon salary details

$29.9K

$101.4K

$145.1K

How much do thin films engineer jobs pay per year?

As of Aug 1, 2026, the average yearly pay for thin films engineer in Oregon is $101,397.00, according to ZipRecruiter salary data. Most workers in this role earn between $88,769.00 and $122,182.00 per year, depending on experience, location, and employer.

What is a Thin Films Engineer job?

A Thin Films Engineer specializes in the design, deposition, characterization, and optimization of thin film materials used in various industries, such as semiconductors, optics, and coatings. They work with techniques like physical vapor deposition (PVD) and chemical vapor deposition (CVD) to develop films with specific electrical, optical, or mechanical properties. Their role involves process development, troubleshooting, and ensuring quality control in manufacturing environments.

What are some typical daily responsibilities of a Thin Films Engineer?

Thin Films Engineers are generally responsible for designing, developing, and optimizing thin film deposition processes and equipment used in manufacturing semiconductors, photovoltaics, or optical devices. Daily tasks may include setting up and operating deposition systems, analyzing film properties using advanced characterization tools, troubleshooting process issues, and documenting experimental results. They often collaborate closely with process engineers, technicians, and R&D teams to improve product yield and resolve technical challenges. This role involves both hands-on equipment work in cleanroom environments and data-driven analysis to refine manufacturing processes.

What are the key skills and qualifications needed to thrive in the Thin Films Engineer position, and why are they important?

A Thin Films Engineer should possess a strong background in materials science, physics, or engineering, often with a bachelor's or advanced degree in a related field. Experience with thin film deposition techniques (such as PVD, CVD, or sputtering), process control systems, and cleanroom protocols is highly valuable; certifications in these areas can be advantageous. Strong analytical thinking, attention to detail, and effective communication skills help engineers diagnose issues and work efficiently with cross-functional teams. These abilities are crucial for optimizing film quality and performance in high-tech manufacturing environments.

What are the most commonly searched types of Thin Films Engineer jobs in Oregon? The most popular types of Thin Films Engineer jobs in Oregon are:
What are popular job titles related to Thin Films Engineer jobs in Oregon? For Thin Films Engineer jobs in Oregon, the most frequently searched job titles are:
What cities in Oregon are hiring for Thin Films Engineer jobs? Cities in Oregon with the most Thin Films Engineer job openings:
Infographic showing various Thin Films Engineer job openings in Oregon as of July 2026, with employment types broken down into 97% Full Time, 1% Part Time, and 2% Contract. Highlights an 87% Physical, 5% Hybrid, and 8% Remote job distribution, with an average salary of $101,397 per year, or $48.7 per hour.

Senior Thin Films Engineer

Intel Corporation

Hillsboro, OR • On-site

$113K - $156K/yr

Full-time

Medical, Retirement, PTO

Re-posted 22 days ago


Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

19th of 156 rated electronics manufacturers


Job description

Job Details:
Job Description:
Organization Overview: Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes and process capability from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers.
About This Role: Join Intel's Manufacturing Development and Customer Engineering (MDCE) team as a Senior Engineer driving process innovation across Intel's most advanced semiconductor technologies in volume manufacturing. You will spearhead the development, optimization, and manufacturability of critical thin film deposition processes, ensuring seamless transitions from early development to high-volume production while meeting Intel foundry customer requirements.
Your Mission: Lead thin film process excellence across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and/or treatment technologies. Operating at the nexus of Technology Development and High-Volume Manufacturing, you will drive breakthrough solutions for Intel 18A, Intel 3, 12nm, and next-generation technology nodes.
Key Responsibilities
Process Innovation & Excellence
  • Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules
  • Drive defectivity reduction and uniformity improvements through systematic process enhancement
  • Lead technical problem resolution and deliver solutions that meet aggressive technology node targets
  • Optimize equipment performance working with internal teams and key suppliers

Strategic Technical Leadership
  • Align technical vision with customer requirements and business objectives
  • Synthesize complex technical data to formulate and execute strategic responses
  • Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines
  • Deliver rapid execution of innovative solutions to meet challenging development timelines

Cross-Functional Partnership
  • Collaborate closely with Technology Development, High Volume Manufacturing, and Business Groups
  • Build strong relationships with Integration, Device, Yield, Quality, Reliability teams, and external suppliers
  • Present technical findings effectively to diverse audiences from engineering teams to executive leadership
  • Foster in-person collaboration to accelerate decision-making and problem resolution

Industry Leadership
  • Stay current with semiconductor industry trends and emerging process technologies
  • Drive strategic initiatives that position Intel at the forefront of manufacturing innovation
  • Contribute to technology roadmaps through hands-on technical expertise and market insight

What We're Looking For
Technical Excellence
  • Results-driven professional with exceptional technical problem-solving abilities
  • Proven track record of significant accomplishments across multiple technology nodes
  • Strong analytical skills with expertise in yield improvement, performance enhancement, and variation reduction
  • Deep understanding of semiconductor manufacturing strategies, fab operations, and technology transfer

Leadership Capabilities
  • Outstanding communication skills for presenting complex technical information to varied audiences
  • Self-motivated with strong initiative and ability to navigate ambiguous technical challenges
  • Demonstrated ability to manage multiple high-priority projects under pressure while maintaining quality focus
  • Experience driving clarity in complex technical situations and leading cross-functional initiatives

Industry Expertise
  • Comprehensive knowledge of process development, materials science, and device physics
  • Ability to interpret industry trends and translate market dynamics into actionable technical strategies
  • Experience with foundry business models and customer engagement requirements
  • Proven capability to work independently while managing diverse technical assignments

Qualifications:
Minimum Qualifications
  • Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field
  • 5+ years semiconductor industry experience with strong focus on thin film deposition processes
  • Proven experience in process development, technical leadership, and manufacturing engineering
  • Extensive background working with equipment suppliers (AMAT, LAM, ASM, TEL) on process optimization
  • Comprehensive fab startup experience across manufacturing, quality, RandD, and supply chain functions
  • Proficiency with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems

Preferred Qualifications
  • Doctoral degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field with research publications and patent portfolio in thin film technologies
  • Expertise in Gate All Around (GAA) logic technologies within semiconductor foundry environments
  • Proven track record delivering customized solutions across Technology Development and HVM organizations
  • Cross-functional leadership experience managing diverse stakeholder groups
  • Semiconductor foundry experience

Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
US, Arizona, Phoenix
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968