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Tcad Engineer Jobs (NOW HIRING)

The TCAD Device Engineering team at Micron plays a critical role in shaping nextgeneration memory technologies. We work at the intersection of physics, process integration, and design, using advanced ...

Experienced in one of the following fields:- TFT/MOSFET device engineering and modeling (TCAD, SPICE)- Material science & physics, and familiar with the tools of analysis & measurement- Mechanical ...

Experience with TCAD process and device simulation tools is highly preferred * Experience with 3D ... Collaborate with marketing, product engineering and project managers to surmount challenges and ...

Experienced in one of the following fields: - TFT/MOSFET device engineering and modeling (TCAD, SPICE) - Material science & physics, and familiar with the tools of analysis & measurement - Mechanical ...

Responsible for TCAD simulations to define new device design for new technology platform ... Collaborate with marketing, product engineering and project managers to surmount challenges and ...

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Tcad Engineer information

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$36K

$105.1K

$173.5K

How much do tcad engineer jobs pay per year?

As of Jun 7, 2026, the average yearly pay for tcad engineer in the United States is $105,107.00, according to ZipRecruiter salary data. Most workers in this role earn between $77,500.00 and $128,500.00 per year, depending on experience, location, and employer.

What does a typical day look like for a TCAD Engineer?

A typical day for a TCAD Engineer involves using specialized simulation tools to model and analyze semiconductor devices or processes, interpreting simulation results, and working closely with design, process, and device engineering teams to validate and optimize designs. You may also spend time preparing technical reports, troubleshooting simulation challenges, and participating in meetings to align on project goals. Collaboration with different departments is frequent, as your simulation insights directly influence product development and manufacturing strategies. This dynamic environment offers continuous learning and the opportunity to make a significant impact on innovative technology solutions.

What is a Tcad Engineer job?

A TCAD (Technology Computer-Aided Design) Engineer uses simulation tools to model semiconductor processes and device behavior. They analyze and optimize semiconductor fabrication steps, such as doping, etching, and lithography, to improve device performance. TCAD Engineers work closely with process and design teams to enhance manufacturing efficiency and reduce development costs. Their role is essential in developing next-generation semiconductor technology.

What are the key skills and qualifications needed to thrive in the Tcad Engineer position, and why are they important?

To thrive as a TCAD Engineer, you typically need a solid background in semiconductor physics, device modeling, and simulation, often supported by a degree in electrical engineering, materials science, or a related field. Experience with TCAD software tools like Synopsys Sentaurus, Silvaco Atlas, and familiarity with process/device simulation workflows are crucial, and relevant certifications can be a plus. Strong analytical thinking, problem-solving abilities, and clear communication skills help a TCAD Engineer collaborate effectively across multi-disciplinary teams. These competencies are essential for accurately simulating semiconductor devices, optimizing fabrication processes, and delivering reliable results in a fast-paced industry.

More about Tcad Engineer jobs
What cities are hiring for Tcad Engineer jobs? Cities with the most Tcad Engineer job openings:
What are the most commonly searched types of Tcad Engineer jobs? The most popular types of Tcad Engineer jobs are:
What states have the most Tcad Engineer jobs? States with the most job openings for Tcad Engineer jobs include:
What job categories do people searching Tcad Engineer jobs look for? The top searched job categories for Tcad Engineer jobs are:
Infographic showing various Tcad Engineer job openings in the United States as of May 2026, with employment types broken down into 5% Internship, 1% As Needed, 1% Full Time, 4% Temporary, 84% Contract, and 5% Nights. Highlights an 96% Physical, 2% Hybrid, and 2% Remote job distribution, with an average salary of $105,107 per year, or $50.5 per hour.

Senior/Principal TCAD Engineer, Texas Institute for Electronics

The University of Texas at Austin

Austin, TX • On-site

$124K - $171K/yr

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

Posted 12 days ago


University Of Texas at Austin rating

8.1

Company rating: 8.1 out of 10

Based on 62 frontline employees who took The Breakroom Quiz

131st of 534 rated colleges and universities


Job description

Job Posting Title:
Senior/Principal TCAD Engineer, Texas Institute for Electronics
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Hiring Department:
Texas Institute for Electronics
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Position Open To:
All Applicants
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Weekly Scheduled Hours:
40
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FLSA Status:
To Be Determined at Offer
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Earliest Start Date:
Ongoing
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Position Duration:
Expected to Continue
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Location:
AUSTIN, TX
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Job Details:
General Notes
About TIE
Texas Institute for Electronics (TIE) is a transformative, well-funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative.
Our Mission
A key part of our mission is to advance the state of the art in 3D heterogeneous integration (3DHI), chiplet-based architectures, and multi-component microsystems- catalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices.
Our Impact
Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, we are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing.
Our Technology
TIE's 3DHI and chiplet integration platforms integrate novel thermal management and advanced interconnect solutions to deliver unprecedented performance and energy efficiency. Operating at the intersection of defense electronics and commercial markets, TIE offers a rare opportunity to reimagine an industry from the ground up and build transformative products with global impact.
UT Austin, recognized by Forbes as one of America's Best Large Employers, provides outstanding employee benefits and total rewards packages that include:
  • Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
  • Voluntary Vision, Dental, Life, and Disability insurance options
  • Generous paid vacation, sick time, and holidays
  • Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
  • Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
  • Flexible spending account options for medical and childcare expenses
  • Robust free training access through LinkedIn Learning plus professional conference opportunities
  • Tuition assistance
  • Expansive employee discount program including athletic tickets
  • Free access to UT Austin's libraries and museums with staff ID card
  • Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card
  • For more details, please see Benefits | Human Resources and UT Austin Employee Experience | Human Resources and UT Austin Employee Experience | Human Resources

Purpose
Develop and validate multi-physics, silicon-calibrated TCAD models for 3DHI devices and interfaces to predict performance and reliability. Partners across teams and external vendors co-optimize designs, set modeling best practices, deliver reusable reference flows, and mentor engineers.
Responsibilities
  • Develop and own TCAD modeling frameworks for advanced devices and interfaces relevant to 3DHI, including hybrid bonding contacts, TSVs, BEOL interconnects, and emerging device structures.
  • Perform multi-physics simulations (electrical, thermal, mechanical, and reliability) to predict performance, variability, and failure mechanisms across stacked, heterogeneous die systems.
  • Co-optimize devices, interconnect, and packaging designs by working closely with process integration, packaging, and circuit teams to close the loop between fabrication, measurement, and simulation.
  • Calibrate and validate TCAD models using silicon data from wafer-level test vehicles and process monitors; drive model-to-hardware correlation across corners and stress conditions.
  • Define simulation methodologies and best practices for 3D device and interface modeling (e.g., contact resistance, current crowding, electromigration, thermo-mechanical stress).
  • Engage with foundry, EDA, and materials partners to influence next-generation TCAD tool features and process design enablement for 3D-stacked systems.
  • Author technical documentation, modeling guidelines, and reference flows to support ecosystem adoption of TIE's device and interface platforms.
  • Mentor junior engineers and technical staff, setting standards for modeling rigor and engineering judgment across the organization.

Required Qualifications
  • Ph.D. or M.S. in Electrical Engineering, Materials Science, Applied Physics, or a closely related field with strong emphasis on device physics and numerical simulation.
  • 8+ years (Senior) or 12+ years (Principal) of hands-on experience with TCAD for semiconductor devices or interconnects.
  • Deep understanding of semiconductor device physics (MOSFETs, diodes, contacts) and transport mechanisms relevant to nanoscale and 3D structures.
  • Proficiency with commercial TCAD tools such as Synopsys Sentaurus, Silvaco Atlas/Victory, or equivalent multi-physics simulation environments.
  • Experience correlating TCAD models with silicon data and extracting physical parameters from measurements.
  • Strong background in process integration effects (doping, defects, interfaces, stress, and materials).
  • Ability to work cross-functionally with process, packaging, EDA, and system teams in a fast-moving R&D environment.

Relevant education and experience may be substituted as appropriate.
Preferred Qualifications
  • Experience modeling 3D integration features such as hybrid bonding interfaces, TSVs, or wafer-to-wafer/die-to-wafer stacks.
  • Familiarity with reliability physics (electromigration, TDDB, stress migration, thermal cycling) in advanced interconnects or contacts.
  • Exposure to advanced materials systems (Cu-Cu bonding, barrier/liner stacks, low-k dielectrics, compound semiconductors).
  • Knowledge of compact model extraction and linkage between TCAD and SPICE-level models.
  • Publication or patent record in semiconductor device modeling, interconnect physics, or advanced packaging.
  • Strong technical writing and presentation skills for industry and defense-sector collaborations.

Salary Range
TIE pays industry-competitive salaries
Working Conditions
  • May work around standard office conditions
  • Repetitive use of a keyboard at a workstation
  • Use of manual dexterity (ex: using a mouse)
  • Location: Austin, Texas is preferred for close collaboration with our engineering teams and partners. Hybrid work arrangements may be possible, with travel up to 30-50% as needed. (Any flexible arrangement would be subject to university policies and approval regarding employment laws and regulations.)

Work Shift
Monday - Friday
Required Materials
  • Resume/CV
  • 3 work references with their contact information; at least one reference should be from a supervisor

Important for applicants who are NOT current university employees or contingent workers: You will be prompted to submit your resume the first time you apply, then you will be provided an option to upload a new Resume for subsequent applications. Any additional Required Materials (letter of interest, references, etc.) will be uploaded in the Application Questions section; you will be able to multi-select additional files. Before submitting your online job application, ensure that ALL Required Materials have been uploaded. Once your job application has been submitted, you cannot make changes.
Important for Current university employees and contingent workers: As a current university employee or contingent worker, you MUST apply within Workday by searching for Find UT Jobs. If you are a current University employee, log-in to Workday, navigate to your Worker Profile, click the Career link in the left hand navigation menu and then update the sections in your Professional Profile before you apply. This information will be pulled in to your application. The application is one page and you will be prompted to upload your resume. In addition, you must respond to the application questions presented to upload any additional Required Materials (letter of interest, references, etc.) that were noted above.
Employment Eligibility:
Regular staff who have been employed in their current position for the last six continuous months are eligible for openings being recruited for through University-Wide or Open Recruiting, to include both promotional opportunities and lateral transfers. Staff who are promotion/transfer eligible may apply for positions without supervisor approval.
Retirement Plan Eligibility:
The retirement plan for this position is Teacher Retirement System of Texas (TRS), subject to the position being at least 20 hours per week and at least 135 days in length. This position has the option to elect the Optional Retirement Program (ORP) instead of TRS, subject to the position being 40 hours per week and at least 135 days in length.
Background Checks:
A criminal history background check will be required for finalist(s) under consideration for this position.
Equal Opportunity Employer:
The University of Texas at Austin, as an equal opportunity/affirmative action employer, complies with all applicable federal and state laws regarding nondiscrimination and affirmative action. The University is committed to a policy of equal opportunity for all persons and does not discriminate on the basis of race, color, national origin, age, marital status, sex, sexual orientation, gender identity, gender expression, disability, religion, or veteran status in employment, educational programs and activities, and admissions.
Pay Transparency:
The University of Texas at Austin will not discharge or in any other manner discriminate against employees or applicants because they have inquired about, discussed, or disclosed their own pay or the pay of another employee or applicant. However, employees who have access to the compensation information of other employees or applicants as a part of their essential job functions cannot disclose the pay of other employees or applicants to individuals who do not otherwise have access to compensation information, unless the disclosure is (a) in response to a formal complaint or charge, (b) in furtherance of an investigation, proceeding, hearing, or action, including an investigation conducted by the employer, or (c) consistent with the contractor's legal duty to furnish information.
Employment Eligibility Verification:
If hired, you will be required to complete the federal Employment Eligibility Verification I-9 form. You will be required to present acceptable and original documents to prove your identity and authorization to work in the United States. Documents need to be presented no later than the third day of employment. Failure to do so will result in loss of employment at the university.
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E-Verify:
The University of Texas at Austin use E-Verify to check the work authorization of all new hires effective May 2015. The university's company ID number for purposes of E-Verify is 854197. For more information about E-Verify, please see the following:
  • E-Verify Poster (English and Spanish) [PDF]
  • Right to Work Poster (English) [PDF]
  • Right to Work Poster (Spanish) [PDF]

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Compliance:
Employees may be required to report violations of law under Title IX and the Jeanne Clery Disclosure of Campus Security Policy and Crime Statistics Act (Clery Act). If this position is identified a Campus Security Authority (Clery Act), you will be notified and provided resources for reporting. Responsible employees under Title IX are defined and outlined in HOP-3031.
The Clery Act requires all prospective employees be notified of the availability of the Annual Security and Fire Safety report. You may access the most recent report here or obtain a copy at University Compliance Services, 1616 Guadalupe Street, UTA 2.206, Austin, Texas 78701.

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