Senior Hardware Engineer Jobs in Florida (NOW HIRING)

iPolish, Inc.

Senior Electrical & Hardware Engineer

Full-Time Mid-to-Senior Level On-Site / Hybrid

Orlando, FL

Full-Time

Engineering

iPolish, Inc. is a Central Florida digital beauty technology company pioneering electrophoretic display (EPD)-based color-changing cosmetic products, including digitally programmable press-on nails and the Magic Wand handheld programming device. We operate at the intersection of advanced materials science, consumer electronics, and fashion-tech, with manufacturing partners in China, Taiwan, USA, Japan and Mexico and a product roadmap targeting simultaneous launch across North American, European, and Asia-Pacific markets.

We are seeking an experienced Senior Electrical & Hardware Engineer to lead the design, prototyping, and bring-to-market of mixed-signal embedded systems at the core of the iPolish® product platform. This role is central to the continued development of the Magic Wand device — a compact, battery-powered wireless EPD programmer — as well as next-generation iPolish press on nail display hardware. You will work directly with the founders across the full hardware development lifecycle, from schematic capture through DFM, multi-market regulatory certification, and volume manufacturing. This role carries significant international compliance coordination responsibility: iPolish products are wireless, battery-powered, and skin-adjacent, and the successful candidate will help drive certification and market-access programs across the US, Canada, UK, EU, and Asia-Pacific.

• Own schematic capture and PCB layout for compact, battery-powered consumer electronics products, including the Magic Wand (ESP32-C6-class Wi-Fi/BLE SoC, LiPo power system, high-voltage EPD source/gate drivers)


• Design and validate low-voltage analog/mixed-signal circuits, including power-path management (ideal-diode ORing, PFET mux, LDOs), high-voltage EPD driver rails (±30 V class VGH/VGL supplies), and USB-C charging topologies


• Perform component voltage-rating and derating audits, tolerance analysis, and FMEA; maintain design verification test plans for reliability and safety compliance


• Lead design-for-manufacturing (DFM) reviews and coordinate with overseas CM partners (China, Taiwan, Mexico) on PCB fabrication, panelization, SMT assembly, and functional test infrastructure — including bed-of-nails / spring-pin programming and test fixtures


• Develop and maintain full Bills of Materials (BOM) and CPL/placement files with preferred and alternate sourcing, DigiKey / LCSC / Mouser cross-references, and formal component change documentation (ECOs, CCNs)


• Coordinate international wireless and product-safety certification programs end-to-end: FCC and ISED (Canada), CE RED and UKCA, SAR testing, MIC/Giteki (Japan), SRRC (China), and emerging EU radio-equipment cybersecurity requirements (EN 18031 series); manage test-house relationships, technical files, and Declarations of Conformity


• Support battery and product safety compliance, including UN 38.3 transport testing, pack-level certification (UL 2054 / IEC 62133 class), and safety-relevant component selection (e.g., glow-wire-compliant connectors)


• Track evolving market-access requirements (EU GPSR, EU Battery Regulation labeling and marking phases, RoHS/REACH) and translate them into actionable design and documentation changes


• Collaborate on firmware-hardware integration with embedded software developers; review strapping-pin and boot configurations, bring-up procedures, and factory calibration and programming flows


• Contribute to IP documentation and patent prosecution support as needed, working with outside counsel and RocketPatent LLC


• Manage hardware project timelines, milestone tracking, and cross-functional dependencies across engineering, operations, and external vendors; maintain schedules from prototype build through production release


• Author and maintain technical project documentation including design history files, ECO logs, component change notices, and design review packages

• B.S. or M.S. in Electrical Engineering, Computer Engineering, or equivalent


• 5+ years of hands-on hardware product development experience with consumer electronics or IoT devices


• Proficiency in schematic capture and PCB layout; Fusion 360 Electronics / EAGLE experience strongly preferred (Altium or KiCad acceptable with willingness to work in the company toolchain)


• Demonstrated experience with ESP32 or equivalent Wi-Fi/BLE SoC families; familiarity with Nordic nRF52-class BLE SoCs a plus


• Experience with battery-powered products: LiPo charging/protection, power-path management, thermal and safety design


• Solid understanding of EMC principles and direct experience supporting FCC/CE certification campaigns, including pre-scan, test-house liaison, and remediation


• Working knowledge of international market-access frameworks for wireless consumer products (radio, safety, battery, and labeling requirements) and ability to coordinate multi-country certification schedules


• Comfort working in a fast-paced startup environment with hands-on prototyping and bench testing

• Experience with electrophoretic displays (E Ink-class, SiPix, or custom EPD) or high-voltage display driver ICs, including waveform and supply-rail design considerations


• Background in manufacturing engineering, DFM, or factory bring-up at contract manufacturers in Asia or Mexico


• Experience with RF antenna variants and conducted/radiated test configurations (e.g., U.FL/W.FL test ports for certification builds)


• Familiarity with HTS classification, tariff structures, and Taiwan/China supply chain logistics


• Experience contributing to patent applications, IP disclosures, or FTO analyses


• Prior use of LCSC, DigiKey, and Mouser for component sourcing, cross-referencing, and lifecycle management


• Familiarity with project management methodologies (Agile, stage-gate, or hybrid); experience using engineering task-tracking tools


• Experience managing external vendors, test labs, or CM partners to schedule and deliverable commitments


• Background in semiconductor or IC manufacturing processes — including wafer fabrication, packaging, or BEOL operations — with the ability to evaluate component-level design margins and interface effectively with IC vendors on custom or semi-custom silicon

• Direct collaboration with the founding team on industry-first EPD beauty technology


• Competitive compensation commensurate with experience; equity participation available


• Flexible hybrid arrangement after initial onboarding period


• Opportunity to own key technical domains and grow into a technical leadership role as the company scales