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Semiconductor Process Integration Engineer Jobs in New York

GlobalFoundries

SMTS Integration Engineering

New York, NY · On-site

$118K - $210K/yr

About GlobalFoundries GlobalFoundries is a leading full-service semiconductor foundry providing a ... The core responsibilities of this team involve ownership of process integration of a multi wafer ...

Scalence L.L.C.

Integration Engineer

Manhattan, NY · On-site

$114K - $154K/yr

... processes. • Optimize integration performance, scalability, and reliability. • Create and ... programming. • Experience in data transformation. • Knowledge of enterprise integration ...

Elligint Health

Integration Engineer

Edison, NJ · Hybrid

$107K - $144K/yr

The Integration Engineer is a strategic role that is expected to assist in the design and delivery ... Document process, identify areas of improvement, and increase your knowledge and expertise through ...

Elligint Health

Integration Engineer

Edison, NJ · On-site

$107K - $144K/yr

The Integration Engineer is a strategic role that is expected to assist in the design and delivery ... Document process, identify areas of improvement, and increase your knowledge and expertise through ...

Carian

DER Integration Engineer

Somerset, NJ · On-site

$90K - $125K/yr

Distributed Energy Resources (DER) Integration Engineer Location: Remote Job Type: Full-Time ... Exposure to DER interconnection processes, electrification programs, or renewable integration ...

New

GlobalFoundries

Process Engineer - Etch

New York, NY · On-site

$105K - $120K/yr

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of ... team, PI (process integration) team, cost management and quality assurance teams. Other ...

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All JobsSemiconductor Process Integration Engineer JobsSemiconductor Process Integration Engineer Jobs in New York

Semiconductor Process Integration Engineer information

See New York salary details

$54.2K

$100.7K

$155.9K

How much do semiconductor process integration engineer jobs pay per year?

As of Aug 15, 2026, the average yearly pay for semiconductor process integration engineer in New York is $100,670.00, according to ZipRecruiter salary data. Most workers in this role earn between $81,500.00 and $112,700.00 per year, depending on experience, location, and employer.

What are the typical daily responsibilities of a semiconductor process integration engineer?

As a Semiconductor Process Integration Engineer, your daily tasks usually involve coordinating with process and device engineers, analyzing production data, and troubleshooting yield or performance issues in semiconductor manufacturing. You may develop and optimize process flows, work on root cause analyses for defects, and implement new technologies to improve device performance. Routine meetings with cross-functional teams—such as design, process engineering, and quality assurance—are common, and your role often includes documenting experimental results and preparing technical presentations. This hands-on, dynamic work environment fosters both technical growth and opportunities to contribute directly to product quality and innovation.

What are the key skills and qualifications needed to thrive as a semiconductor process integration engineer?

To thrive as a Semiconductor Process Integration Engineer, you need a solid understanding of semiconductor device physics, fabrication processes, and materials science, often requiring at least a bachelor's or master's degree in electrical engineering, materials science, or a related field. Proficiency with semiconductor process simulation tools (such as TCAD), data analysis software, and familiarity with cleanroom protocols is essential. Effective communication, problem-solving, and strong project management skills set outstanding candidates apart. These competencies are crucial for optimizing process flows, troubleshooting production issues, and fostering successful collaboration in a multidisciplinary manufacturing environment.

What is a semiconductor process integration engineer?

A Semiconductor Process Integration Engineer is responsible for developing and optimizing semiconductor fabrication processes by integrating various process modules, such as lithography, etching, deposition, and CMP. They work closely with design, process, and equipment engineers to ensure device performance, yield, and manufacturability. Their role involves data analysis, troubleshooting process issues, and continuous improvement of semiconductor manufacturing. Additionally, they help with technology transfers and scaling processes for high-volume production.

What are popular job titles related to Semiconductor Process Integration Engineer jobs in New York?

For Semiconductor Process Integration Engineer jobs in New York, the most frequently searched job titles are:

What job categories do people searching Semiconductor Process Integration Engineer jobs in New York look for?

The top searched job categories for Semiconductor Process Integration Engineer jobs in New York are:

Semiconductor Process Integration Engineer jobs near you
Infographic showing various Semiconductor Process Integration Engineer job openings in New York as of August 2026, with employment types broken down into 1% As Needed, 77% Full Time, 17% Part Time, 1% Temporary, 3% Contract, and 1% Nights. Highlights an 92% Physical, 2% Hybrid, and 6% Remote job distribution, with an average salary of $100,670 per year, or $48.4 per hour.

3D Heterogeneous Integration Engineer

GlobalFoundries

New York, NY • On-site

$98K - $176K/yr

Full-time

Re-posted 10 days ago

GlobalFoundries rating

8.3

Company rating: 8.3 out of 10

Based on 35 frontline employees who took The Breakroom Quiz

67th of 540 rated manufacturers

Job description

About GlobalFoundries:
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.
Summary of Role:
GlobalFoundries Fab8 is seeking an experienced and dedicated R&D engineer, joining Advanced Packaging Lab (APL) to lead advanced 3D Heterogeneous Integration (3D-HI) initiatives spanning multiple application domains.
Essential Responsibilities:
  • Drive 3D-HI process development efforts for the building blocks required for advanced packaging solutions needed by the GlobalFoundries product lines (e.g., multi-die stacking, die-to-wafer / wafer-to-wafer fine pitch hybrid bonding, etc.).
  • Partner with unit process engineers, manufacturing engineers, as well as directly with the tool and material vendors for the GlobalFoundries fabs.
  • Collaborate joint development projects (JDP) with partners to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration (3D-HI) processes.
  • Drive end-to-end process integration and planning to enable new capabilities and early product prototyping across multiple programs.
  • Develop expertise in processes, materials, and tooling, and make efficient use of characterization resources.
  • Drive data analysis, interpretation of results, and understanding of failure modes.
  • Identify and resolve process integration issues and related challenges.
  • Generate IP related to novel wafer integration and packaging technology.

Other Responsibilities:
  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
  • Participate in hiring activities.
  • Mentor and guide new hires to assume their roles and responsibilities.
  • Other duties as assigned by manager.

Required Qualifications:
  • Education - Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
  • MS degree with at least 5 years of prior related work experience.
  • In depth knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.
  • Strong problem solving and technical trouble shooting skills including expertise in design of experiment.
  • Must have at least an overall 3.0 GPA and proven good academic standing.
  • Language Fluency - English (Written & Verbal).
  • Travel - Up to 10%.

Preferred Qualifications:
  • Education - PhD education level preferred with at least 3 years of prior related work experience.
  • Demonstrated prior leadership experience internally or with an OSAT eco-system.
  • Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
  • Strong written and verbal communication skills.
  • Strong planning and organizational skills.

Expected Salary Range
$98,000.00 - $176,000.00
The exact Salary will be determined based on qualifications, experience and location.
If you need a reasonable accommodation for any part of the employment process, please contact us by email at usaccommodations@gf.com and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.
An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.
GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.
All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law

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