Position Summary
The SMT Process Engineer is responsible for developing, optimizing, and sustaining Surface Mount Technology (SMT) processes to support PCBA manufacturing. This role ensures process stability, yield improvement, and product quality through hands-on engineering support, data-driven analysis, and cross-functional collaboration.
The engineer will play a key role in New Product Introduction (NPI), process validation, and continuous improvement initiatives to support advanced electronic manufacturing programs.
Key Responsibilities:
Develop, configure, and optimize SMT manufacturing processes from NPI through mass production, ensuring readiness for scale and quality targets
Drive yield improvement and process stability across SMT lines, including stencil printing, placement, reflow, and inspection
Perform root cause analysis (RCA) on SMT defects (e.g., bridging, tombstoning, voiding, insufficient solder) and implement corrective and preventive actions
Support SMT line setup, validation, and qualification, including process parameter development and DOE (Design of Experiments)
Establish and maintain process documentation, including SOPs, work instructions, PFMEA, and control plans
Monitor key performance metrics (yield, defect rate, cycle time, OEE) and drive continuous improvement initiatives
Technical Skills:
Preferred Skills:
Qualifications:
Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Manufacturing Engineering, or a related field
Pay Range: $80,000 - $95,000/year
Exempt Status
Foxconn Assembly, LLC is an Equal Opportunity Employer (EOE). All qualified candidates will receive consideration without regard to race, color, religion, gender, sexual orientation, national origin, age, disability, or marital status in accordance with applicable federal, state and local laws.
Foxconn Assembly, LLC participates in E-Verify and will provide the federal government with your Form I-9 information to confirm that you are authorized to work in the U.S.
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