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Packaging Engineering Jobs in Oregon (NOW HIRING)

Intel

Director, Engineering

Hillsboro, OR · On-site

Partner closely with Architecture, Circuit Design, RTL Design, Verification, Package, Product Engineering, and Technology Development teams.Manage schedule, resource allocation, risk mitigation, and ...

Corbin Engineering

Electrical Engineer

Beaverton, OR · On-site

We offer a very competitive compensation package within the engineering consulting industry. Flexible work hours. Comprehensive medical, prescription, dental, and vision plans. 401(k) plan with ...

Onto

Senior Manager, Hardware Engineering

Hillsboro, OR · On-site

$144K - $216K/yr

... packages; metal interconnect composition; factory analytics; and lithography for advanced ... Drive engineering excellence through effective design reviews, risk management, and technical ...

Corbin Engineering

Junior Mechanical Engineer

Beaverton, OR · On-site

$66K - $85K/yr

We offer a very competitive compensation package within the engineering consulting industry. Flexible work hours. Comprehensive medical, prescription, dental and vision plans. 401(k) plan with ...

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Packaging Engineering information

See Oregon salary details

$20

$44

$70

How much do packaging engineering jobs pay per hour?

As of Sep 15, 2026, the average hourly pay for packaging engineering in Oregon is $44.79, according to ZipRecruiter salary data. Most workers in this role earn between $34.57 and $52.12 per hour, depending on experience, location, and employer.

What is packaging engineering?

Packaging engineering is a specialized field of engineering that focuses on the design, development, testing, and production of packaging for products. Packaging engineers work to ensure that products are protected, preserved, and presented in a way that is efficient, cost-effective, and sustainable. They consider factors such as materials, manufacturing processes, safety regulations, and environmental impact. This role often involves collaboration with product designers, manufacturers, and marketing teams to create packaging solutions that meet both functional and aesthetic requirements.

What are some common challenges packaging engineers face when balancing sustainability with cost and functionality?

Packaging engineers often encounter the challenge of designing solutions that are environmentally friendly while still being cost-effective and meeting product protection requirements. Sustainable materials can sometimes be more expensive or less readily available, and may require adjustments in manufacturing processes. Additionally, engineers must ensure that the chosen packaging maintains product integrity during shipping and storage. Collaboration with suppliers, marketing, and manufacturing teams is essential to find a balance that aligns with company goals and regulatory standards.

What are the key skills and qualifications needed to thrive as a packaging engineer, and why are they important?

To thrive as a Packaging Engineer, you need a solid background in engineering principles, materials science, and packaging design, usually supported by a degree in packaging engineering or a related field. Proficiency with CAD software, packaging simulation tools, and knowledge of regulatory standards are typically required. Strong problem-solving, project management, and communication skills help you collaborate effectively and innovate solutions. These skills ensure product safety, cost efficiency, and compliance throughout the packaging lifecycle.

What is the difference between Packaging Engineering vs Packaging Technician?

AspectPackaging EngineeringPackaging Technician
CredentialsBachelor's degree in engineering or related fieldTechnical diploma or associate degree
Work EnvironmentDesign, development, and testing of packaging solutionsImplementing and troubleshooting packaging processes
Industry UsageDesigning new packaging systems for productsMaintaining and operating packaging equipment
Common Search IntentUnderstanding roles in packaging design and developmentLearning about packaging process support and technical tasks

Packaging Engineering focuses on designing and developing packaging solutions, requiring engineering knowledge and design skills. Packaging Technicians support these systems by implementing and maintaining packaging processes, often with technical training. Both roles are essential in the packaging industry but differ in responsibilities and qualifications.

What does a packaging engineering do?

A packaging engineer designs and develops packaging solutions to protect products during storage, handling, and transportation. They evaluate materials, create prototypes, and ensure compliance with safety and industry standards, often using CAD software and testing methods. Their work helps optimize packaging for cost, sustainability, and efficiency.

What are popular job titles related to Packaging Engineering jobs in Oregon?

For Packaging Engineering jobs in Oregon, the most frequently searched job titles are:

What job categories do people searching Packaging Engineering jobs in Oregon look for?

The top searched job categories for Packaging Engineering jobs in Oregon are:

Packaging Engineering jobs near you
Infographic showing various Packaging Engineering job openings in Oregon as of September 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution, with an average salary of $93,168 per year, or $44.8 per hour.

Advanced Packaging Integration and Simulation Intern

Hillsboro, OR • On-site

Intel
Manufacturing • 10K+ employees
Learn more about Intelexternal

Full-time

Medical, Retirement, PTO

Posted 5 days ago

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

Job description

Job Details:Job Description: 

Intel Technology Research is advancing the future of AI and high-performance computing through innovative advanced packaging technologies and 3D heterogeneous integration. Enabling novel system architecture, developing innovating process integration and establishing predictive physics-based simulation capabilities are critical for enabling complex large form factor packages with high-bandwidth interconnect. As an Advanced Packaging Integration and Simulation Intern, you will collaborate with leading researchers, process engineers, and modeling experts to develop and assess next-generation package architectures. In this role, you will contribute to advanced Research and Dev across package integration, process flow definition and development, package modeling, yield and reliability assessment, and data analytics.

Key Responsibilities

  • Support advanced packaging integration activities across wafer-level and package-level process flows, including wafer level process, 2.5D/3D integration, chiplet integration, and hybrid bonding-related modules.

  • Develop and execute Design of Experiments (DOE) to understand relationships among package architecture, process conditions, material behavior, and electrical/mechanical performance.

  • Build, calibrate, and apply simulation models to understand mechanical characteristics of packages, interconnect quality, thermal performance, etc.

  • Conduct thermo-mechanical simulations to evaluate material responses to temperature, stress, and package-level loading conditions.

  • Analyze inspection, process, and simulation data to identify root causes of integration challenges and recommend improvement paths.

  • Collaborate with cross-functional teams to optimize process flows for yield, reliability, manufacturability, and package performance.

  • Present findings through technical presentations and potential publications.

What You Will Gain:

  • Gain hands-on exposure to advanced packaging integration challenges that enable future semiconductor technologies.

  • Learn how process integration, material selection, design rules, metrology, and package architecture interact to drive yield and reliability.

  • Develop practical experience with developing package simulation, model validation, and data-driven engineering analysis.

  • Gain exposure to advanced packaging architectures, including chiplets, 2.5D/3D integration, wafer-level assembly, and industrial leading interconnect technologies.

  • Participate in technical reviews, technology forums, and intern research presentations with experienced engineers and researchers.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences.

Minimum Qualifications
Candidate must be pursuing aPhD degreein Mechanical Engineering, Materials Science and Engineering, Electrical Engineering, Physics, Manufacturing Engineering, or a closely related STEM discipline

Must be available to work full-time for the duration of a 3-month internship.

3+ months of academic or professional experience in one or more of the following areas:

  • Experience with laboratory experimentation, engineering data analysis, or simulation/modeling workflows.

  • Experience in process integration or hands-on module development.

  • Programming or data analysis experience using Python, MATLAB, JMP, R, or similar tools.

  • Statistical analysis, DOE, or machine learning for engineering applications.

Preferred Qualifications

6+ months of academic or professional experience in one or more of the following areas:

  • Advanced packaging, heterogeneous integration, wafer-level packaging, chiplet integration, or package assembly process development.

  • Thermal/mechanical/electrical modeling, finite element analysis preferred.

  • Failure analysis for semiconductor process and package assembly.

Join us at Intel to contribute to technological advancements while building a rewarding and impactful career. Apply now to be a part of our extraordinary journey.

Job Type:Student / InternShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:US, Oregon, HillsboroPosting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

What Intel employees say

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Benefits

Hours and flexibility

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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