ZipRecruiter

Log In

1

Internship Packaging Development Jobs (NOW HIRING)

INTEL

Packaging Module Development Engineer

Phoenix, AZ

$127K - $179K/yr

... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ

$127K - $179K/yr

... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ

$127K - $179K/yr

... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ

$94K - $133K/yr

Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...

Rutgers University

$2K/wk

Benefits Rutgers provides a comprehensive benefits package to eligible employees. The specific ... Promotes academic, career and/or personal development; Prepare materials for an Online Internship ...

Duracell

R&D - Packaging Engineer

Atlanta, GA · On-site

... packaging. Supports Front End Innovation, Material and Structural Development in line with our ... Related Internship experience is included. * Technical Mastery - Ideal candidate has demonstrated ...

next page

Showing results 1-20

All JobsInternship Packaging Development Jobs

Internship Packaging Development information

See salary details

$8

$17

$24

How much do internship packaging development jobs pay per hour?

As of Jun 14, 2026, the average hourly pay for internship packaging development in the United States is $17.04, according to ZipRecruiter salary data. Most workers in this role earn between $14.42 and $19.23 per hour, depending on experience, location, and employer.

What is the difference between Internship Packaging Development vs Packaging Engineer?

AspectInternship Packaging DevelopmentPackaging Engineer
CredentialsEnrolled in or recent graduate of relevant degree (e.g., Packaging, Industrial Design)Bachelor's or higher in Packaging Engineering or related field
Work EnvironmentInternship programs, entry-level tasks, supervisedFull-time professional role, independent project management
Industry UsageCommon in manufacturing, consumer goods, and packaging companiesEstablished in packaging design, development, and optimization teams

Internship Packaging Development roles are entry-level positions designed for students or recent graduates gaining hands-on experience. Packaging Engineers are full-time professionals responsible for designing, testing, and improving packaging solutions. While both roles focus on packaging, internships are learning opportunities, whereas engineers handle ongoing development projects.

What cities are hiring for Internship Packaging Development jobs? Cities with the most Internship Packaging Development job openings:
What are the most commonly searched types of Packaging Development jobs? The most popular types of Packaging Development jobs are:
What states have the most Internship Packaging Development jobs? States with the most job openings for Internship Packaging Development jobs include:
Internship Packaging Development jobs near you
Packaging Module Development Engineer

Packaging Module Development Engineer

Intel

Phoenix, AZ

Full-time

Medical, Retirement, PTO

Posted 8 days ago

Intel rating

8.8

Company rating: 8.8 out of 10

Based on 143 frontline employees who took The Breakroom Quiz

8th of 139 rated electronics manufacturers

Job description

Job Details:Job Description: 

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.


As a Packaging Module Development Engineer, you will:


Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms.
Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities
Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing.
Manage projects to ensure alignment with product development schedules and execution milestones.
Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges.
Provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environments
Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events
The ideal candidate should demonstrate:


Technical leadership, strategic planning, and critical thinking.
Ability to coach and develop technical teams.
Tolerance for ambiguity and adaptability in a dynamic environment.
Flexibility in managing changing priorities and responsibilities.
Experience leading teams in a highly matrixed organization.
Initiative and ability to work independently.
Strong communication, influencing, technical, and analytical skills.
This position requires regular onsite presence.

Qualifications:

You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:


Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field.


Experience listed above should be a combination of the following:

Programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts.
Preferred Qualifications:


One or more years of experience in one or more of the following areas:
Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE)
Delivery of results for complex, time-critical technical projects.
Semiconductor fabrication processes and technologies.
Prior related work experience within a semiconductor foundry.

Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:Business group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

What Intel employees say

Pay

Benefits

Hours and flexibility

Workplace

Get the full story on Breakroom

Intel logo

About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

View All Intel Jobs

Apply