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Internship Packaging Development Jobs (NOW HIRING)

INTEL

Packaging Module Development Engineer

Phoenix, AZ · On-site

$127K - $179K/yr

... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...

Rutgers University

$2.7K/wk

Benefits Rutgers provides a comprehensive benefits package to eligible employees. The specific ... Promotes academic, career and/or personal development; Prepare materials for an Online Internship ...

JRG Partners

Packaging Engineer

Omaha, NE · On-site

$65K - $100K/yr

As an Packaging Engineer reporting to the Packaging Manager, you will work toward development and ... internship (CPG preferred) * Experience with packaging materials, capabilities and equipment.

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How much do internship packaging development jobs pay per hour?

As of Jul 12, 2026, the average hourly pay for internship packaging development in the United States is $17.04, according to ZipRecruiter salary data. Most workers in this role earn between $14.42 and $19.23 per hour, depending on experience, location, and employer.

What is the difference between Internship Packaging Development vs Packaging Engineer?

AspectInternship Packaging DevelopmentPackaging Engineer
CredentialsEnrolled in or recent graduate of relevant degree (e.g., Packaging, Industrial Design)Bachelor's or higher in Packaging Engineering or related field
Work EnvironmentInternship programs, entry-level tasks, supervisedFull-time professional role, independent project management
Industry UsageCommon in manufacturing, consumer goods, and packaging companiesEstablished in packaging design, development, and optimization teams

Internship Packaging Development roles are entry-level positions designed for students or recent graduates gaining hands-on experience. Packaging Engineers are full-time professionals responsible for designing, testing, and improving packaging solutions. While both roles focus on packaging, internships are learning opportunities, whereas engineers handle ongoing development projects.

What cities are hiring for Internship Packaging Development jobs? Cities with the most Internship Packaging Development job openings:
What are the most commonly searched types of Packaging Development jobs? The most popular types of Packaging Development jobs are:
What states have the most Internship Packaging Development jobs? States with the most job openings for Internship Packaging Development jobs include:
Internship Packaging Development jobs near you
Packaging Module Development Engineer

Packaging Module Development Engineer

INTEL

Phoenix, AZ • On-site

$127K - $179K/yr

Full-time

Medical, Retirement, PTO

This job post has expired today. Applications are no longer accepted.

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 146 frontline employees who took The Breakroom Quiz

11th of 142 rated electronics manufacturers

Job description

Job Description

  • Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.

  • Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.

  • Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.

  • Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.

  • Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.

  • Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.

  •  Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.

  • Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.

  • Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.

  • Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur.

  • Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.

Note: This role requires regular onsite presence to fulfill essential job responsibilities.


Qualifications

You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:

  • Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related STEM field with 5+ years of industry experience

  • -OR- PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 2+ years of industry experience.

  • Experience listed above should be a combination of the following:

- Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE), preferably within semiconductor or advanced manufacturing environments.
- Strong experimental background, including hands-on laboratory or prototype development experience.
- Strong collaboration and communication skills with cross-functional teams and external collaborators.
- Experience in programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts


Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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