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Ic Package Design Engineer Jobs (NOW HIRING)

Apple

IC Package Design Engineer

Los Angeles, CA · On-site

$146K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next ... Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms ...

Apple

IC Package Design Engineer

Austin, TX · On-site

$134K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next ... Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms ...

Apple Inc.

IC Package Design Engineer

Austin, TX · On-site

$90 - $130/hr

Description As a Package design engineer, you will lead advanced package architecture, drive ... Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms ...

Apple

IC Package Design Engineer

Austin, TX

$175K - $308K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next ... Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms ...

Apple

IC Package Design Engineer

Los Angeles, CA

$122K - $214K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next ... Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms ...

Apple

IC Package Design Engineer

Austin, TX

$175K - $308K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next ... Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms ...

Apple

IC Package Design Engineer

Austin, TX

$175K - $308K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next ... Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms ...

Apple

IC Package Design Engineer

Los Angeles, CA

$122K - $214K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next ... Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms ...

Apple

IC Package Design Engineer

Los Angeles, CA

$122K - $214K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next ... Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms ...

Etched

IC Package Engineer

Cupertino, CA

$2.0K/mo

IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all aspects of substrate layout and package design work. The ideal candidate will have extensive ...

Etched

IC Package Engineer

Cupertino, CA · On-site

$2.0K/mo

IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all aspects of substrate layout and package design work. The ideal candidate will have extensive ...

Etched

IC Package Engineer

Cupertino, CA

$2.0K/mo

IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all aspects of substrate layout and package design work. The ideal candidate will have extensive ...

Apple Inc.

IC Package Design Engineer

Los Angeles, CA · On-site

$171.60 - $302.20/hr

Description As a Package design engineer, you will lead advanced package architecture, drive ... Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms ...

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Ic Package Design Engineer information

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$90K

$136.5K

How much do ic package design engineer jobs pay per year?

As of Aug 22, 2026, the average yearly pay for ic package design engineer in the United States is $135,040.00, according to ZipRecruiter salary data. Most workers in this role earn between $136,000.00 and $136,000.00 per year, depending on experience, location, and employer.

What is an IC Package Design Engineer?

An IC Package Design Engineer is responsible for designing and developing semiconductor chip packaging to ensure electrical, thermal, and mechanical performance. They work with cross-functional teams to optimize package layouts, material selection, and manufacturing processes. Their role involves using CAD tools, simulation software, and collaborating with fabrication and assembly teams to meet product requirements.

What are the daily responsibilities of an IC Package Design Engineer?

IC Package Design Engineers typically spend their days designing and simulating semiconductor package layouts, reviewing schematics, and ensuring designs meet electrical and thermal requirements. They collaborate closely with PCB designers, test engineers, and manufacturing teams to optimize the package for performance and ease of assembly. Daily work also involves troubleshooting design issues, interacting with vendors for material selection, and participating in design reviews alongside multidisciplinary teams. The role balances hands-on technical tasks with communication, making cross-team coordination a key part of the job.

What are the key skills and qualifications needed to thrive as an IC Package Design Engineer?

Success as an IC Package Design Engineer requires a strong background in electrical engineering, semiconductor packaging principles, and CAD software proficiency, typically supported by a relevant engineering degree. Familiarity with electronic design automation (EDA) tools such as Cadence or Mentor Graphics, and knowledge of industry standards like JEDEC, are highly valuable. Excellent problem-solving, attention to detail, and effective communication skills help navigate complex design challenges and collaborate with cross-functional teams. These abilities are crucial for ensuring robust package designs that meet performance, cost, and manufacturability requirements in the fast-paced semiconductor industry.

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What states have the most Ic Package Design Engineer jobs?

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Ic Package Design Engineer jobs near you
Infographic showing various Ic Package Design Engineer job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 75% Full Time, 10% Part Time, and 14% Contract. Highlights an 79% Physical, 2% Hybrid, and 19% Remote job distribution, with an average salary of $135,040 per year, or $64.9 per hour.

IC Packaging Design Engineer

Comprehensive Resources Inc.

Chandler, AZ • On-site

$138K/yr

Other

Posted 22 days ago

Job description

Job Title: IC Packaging Design Engineer

Location: Chandler, AZ or Hillsboro, OR (100% Onsite)

Duration: Long-Term Contract (12+ Months)

Employment Type: C2C / W2

Openings: 4

Job Description

We are seeking experienced IC Packaging Design Engineers with strong expertise in package substrate design and advanced package layout. The ideal candidate should have hands-on experience with Siemens (Mentor) Xpedition (XPD) or Cadence Allegro Advanced Package Designer (APD/SiP) and a solid understanding of IC package design methodologies.

Required Qualifications
  • Bachelor's or Master's degree in Electrical/Electronics Engineering.
  • Senior Level: 10+ years of IC Packaging / Package Design experience.
  • Mid Level: 4-6+ years (MS) or 6+ years (BS) of relevant experience.
  • Strong hands-on experience with Siemens (Mentor) Xpedition (XPD) (Preferred).
  • Experience with Cadence Allegro APD / SiP is also acceptable.
  • Strong understanding of package substrate design and layout.

Required Skills
  • IC Package Physical Design & Layout
  • Substrate Design & Layout
  • SI/PI Aware Design Implementation
  • Design Rule Compliance (DRC)
  • Design for Performance, Manufacturability, Yield & Reliability
  • Package Floor Planning
  • High-Speed Signal Routing
  • Package Stack-up Design
  • Cross-functional collaboration with SI/PI, Mechanical, and Manufacturing teams

Preferred Skills
  • FCBGA, FCCSP, SiP, or Advanced Packaging experience
  • High-speed interfaces such as PCIe, DDR, HBM, or SerDes
  • Strong problem-solving and debugging skills

Please send your updated resume to:

C2C & W2 candidates are welcome.

Apply