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Ic Package Design Engineer Jobs (NOW HIRING)

Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field * 5+ years of experience in substrate IC package design for high-performance processors or ...

Nokia Bell Labs is seeking a High-Speed Package Design Engineer to drive the design, simulation, and validation of advanced IC packages for high-performance RF, photonics, and mixed-signal systems.

Work with package leads and senior engineers on complex package programs and progressively take ownership of larger design scopes. Minimum Qualifications Bachelor's with 5+ years of experience or ...

IC Package Design Engineer

San Jose, CA · On-site

$152K - $219K/yr

... engineering environment. Responsibilities: • Contribute to package design activities including planning, floorplanning, pinout optimization, stack-up definition, and high-speed routing support. • ...

About This Role Lightmatter is looking for a Package Layout Design Engineer to drive the next ... Minimum 3-5 years of experience in IC package layout design. * Proficient with Allegro X APD.

New

Work with IC design, system design, package Signal Integrity (SI)/Power Integrity (PI) & thermal engineering teams to design custom interposer and substrates * Work with SoC design teams to optimize ...

Package Design Engineer

San Jose, CA · On-site

$159K/yr

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs.You will be part ...

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Package Design Engineer

San Jose, CA · On-site

$141K - $226K/yr

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs.You will be part ...

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Package Design Engineer

San Jose, CA · On-site

$141.30 - $226/hr

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

We are seeking a motivated Advanced IC Package Engineer to join our Advanced Package Design team. This role offers hands on experience with real world semiconductor and package design, working ...

New

Package Design Engineer

Austin, TX · On-site

$134K/yr

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs.You will be part ...

Showing results 21-40

Ic Package Design Engineer information

See salary details

$90K

$136.5K

How much do ic package design engineer jobs pay per year?

As of Aug 22, 2026, the average yearly pay for ic package design engineer in the United States is $135,040.00, according to ZipRecruiter salary data. Most workers in this role earn between $136,000.00 and $136,000.00 per year, depending on experience, location, and employer.

What is an IC Package Design Engineer?

An IC Package Design Engineer is responsible for designing and developing semiconductor chip packaging to ensure electrical, thermal, and mechanical performance. They work with cross-functional teams to optimize package layouts, material selection, and manufacturing processes. Their role involves using CAD tools, simulation software, and collaborating with fabrication and assembly teams to meet product requirements.

What are the daily responsibilities of an IC Package Design Engineer?

IC Package Design Engineers typically spend their days designing and simulating semiconductor package layouts, reviewing schematics, and ensuring designs meet electrical and thermal requirements. They collaborate closely with PCB designers, test engineers, and manufacturing teams to optimize the package for performance and ease of assembly. Daily work also involves troubleshooting design issues, interacting with vendors for material selection, and participating in design reviews alongside multidisciplinary teams. The role balances hands-on technical tasks with communication, making cross-team coordination a key part of the job.

What are the key skills and qualifications needed to thrive as an IC Package Design Engineer?

Success as an IC Package Design Engineer requires a strong background in electrical engineering, semiconductor packaging principles, and CAD software proficiency, typically supported by a relevant engineering degree. Familiarity with electronic design automation (EDA) tools such as Cadence or Mentor Graphics, and knowledge of industry standards like JEDEC, are highly valuable. Excellent problem-solving, attention to detail, and effective communication skills help navigate complex design challenges and collaborate with cross-functional teams. These abilities are crucial for ensuring robust package designs that meet performance, cost, and manufacturability requirements in the fast-paced semiconductor industry.

More about Ic Package Design Engineer jobs

What states have the most Ic Package Design Engineer jobs?

States with the most job openings for Ic Package Design Engineer jobs include:

Infographic showing various Ic Package Design Engineer job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 75% Full Time, 10% Part Time, and 14% Contract. Highlights an 79% Physical, 2% Hybrid, and 19% Remote job distribution, with an average salary of $135,040 per year, or $64.9 per hour.

IC Packaging Design Engineer

Comprehensive Resources Inc.

Hillsboro, OR • On-site

$148K/yr

Other

Posted 4 days ago


Job description

Role : IC Packaging Design Engineer
LOC: Chandler, AZ or Hillsboro, OR (ONSITE)
Experience : !0+ years

Skills Required : -
Bachelor s or Master s degree in Electrical /Electronics Engineering
Experience Tier: Senior-level (primary); Mid-level (secondary)
Senior-Level: ~10+ years in IC packaging / package design
Mid-Level: 4-6+ years (MS) or 6+ years (BS) in IC packaging / package design
Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)
Experience :-


Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)
Candidates should have experience in the below domains:
Physical Design & Layout
Substrate design and layout
SI/PI aware design implementation
Design for performance, manufacturability, yield, and reliability
Design rule compliance