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Ic Package Design Engineer Jobs (NOW HIRING)

Micross

Package Design Engineer | Semiconductor

Durham, NC · On-site

$128.20K/yr

Work with IC design, system design, package Signal Integrity (SI)/Power Integrity (PI) & thermal engineering teams to design custom interposer and substrates * Work with SoC design teams to optimize ...

Micross

Package Design Engineer | Semiconductor

Apopka, FL · On-site

$119.20K/yr

Work with IC design, system design, package Signal Integrity (SI)/Power Integrity (PI) & thermal engineering teams to design custom interposer and substrates * Work with SoC design teams to optimize ...

Broadcom, Inc.

Package Design Engineer

San Jose, CA · On-site

$141.30K - $226K/yr

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Broadcom

Package Design Engineer

Fort Collins, CO · On-site

$141.30K - $226K/yr

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Broadcom

Package Design Engineer

Austin, TX · On-site

$141.30K - $226K/yr

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Renesas Electronics

Package Design Engineer

Austin, TX · On-site

$134.80K/yr

... Design Engineer to join our Advanced Silicon Packaging team to design and deliver the next ... Execute package layout design and development for advanced packages, including 2.5D/3D IC, FCBGA ...

Renesas Electronics

Package Design Engineer

Austin, TX · On-site +1

$134.80K/yr

... Design Engineer to join our Advanced Silicon Packaging team to design and deliver the next ... Execute package layout design and development for advanced packages, including 2.5D/3D IC, FCBGA ...

New

Renesas Electronics

Package Design Engineer

Austin, TX · On-site +1

$134.80K/yr

... Design Engineer to join our Advanced Silicon Packaging team to design and deliver the next ... Execute package layout design and development for advanced packages, including 2.5D/3D IC, FCBGA ...

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Ic Package Design Engineer information

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$90K

$136.5K

How much do ic package design engineer jobs pay per year?

As of May 31, 2026, the average yearly pay for ic package design engineer in the United States is $135,040.00, according to ZipRecruiter salary data. Most workers in this role earn between $136,000.00 and $136,000.00 per year, depending on experience, location, and employer.

What is an IC Package Design Engineer job?

An IC Package Design Engineer is responsible for designing and developing semiconductor chip packaging to ensure electrical, thermal, and mechanical performance. They work with cross-functional teams to optimize package layouts, material selection, and manufacturing processes. Their role involves using CAD tools, simulation software, and collaborating with fabrication and assembly teams to meet product requirements.

What are the key skills and qualifications needed to thrive in the Ic Package Design Engineer position, and why are they important?

Success as an IC Package Design Engineer requires a strong background in electrical engineering, semiconductor packaging principles, and CAD software proficiency, typically supported by a relevant engineering degree. Familiarity with electronic design automation (EDA) tools such as Cadence or Mentor Graphics, and knowledge of industry standards like JEDEC, are highly valuable. Excellent problem-solving, attention to detail, and effective communication skills help navigate complex design challenges and collaborate with cross-functional teams. These abilities are crucial for ensuring robust package designs that meet performance, cost, and manufacturability requirements in the fast-paced semiconductor industry.

What are some common daily responsibilities for an IC Package Design Engineer?

IC Package Design Engineers typically spend their days designing and simulating semiconductor package layouts, reviewing schematics, and ensuring designs meet electrical and thermal requirements. They collaborate closely with PCB designers, test engineers, and manufacturing teams to optimize the package for performance and ease of assembly. Daily work also involves troubleshooting design issues, interacting with vendors for material selection, and participating in design reviews alongside multidisciplinary teams. The role balances hands-on technical tasks with communication, making cross-team coordination a key part of the job.
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Ic Package Design Engineer jobs near you
Infographic showing various Ic Package Design Engineer job openings in the United States as of May 2026, with employment types broken down into 91% Full Time, 6% Part Time, and 3% Contract. Highlights an 87% Physical, 2% Hybrid, and 11% Remote job distribution, with an average salary of $135,040 per year, or $64.9 per hour.
Optoelectronic IC Package Design Director

Optoelectronic IC Package Design Director

Ciena Corporation

New Providence, NJ • On-site

$235.60K - $376.40K/yr

Full-time

Medical, Dental, Vision, Retirement, PTO

Posted 16 days ago

Job description

As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We're a technology company that leads with our humanity-driving our business priorities alongside meaningful social, community, and societal impact.
As Optoelectronic IC Package Design Director, you will be an integral part of the xPO engineering team and lead package development for custom in-house photonic, analog, and digital ICs, supporting next generation optical modules.
How You Will Make an Impact:
  • Own and drive advanced package selection, new product BGA configuration, and package structure
  • Own and manage package development schedules
  • Responsible for package layout, SI/PI optimization, design verification and tapeout
  • Interface and coordinate with cross-functional groups on new product package selection, feasibility analysis and design
  • Work cross-functionally, understand trade-offs, constraints, and optimize silicon floor plan, bump and package pin out
  • Simulate and optimize signal and power integrity and RF performance of the package design
  • Interface and work with CMs and vendors for sourcing existing designs and future product development

The Must Haves:
  • BS in Electrical Engineering or Physics (master's or Ph. D degree is a plus)
  • 10+ years hands on experience with IC package design experience

The Nice to Haves:
  • Substrate design experience for RF, digital, high speed and mixed signal designs
  • Thorough understanding of signal and power integrity fundamentals
  • Experience with Advanced Package Designer (APD)+SIP and/or Xpedition Package Designer (XPD) tools (Cadence highly preferred)
  • Fluent in SI/PI and EM simulation tools such as SIWave and HFSS
  • Experience in package design electrical review, SI/PI analysis
  • Experience in package design for manufacturing reviews
  • Experience in thermal and mechanical design is a plus
  • Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers
  • Problem solver with strong engineering fundamentals

Pay Range: The annual salary range for this position is $235,600 - $376,400.
Pay ranges at Ciena are designed to accommodate variations in knowledge, skills, experience, market conditions, and locations, reflecting our diverse products, industries, and lines of business. Please note that the pay range information provided in this posting pertains specifically to the primary location, which is the top location listed in case multiple locations are available.
Non-Sales employees may be eligible for a discretionary incentive bonus, while Sales employees may be eligible for a sales commission. In addition to competitive compensation, Ciena offers a comprehensive benefits package, including medical, dental, and vision plans, participation in 401(K) (USA) & DCPP (Canada) with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays, paid sick leave, and vacation time. We also comply with all applicable laws regarding Paid Family Leave and other leaves of absence.
At Ciena, we are committed to building and fostering an environment in which our employees feel respected, valued, and heard. Ciena values the diversity of its workforce and respects its employees as individuals. We do not tolerate any form of discrimination.
Ciena is an Equal Opportunity Employer, including disability and protected veteran status.
If contacted in relation to a job opportunity, please advise Ciena of any accommodation measures you may require.

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