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Ic Package Design Engineer Jobs in California (NOW HIRING)

IC Package Design Engineer

Los Angeles, CA · On-site

$146K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next ... Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms ...

Description As a Package design engineer, you will lead advanced package architecture, drive next ... Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms ...

Description As a Package design engineer, you will lead advanced package architecture, drive next ... Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms ...

Description As a Package design engineer, you will lead advanced package architecture, drive next ... Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms ...

IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all aspects of substrate layout and package design work. The ideal candidate will have extensive ...

IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all aspects of substrate layout and package design work. The ideal candidate will have extensive ...

IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all aspects of substrate layout and package design work. The ideal candidate will have extensive ...

IC Package Design Engineer

Los Angeles, CA · On-site

$171.60 - $302.20/hr

Description As a Package design engineer, you will lead advanced package architecture, drive ... Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms ...

IC Package Design Engineer

San Francisco, CA · On-site

$122.70 - $214.30/hr

... design engineer, you will lead advanced package architecture, drive next‑generation package ... Package Design Proficiency: Proven experience in IC package physical design using Cadence Allegro ...

New

IC Package Design Engineer

San Jose, CA · On-site

$152.50 - $219.20/hr

Experience in hardware, package, PCB, or high‑speed design engineering. * Experience of high‑speed signaling, power delivery, and system‑level hardware concepts. * Prior experience with ...

New

IC Package Design Engineer

San Jose, CA · On-site

$152K - $219K/yr

... engineering environment. Responsibilities: • Contribute to package design activities including planning, floorplanning, pinout optimization, stack-up definition, and high-speed routing support. • ...

Work with package leads and senior engineers on complex package programs and progressively take ownership of larger design scopes. Minimum Qualifications Bachelor's with 5+ years of experience or ...

Package Design Engineer

San Jose, CA · On-site

$159K/yr

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs.You will be part ...

Package Design Engineer

San Jose, CA · On-site

$141K - $226K/yr

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Package Design Engineer

San Jose, CA · On-site

$141.30 - $226/hr

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Package Design Engineer

San Jose, CA · On-site

$159K/yr

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

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Showing results 1-20

Ic Package Design Engineer information

See California salary details

$88.8K

$134.7K

How much do ic package design engineer jobs pay per year?

As of Aug 20, 2026, the average yearly pay for ic package design engineer in California is $133,271.00, according to ZipRecruiter salary data. Most workers in this role earn between $134,200.00 and $134,200.00 per year, depending on experience, location, and employer.

What is an IC Package Design Engineer?

An IC Package Design Engineer is responsible for designing and developing semiconductor chip packaging to ensure electrical, thermal, and mechanical performance. They work with cross-functional teams to optimize package layouts, material selection, and manufacturing processes. Their role involves using CAD tools, simulation software, and collaborating with fabrication and assembly teams to meet product requirements.

What are the daily responsibilities of an IC Package Design Engineer?

IC Package Design Engineers typically spend their days designing and simulating semiconductor package layouts, reviewing schematics, and ensuring designs meet electrical and thermal requirements. They collaborate closely with PCB designers, test engineers, and manufacturing teams to optimize the package for performance and ease of assembly. Daily work also involves troubleshooting design issues, interacting with vendors for material selection, and participating in design reviews alongside multidisciplinary teams. The role balances hands-on technical tasks with communication, making cross-team coordination a key part of the job.

What are the key skills and qualifications needed to thrive as an IC Package Design Engineer?

Success as an IC Package Design Engineer requires a strong background in electrical engineering, semiconductor packaging principles, and CAD software proficiency, typically supported by a relevant engineering degree. Familiarity with electronic design automation (EDA) tools such as Cadence or Mentor Graphics, and knowledge of industry standards like JEDEC, are highly valuable. Excellent problem-solving, attention to detail, and effective communication skills help navigate complex design challenges and collaborate with cross-functional teams. These abilities are crucial for ensuring robust package designs that meet performance, cost, and manufacturability requirements in the fast-paced semiconductor industry.

Infographic showing various Ic Package Design Engineer job openings in California as of August 2026, with employment types broken down into 75% Full Time, and 25% Contract. Highlights an 100% In-person job distribution, with an average salary of $133,271 per year, or $64.1 per hour.

IC Package Design Engineer

Apple

Los Angeles, CA • On-site

$146K/yr

Full-time

Re-posted 10 days ago


Apple rating

8.0

Company rating: 8.0 out of 10

Based on 677 frontline employees who took The Breakroom Quiz

7th of 30 rated technology retailers


Job description

Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for Apple's internal and custom components across products including iPhone, iPad, Mac, Apple Watch, and Apple TV. We're looking for a Package Design Engineer to drive the physical design and integration of advanced semiconductor packages across SoC, memory, RF, and cellular technologies. You will play a key role in shaping the architecture, scalability, and efficiency of next-generation products while advancing design methodologies through automation and AI.
Description
As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical design from concept through tape-out. You will collaborate closely with cross-functional teams to deliver optimized SI/PI performance across a wide range of silicon technologies You are expected to leverage AI tools to enhance design efficiency, quality and performance.
Minimum Qualifications
Bachelors degree required.
Preferred Qualifications
Package Design Proficiency: Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms, with knowledge of diverse package types (SiP, PoP, wirebond) and verification tools (Calibre, CAM350).
High-Speed & SI/PI Expertise: Strong understanding of high-speed interface layout constraints (DDR, PCIe) and Signal/Power Integrity (SI/PI) analysis, including experience with simulation tools like HFSS or PowerSI and parasitic extraction (RLGC, S-parameters).
Manufacturing & Materials Knowledge: Solid grasp of substrate manufacturing processes, design rules (DRC), design for manufacturability (DFM), and various sophisticated package configurations and assembly technology
Automation & Scripting Skills: Familiarity with a Unix/Linux environment and proficiency in scripting languages such as Python, Perl, or TCL to automate design tasks and improve workflows.

What Apple employees say

Pay

Benefits

Hours and flexibility

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About Apple

Sourced by ZipRecruiter

Imagine what you could do here! At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, intelligent people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same real passion for innovation that goes into our products also applies to our practices strengthening our dedication to leave the world better than we found it.

Industry

Computer and electronic product manufacturing

Company size

10,000+ Employees

Headquarters location

Cupertino, CA, US

Year founded

1976