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Ic Package Design Engineer Jobs in California (NOW HIRING)

IC Package Design Engineer

Los Angeles, CA · On-site

$146K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next ... Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms ...

IC Package Design Engineer

Los Angeles, CA

$122K - $214K/yr

  • Medical

  • Dental

  • Retirement

Description As a Package design engineer, you will lead advanced package architecture, drive next ... Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms ...

IC Package Design Engineer

Los Angeles, CA

$122K - $214K/yr

  • Medical

  • Dental

  • Retirement

Description As a Package design engineer, you will lead advanced package architecture, drive next ... Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms ...

IC Package Engineer

Cupertino, CA

$2.0K/mo

  • Medical

  • Dental

  • Vision

IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all aspects of substrate layout and package design work. The ideal candidate will have extensive ...

IC Package Design Engineer

Los Angeles, CA

$122K - $214K/yr

  • Medical

  • Dental

  • Retirement

Description As a Package design engineer, you will lead advanced package architecture, drive next ... Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms ...

IC Package Engineer

Cupertino, CA · On-site

$2.0K/mo

  • Medical

  • Dental

  • Vision

IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all aspects of substrate layout and package design work. The ideal candidate will have extensive ...

IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all aspects of substrate layout and package design work. The ideal candidate will have extensive ...

IC Package Design Engineer

San Jose, CA · On-site

$152K - $219K/yr

  • Medical

  • Dental

  • Vision

  • Life

  • Retirement

  • PTO

... engineering environment. Responsibilities: • Contribute to package design activities including planning, floorplanning, pinout optimization, stack-up definition, and high-speed routing support. • ...

IC Package Design Engineer

San Jose, CA · On-site

$152K - $219K/yr

  • Medical

  • Dental

  • Vision

  • Life

  • Retirement

  • PTO

Work with package leads and senior engineers on complex package programs and progressively take ownership of larger design scopes. Minimum Qualifications Bachelor's with 5+ years of experience or ...

Package Design Engineer

San Jose, CA

$159K/yr

  • Medical

  • Dental

  • Vision

  • Retirement

  • PTO

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs.You will be part ...

Package Design Engineer

San Jose, CA · On-site

$141K - $226K/yr

  • Medical

  • Dental

  • Vision

  • Retirement

  • PTO

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Package Design Engineer

San Jose, CA

$141K - $226K/yr

  • Medical

  • Dental

  • Vision

  • Retirement

  • PTO

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Package Design Engineer

San Jose, CA · On-site

$159K/yr

  • Medical

  • Dental

  • Vision

  • Retirement

  • PTO

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

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Showing results 1-20

Ic Package Design Engineer information

See California salary details

$88.8K

$134.7K

How much do ic package design engineer jobs pay per year?

As of Aug 16, 2026, the average yearly pay for ic package design engineer in California is $133,271.00, according to ZipRecruiter salary data. Most workers in this role earn between $134,200.00 and $134,200.00 per year, depending on experience, location, and employer.

What is an IC Package Design Engineer?

An IC Package Design Engineer is responsible for designing and developing semiconductor chip packaging to ensure electrical, thermal, and mechanical performance. They work with cross-functional teams to optimize package layouts, material selection, and manufacturing processes. Their role involves using CAD tools, simulation software, and collaborating with fabrication and assembly teams to meet product requirements.

What are the daily responsibilities of an IC Package Design Engineer?

IC Package Design Engineers typically spend their days designing and simulating semiconductor package layouts, reviewing schematics, and ensuring designs meet electrical and thermal requirements. They collaborate closely with PCB designers, test engineers, and manufacturing teams to optimize the package for performance and ease of assembly. Daily work also involves troubleshooting design issues, interacting with vendors for material selection, and participating in design reviews alongside multidisciplinary teams. The role balances hands-on technical tasks with communication, making cross-team coordination a key part of the job.

What are the key skills and qualifications needed to thrive as an IC Package Design Engineer?

Success as an IC Package Design Engineer requires a strong background in electrical engineering, semiconductor packaging principles, and CAD software proficiency, typically supported by a relevant engineering degree. Familiarity with electronic design automation (EDA) tools such as Cadence or Mentor Graphics, and knowledge of industry standards like JEDEC, are highly valuable. Excellent problem-solving, attention to detail, and effective communication skills help navigate complex design challenges and collaborate with cross-functional teams. These abilities are crucial for ensuring robust package designs that meet performance, cost, and manufacturability requirements in the fast-paced semiconductor industry.

How much do IC Package Design Engineers make?

IC Package Design Engineers typically earn between $80,000 and $130,000 annually, depending on experience, location, and industry. Senior engineers with specialized skills or certifications can earn higher salaries, especially in high-tech regions or companies with advanced manufacturing facilities.

What does an IC package design engineer do?

An IC package design engineer develops the physical packaging for integrated circuits, ensuring proper electrical connections, thermal management, and mechanical protection. They use CAD tools and work closely with semiconductor designers to optimize package performance and manufacturability throughout the design process.

What job categories do people searching Ic Package Design Engineer jobs in California look for?

The top searched job categories for Ic Package Design Engineer jobs in California are:

Infographic showing various Ic Package Design Engineer job openings in California as of August 2026, with employment types broken down into 75% Full Time, and 25% Contract. Highlights an 100% In-person job distribution, with an average salary of $133,271 per year, or $64.1 per hour.

Senior IC Package Design Engineer [Onste]

SmartIPlace

Santa Clara, CA • On-site

Contractor

Re-posted 12 days ago


Job description

Position: Senior IC Package Design Engineer

Location: Santa Clara, CA (Onsite)

Duration: 6 Months (Ongoing)

Visa: Any (Onsite work required)

Requirements

Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 10-15 years of related professional experience.
Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 5-10 years of experience.

Job Responsibilities

  • Experience with 2.5D package design and development like CoWoS
  • Strong expertise in using IC package layout tools like Cadence APD
  • Understanding IC package design requirements for high-speed interfaces and setup constraints manager
  • Interface with the IC physical design teams for optimizing the die floor plan
  • Experience in interfacing with Substrate suppliers and OSATs
  • Ability to do automation of the layout tasks using scripting
  • Power plane design and translating power supply requirements into design
  • Familiarity with IC packaging technologies, materials, substrate design rules and assembly rules
  • Track record of new product introduction from concept through development and production is a plus
  • Knowledge of the thermal and mechanical analysis of the IC package development is a plus
  • A team player with strong communication, presentation, and documentation skills

Smart-iPlace logo

About Smart-iPlace

Sourced by ZipRecruiter

SMART-iPLACE provides innovative staffing and consulting solutions that help our clients achieve their business objectives. We can understand and support all areas of your IT systems from back-end infrastructure to front-end personal productivity. Our goal is create innovative IT solutions that enable your business to be more agile and competitive.

Industry

It services

Company size

51 - 200 Employees

Headquarters location

Irving, TX, US

Year founded

2021

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