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Ic Package Design Engineer Jobs (NOW HIRING)

Broadcom

Package Design Engineer

Austin, TX · On-site

$134K/yr

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs.You will be part ...

Broadcom, Inc.

Package Design Engineer

San Jose, CA · On-site

$159K/yr

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Gsme

$110 - $170/hr

We are seeking a motivated Advanced IC Package Engineer to join our Advanced Package Design team. This role offers hands on experience with real world semiconductor and package design, working ...

New

Nutanix

Package Design Engineer - Staff

San Diego, CA · On-site

$154 - $252.80/hr

As the IC Package Design Engineer, you demonstrate fundamental knowledge or proven experience in the following:Proficient in Cadence APD & SiP and/or Siemens Xpedition Package Designer (xPD)

New

Lightmatter

Package Layout Engineer

Mountain View, CA · On-site

$157K - $176K/yr

About This Role Lightmatter is looking for a Package Layout Design Engineer to drive the next ... Minimum 3-5 years of experience in IC package layout design. * Proficient with Allegro X APD.

New

Analog Devices

Staff Semi Packaging Engineer

San Jose, CA · On-site

$130 - $188/hr

IC package design: design and optimize IC packages for a wide range of ADI products, using common ... Master's degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, or ...

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Ic Package Design Engineer information

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$90K

$136.5K

How much do ic package design engineer jobs pay per year?

As of Aug 22, 2026, the average yearly pay for ic package design engineer in the United States is $135,040.00, according to ZipRecruiter salary data. Most workers in this role earn between $136,000.00 and $136,000.00 per year, depending on experience, location, and employer.

What is an IC Package Design Engineer?

An IC Package Design Engineer is responsible for designing and developing semiconductor chip packaging to ensure electrical, thermal, and mechanical performance. They work with cross-functional teams to optimize package layouts, material selection, and manufacturing processes. Their role involves using CAD tools, simulation software, and collaborating with fabrication and assembly teams to meet product requirements.

What are the daily responsibilities of an IC Package Design Engineer?

IC Package Design Engineers typically spend their days designing and simulating semiconductor package layouts, reviewing schematics, and ensuring designs meet electrical and thermal requirements. They collaborate closely with PCB designers, test engineers, and manufacturing teams to optimize the package for performance and ease of assembly. Daily work also involves troubleshooting design issues, interacting with vendors for material selection, and participating in design reviews alongside multidisciplinary teams. The role balances hands-on technical tasks with communication, making cross-team coordination a key part of the job.

What are the key skills and qualifications needed to thrive as an IC Package Design Engineer?

Success as an IC Package Design Engineer requires a strong background in electrical engineering, semiconductor packaging principles, and CAD software proficiency, typically supported by a relevant engineering degree. Familiarity with electronic design automation (EDA) tools such as Cadence or Mentor Graphics, and knowledge of industry standards like JEDEC, are highly valuable. Excellent problem-solving, attention to detail, and effective communication skills help navigate complex design challenges and collaborate with cross-functional teams. These abilities are crucial for ensuring robust package designs that meet performance, cost, and manufacturability requirements in the fast-paced semiconductor industry.

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Ic Package Design Engineer jobs near you
Infographic showing various Ic Package Design Engineer job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 75% Full Time, 10% Part Time, and 14% Contract. Highlights an 79% Physical, 2% Hybrid, and 19% Remote job distribution, with an average salary of $135,040 per year, or $64.9 per hour.

Package Design Engineer

Broadcom

Austin, TX • On-site

$134K/yr

Full-time

Medical, Dental, Vision, Retirement, PTO

Re-posted 14 days ago

Broadcom rating

8.7

Company rating: 8.7 out of 10

Based on 23 frontline employees who took The Breakroom Quiz

19th of 159 rated electronics manufacturers

Job description

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Job Description:

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs.You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations.These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team.

RESPONSIBILITIES:

  • Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.

  • Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.

  • Schedule, prioritize, & track your work across 2+ projects simultaneously

  • General flip-chip BGA package design & engineering

  • Project management and customer interface for your design projects

  • Contribute to efficiency improvements for the design team, through process development/improvement, automation, documentation, etc.

  • Physical design (layout) is a foundational responsibility in this role


EDUCATION/EXPERIENCE & REQUIREMENTS:

  • BSEE or similar field and 8+ years' experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or similar field and 6+ years' work experience

  • Knowledge of package-level signal integrity and power integrity, to apply to package designs

  • Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.

  • Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers

  • Self-management and organization skills

  • Preferred candidates will also have1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest

OTHER REQUIREMENTS

  • This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position.


Compensation and Benefits


The annual base salary range for this position is USD 121,900.00 To USD 195,000.00

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.


Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.


Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.


If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

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