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Ic Package Design Engineer Jobs (NOW HIRING)

Gsme

$110 - $170/hr

We are seeking a motivated Advanced IC Package Engineer to join our Advanced Package Design team. This role offers hands on experience with real world semiconductor and package design, working ...

New

Nutanix

Package Design Engineer - Staff

San Diego, CA · On-site

$154 - $252.80/hr

As the IC Package Design Engineer, you demonstrate fundamental knowledge or proven experience in the following:Proficient in Cadence APD & SiP and/or Siemens Xpedition Package Designer (xPD)

New

Lightmatter

Package Layout Engineer

Mountain View, CA · On-site

$157K - $176K/yr

About This Role Lightmatter is looking for a Package Layout Design Engineer to drive the next ... Minimum 3-5 years of experience in IC package layout design. * Proficient with Allegro X APD.

Analog Devices

Staff Semi Packaging Engineer

San Jose, CA · On-site

$130 - $188/hr

IC package design: design and optimize IC packages for a wide range of ADI products, using common ... Master's degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, or ...

Analog Devices

Staff Semi Packaging Engineer

San Jose, CA · On-site

$130K - $188K/yr

IC package design: design and optimize IC packages for a wide range of ADI products, using common ... Master's degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, or ...

Analogdevices

Staff Semi Packaging Engineer

San Jose, CA · On-site

$130K - $188K/yr

IC package design: design and optimize IC packages for a wide range of ADI products, using common ... Master's degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, or ...

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IC Package Design Engineer information

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$90K

$136.5K

How much do ic package design engineer jobs pay per year?

As of Aug 23, 2026, the average yearly pay for ic package design engineer in the United States is $135,040.00, according to ZipRecruiter salary data. Most workers in this role earn between $136,000.00 and $136,000.00 per year, depending on experience, location, and employer.

What is an IC Package Design Engineer?

An IC Package Design Engineer is responsible for designing and developing semiconductor chip packaging to ensure electrical, thermal, and mechanical performance. They work with cross-functional teams to optimize package layouts, material selection, and manufacturing processes. Their role involves using CAD tools, simulation software, and collaborating with fabrication and assembly teams to meet product requirements.

What are the daily responsibilities of an IC Package Design Engineer?

IC Package Design Engineers typically spend their days designing and simulating semiconductor package layouts, reviewing schematics, and ensuring designs meet electrical and thermal requirements. They collaborate closely with PCB designers, test engineers, and manufacturing teams to optimize the package for performance and ease of assembly. Daily work also involves troubleshooting design issues, interacting with vendors for material selection, and participating in design reviews alongside multidisciplinary teams. The role balances hands-on technical tasks with communication, making cross-team coordination a key part of the job.

What are the key skills and qualifications needed to thrive as an IC Package Design Engineer?

Success as an IC Package Design Engineer requires a strong background in electrical engineering, semiconductor packaging principles, and CAD software proficiency, typically supported by a relevant engineering degree. Familiarity with electronic design automation (EDA) tools such as Cadence or Mentor Graphics, and knowledge of industry standards like JEDEC, are highly valuable. Excellent problem-solving, attention to detail, and effective communication skills help navigate complex design challenges and collaborate with cross-functional teams. These abilities are crucial for ensuring robust package designs that meet performance, cost, and manufacturability requirements in the fast-paced semiconductor industry.

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What states have the most Ic Package Design Engineer jobs?

States with the most job openings for Ic Package Design Engineer jobs include:

What job categories do people searching Ic Package Design Engineer jobs look for?

The top searched job categories for Ic Package Design Engineer jobs are:

IC Package Design Engineer jobs near you
Infographic showing various Ic Package Design Engineer job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 75% Full Time, 10% Part Time, and 14% Contract. Highlights an 79% Physical, 2% Hybrid, and 19% Remote job distribution, with an average salary of $135,040 per year, or $64.9 per hour.

Package Design Engineer - Staff

Qualcomm

San Diego, CA • On-site

Full-time

Re-posted 7 days ago

Qualcomm rating

8.8

Company rating: 8.8 out of 10

Based on 11 frontline employees who took The Breakroom Quiz

49th of 246 rated software companies

Job description

Company:
Qualcomm Technologies, Inc.
Job Area:
Engineering Group, Engineering Group > Packaging Engineering
General Summary:
Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work!
Role and Responsibilities:
  • Own and drive advanced package selection, new generation product package structure, and configuration optimization.
  • Responsible for Package/SIP physical design and layout, optimization, DV, and tape out.
  • Work with multi-functional teams to achieve optimized mechanical, electrical, and thermal performance for various types of chips.
  • Implement the physical design of packages and modules for SoC.
  • Interface and coordinate with multi-functional groups throughout Qualcomm on new product package/SiP feasibility analysis, design, and selection.
  • Define and develop design verification and automation strategy to strengthen and streamline package design and release flows.
  • Work multi-functionally to optimize package pin out.
  • Ensure package design is optimized with SI/PI requirements.
  • Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.
  • Explore, evaluate, and develop new CAD tools, design, and verification flow.
  • Partner with BU PD team to optimize chip Floorplan and bump placement and optimize the package size.

Skills:
As the IC Package Design Engineer, you demonstrate fundamental knowledge or proven experience in the following:
  • Proficient in Cadence APD & SiP and/or Siemens Xpedition Package Designer (xPD).
  • Familiar in using Constraint Manager in Package design tool for setting up DFM rules and electrical rules
  • Experience in using in-line DRC checking, DFM verification, Electrical Rule Checking (ERC) preferred.
  • Basic knowledge in signal-integrity for high-speed IO interfaces, transmission line & electromagnetic field theory.
  • Knowledge of IC packaging structures, chip-package, and package-board interaction.
  • Basic knowledge of electronic packaging process and typical failure modes preferred.

Preferred Qualifications:
  • Master's degree in electrical engineering, mechanical engineering, material science, or related fields with 5+ years of experience.
  • Proven fundamentals in electrical, material, thermal, or mechanical engineering fields.
  • Familiarity with various sophisticated package configurations and assembly/substrate technology (Flip chip BGA, 2.5D/3D Interposer, etc.).
  • Experience in package design and proficiency in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP).
  • Basic understanding of some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters, and RLGC model.
  • Basic knowledge of substrate manufacturing process, structure, design rules, and material properties.
  • Proven understanding of high-speed interfaces, including DDR, PCIe, UCIE, etc.
  • Experience with Calibre tool and package design reviews.
  • Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs).
  • Solid understanding of Design Rules Check and Design for Manufacturing.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range and Other Compensation & Benefits:
$154,000.00 - $231,000.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.

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About Qualcomm

Sourced by ZipRecruiter

Qualcomm is enabling a world where everyone and everything can be intelligently connected. You interact with products and technologies made possible by Qualcomm every day, including 5G-enabled smartphones that double as pro-level cameras and gaming devices, smarter vehicles and cities, and the technology behind the smart, connected factories that manufactured your latest purchase. Our powerful connectivity solutions keep you connected—even in remote areas. Qualcomm 5G and AI innovations are the power behind the connected intelligent edge. You’ll find our technologies behind and inside the innovations that deliver significant value across multiple industries and to billions of people every day.

Industry

Technology, communication and media

Company size

10,000+ Employees

Headquarters location

San Diego, CA, US

Year founded

1985

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