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Full Time Mems Design Engineer Jobs (NOW HIRING)

RLA Engineering LLC

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MEMS Process Engineer

Corvallis, OR · On-site

Use of Quality Systems, Statistical Process Control, Design of Experiments, and basic statistical ... · Worked on MEMS products · Collaboration with Mechanical Tooling and Process Engineers on ...

Analogdevices

Mechanical Design Engineer

Chelmsford, MA · Hybrid

$79K - $107K/yr

Mechanical Design Engineer Aerospace and Defense ADI's Aerospace and Defense (ADEF) business is ... Data-Converters, Radio Frequency (RF), and Micro-ElectroMechanical Systems (MEMS). Our diverse ...

SiTime Corporation

Sr. MEMS NPI Engineer

Santa Clara, CA · On-site

$138K - $190K/yr

MEMS-based Precision Timing delivers greater accuracy, smaller size and resilience. Today, MEMS ... You will design and analyze engineering experiments, provide data‑driven insights to guide ...

Analog Devices

Mechanical Design Engineer

Chelmsford, MA · On-site

$79K - $107K/yr

Mechanical Design Engineer Aerospace and Defense ADI's Aerospace and Defense (ADEF) business is ... Data-Converters, Radio Frequency (RF), and Micro-ElectroMechanical Systems (MEMS). Our diverse ...

SiTime Corporation

Principal Engineer, CAD

Santa Clara, CA · On-site

$164K - $226K/yr

MEMS-based Precision Timing delivers greater accuracy, smaller size and resilience. Today, MEMS ... Job Summary The Principal Engineer, CAD will provide CAD Software support for Digital, Analog and ...

W3Global Inc.

Test Design Engineer position

Hutto, TX

$120K - $150K/yr

Hutto, TX Job Type: Full-time About the Company: A growing leader in the semiconductor test ... edge MEMS probe technology. Join our dynamic and growing team as we continue to address the ...

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As of Jun 7, 2026, the average yearly pay for full time mems design engineer in the United States is $111,500.00, according to ZipRecruiter salary data. Most workers in this role earn between $84,000.00 and $139,000.00 per year, depending on experience, location, and employer.
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MEMS Process Engineer

MEMS Process Engineer

RLA Engineering LLC

Corvallis, OR • On-site

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

Posted 10 days ago

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Job description

Position Summary

This position is responsible for supporting various wafer bonding processes (microbond WC) for the high-volume fabrication of MEMS (silicon wafer). The candidate will use their understanding of fabrication processes and product development methodologies to achieve the yield goals of assigned toolset/process step(s). The wafer fab process engineer will collaborate with product R&D teams to make decisions on process quality based on data and statistical analysis.

Duties and Responsibilities

  • Develop fundamental understanding of assigned fabrication processes and product development methodologies against target yields
  • Determine wafer surface preparation and pre-bond cleaning requirements (plasma, wet cleans, dehydration bakes) to achieve high bond strength and low defectivity
  • Confirm bond alignment, bond tool operation, and post-bond thermal processing (bakes/cures) to ensure mechanical integrity and yield
  • Collaborate with:

· Other process and tooling engineers to execute process characterization, optimization, and margin studies including SPC, DOE, yield analysis, and defect reduction

·Equipment engineering, integration, and quality teams to drive process stability and continuous improvement

  • Contribute to FA by troubleshooting bond-related excursions such as delamination, voiding, particle-driven defects, and thickness non-uniformity
  • Support NPI, process transfer, and documentation (work instructions, process flows, FMEA, and control plans)
  • Occasionally work 40+ hours in a week to meet certain team milestones
  • Perform other duties as needed

Education and Credential Requirements

  • Bachelor’s degree in Mechanical Engineering, Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related field
  • Due to project scope - US Citizenship is a requirement to be eligible for this role. Eligible to work in the US without RLA sponsorship for employment visa status

Experience Requirements

  • 3-5 years of experience in a wafer bonding process engineer role
  • Wafer bonding processes supporting volume manufacturing and R&D environments
  • Wafer-to-wafer and wafer-to-carrier bonding (e.g., direct bond, adhesive bond, oxide bond, plasma/anodic bond) used in MEMS and advanced device integration
  • Familiar with IR inspection, metrology, and cross-section analysis to evaluate bond voids, alignment accuracy, and interface quality
  • Use of Quality Systems, Statistical Process Control, Design of Experiments, and basic statistical data analysis on tooling design, process development, and improvements
  • Preferred experience:

· Worked on MEMS products

· Collaboration with Mechanical Tooling and Process Engineers on designing custom jigs/fixtures for wafer handling

Skills Requirements

  • Ability to read, write, and speak English proficiently
  • High proficiency using productivity software such as M365 (Word, Outlook, Excel, PowerPoint, Visio, Teams and SharePoint)
  • Ability to use agile/scrum project/program management principles and methodologies to consistently meet task deadlines, triage changing priorities, and track issues to resolution
  • Ability to collaborate across diverse teams with a customer service mindset

Work Environment

  • The position typically operates in a standard office environment and/or from employee’s home
  • Be able to lift and/or move up to 25 pounds

Company Description

Founded in 2010 and based in Vancouver, WA, RLA Engineering is a premier engineering design firm. We partner with clients from start-ups to industry leaders across the U.S. to help bring great products to life. From concept to prototype, we provide test & measurement and product design solutions powered by deep technical expertise.