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Extract Labs Jobs (NOW HIRING)

Python * ETL * Data Transformation * Data Integration Responsibilities: * Implement solutions using ... Cloud BC Labs Inc is a digital transformation organization aimed at creating seamless solutions for ...

Manufacturing Lab Technician

Mount Joy, PA

$18.50 - $24.75/hr

Responsible for the preparation of Cresco Labs extraction, facilitating the processing of product in accordance with the commonwealth and standards set by Cresco Labs * Ensures consistency and ...

Junior Cyber Investigator

Washington, DC · On-site

$80K - $105K/yr

About 10a Labs: 10a Labs is the safety and threat-intelligence layer trusted by frontier AI labs ... data extraction, ransomware, local and remote exploits, or offensive security operations

AI Software/ Data Engineer

Cincinnati, OH · On-site

$111K - $134K/yr

Vurvey Labs is an applied AI company developing models and platforms that enhance human ... Design and implement efficient data ingestion and processing pipelines (ETL/ELT) that feed our AI ...

About 10a Labs: 10a Labs is the safety and threat-intelligence layer trusted by frontier AI labs ... Familiarity with AI abuse including jailbreaking, system prompt extraction, indirect prompt ...

Senior Cyber Investigator

Washington, DC · On-site

$114K - $140K/yr

About 10a Labs: 10a Labs is the safety and threat-intelligence layer trusted by frontier AI labs ... Deep subject-matter expertise in one or more of the following: scaled data extraction, ransomware ...

Lab Analyst I

Portland, ME · On-site

$50K - $60K/yr

Nova Analytic Labs is seeking a highly motivated and qualified scientist to join our cannabis ... Perform extractions and prepare samples for analysis on LC/MS, GC/MS and ICP/MS * Responsible for ...

About 10a Labs: 10a Labs is the safety and threat-intelligence layer trusted by frontier AI labs ... Deep subject-matter expertise in one or more of the following: scaled data extraction, ransomware ...

Catalyst Labs is a leading talent agency specializing in Applied AI, Machine Learning, and Data ... extract business-critical insights from previously unstructured voice data. • Build agents ...

Catalyst Labs is a leading talent agency specializing in Applied AI, Machine Learning, and Data ... extract business-critical insights from previously unstructured voice data. • Build agents ...

Showing results 21-40

Extract LABS information

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$40.5K

$103.6K

$133.5K

How much do extract labs jobs pay per year?

As of Aug 21, 2026, the average yearly pay for extract labs in the United States is $103,613.00, according to ZipRecruiter salary data. Most workers in this role earn between $92,500.00 and $117,500.00 per year, depending on experience, location, and employer.

What is Extract Labs?

Extract Labs is a company that specializes in the production and sale of hemp-derived CBD products. They are known for offering a wide range of items, including tinctures, capsules, topicals, and concentrates, all made from American-grown hemp. The company emphasizes quality, transparency, and third-party lab testing to ensure product safety and efficacy. Extract Labs also provides detailed lab results for each product and focuses on making CBD accessible for wellness purposes.

What are the typical responsibilities for a lab technician at an extraction lab like Extract Labs?

Lab technicians at extraction labs such as Extract Labs are generally responsible for operating extraction equipment, preparing plant materials, monitoring extraction processes, and ensuring strict adherence to safety protocols. They often conduct quality control tests, document results, and calibrate lab instruments. Collaboration with quality assurance and production teams is common to maintain product consistency and compliance with industry regulations. Attention to detail and the ability to follow standard operating procedures are essential for success in this role.

What are the key skills and qualifications needed to thrive as a laboratory technician at an extraction lab, and why are they important?

To thrive as a Laboratory Technician at an extraction lab, you need a solid background in chemistry or biology, attention to detail, and experience with lab protocols, typically supported by a relevant degree or certification. Proficiency in operating extraction equipment, chromatography systems, and data analysis software is often required. Strong organizational skills, problem-solving ability, and effective teamwork are crucial soft skills for this position. These skills and qualities are important to ensure safe, accurate, and efficient extraction processes that meet regulatory standards and product quality requirements.

What is the difference between Extract Labs vs Extraction Technician?

AspectExtract LabsExtraction Technician
Required CredentialsCBD/Hemp extraction certifications, safety trainingExtraction-specific training, safety protocols
Work EnvironmentLaboratory, manufacturing facilityLaboratory, processing plant
Industry UsageCBD, hemp, cannabis industryCannabis, hemp processing
Common Search IntentCompany overview, job roles at Extract LabsExtraction technician jobs, roles at Extract Labs

Extract Labs is a company specializing in CBD and hemp extraction, often hiring Extraction Technicians to operate extraction equipment and ensure product quality. Extraction Technicians are roles within companies like Extract Labs, focusing on the hands-on extraction process. While both roles require safety training and knowledge of extraction methods, Extract Labs is the employer, and Extraction Technician is the job title. Understanding this distinction helps job seekers find relevant opportunities within the industry.

More about Extract LABS jobs

What cities are hiring for Extract Labs jobs?

Cities with the most Extract Labs job openings:

What are the most commonly searched types of Extract Labs jobs?

The most popular types of Extract Labs jobs are:

What states have the most Extract Labs jobs?

States with the most job openings for Extract Labs jobs include:

Infographic showing various Extract Labs job openings in the United States as of August 2026, with employment types broken down into 1% Locum Tenens, 2% As Needed, 81% Full Time, 14% Part Time, and 2% Contract. Highlights an 92% Physical, 1% Hybrid, and 7% Remote job distribution, with an average salary of $103,613 per year, or $49.8 per hour.

Principal Package Signal & Power Integrity

Astera Labs

San Jose, CA • On-site

$195K/yr

Full-time

Re-posted 20 days ago


Job description

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs' Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company's custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com.
Job Description:
As a Principal Package Signal & Power Integrity Engineer at Astera Labs, you will serve as a senior technical leader responsible for architecting, optimizing, and signing off package SIPI solutions for next-generation connectivity products. You will drive package electrical architecture across high-performance IC packaging platforms, including FCBGA, coreless substrates, chiplet-based packages, 2.5D/3D integration, silicon interposers, bridge-based interconnect, and heterogeneous multi-die systems.
In this role, you will lead SIPI strategy and execution for products supporting PCIe, CXL, Ethernet, 200G/400G+ SerDes, and die-to-die interconnect. You will partner closely with silicon architecture, SerDes/IP teams, package design, PCB design, hardware validation, manufacturing, substrate vendors, and OSAT partners to optimize signal integrity, power delivery, substrate/interposer routing, bump planning, and system-level electrical performance while balancing cost, manufacturability, reliability, yield, and schedule.
You will also drive SIPI methodology, modeling standards, simulation-to-measurement correlation, and chip-package-board co-design frameworks to enable scalable execution across multiple product lines.
Key Responsibilities
  • Define package SIPI architecture and design strategy for high-performance connectivity products, including PCIe 5.0/6.0/7.0, CXL, Ethernet, 200G/400G+ SerDes, and die-to-die interconnect.
  • Perform package and system-level SI and PI simulations using industry-standard simulation software such as HFSS, SIwave, and Keysight ADS to develop, optimize, and sign off package electrical models, validate package architecture and designs, and ensure robust signal and power integrity across chip-package-board systems.
  • Lead cross-functional execution across silicon team, package design, marketing and APPs, PCB board team, validation team, package manufacturing, and external substrate/OSAT partners, managing technical tradeoffs among SIPI performance, cost, DFM, yield, etc., and deliver packaging solutions on schedule.
  • Drive simulation-to-measurement correlation strategy, ensuring strong alignment between EM extraction, system-level models, and lab validation (VNA, TDR, high-speed oscilloscope), continuously improving model accuracy, simulation efficiency, and SIPI signoff criteria.
  • Own SIPI simulation and signoff for advanced packaging platforms, including chiplet-based packages, 2.5D/3D integration, silicon interposers, and bridge-based interconnect, by leading simulations for D2D interconnect (e.g., UCIe), multi-die PDN, micro-bump modeling, TSV/interposer modeling, and multi-die CPM co-simulation.
  • Define substrate, interposer, and bridge routing guidelines for high-speed SerDes and D2D interfaces, including impedance targets, differential-pair geometry, via/transition optimization, return-current management, shielding, skew control, and crosstalk isolation.
  • Establish SIPI modeling standards, design rules, review checklists, automation flows, and signoff methodologies to improve execution efficiency, while mentoring engineers across the organization.

Required qualifications:
  • 10+ years of experience in signal integrity, power integrity, package electrical design, or chip-package-board co-design for high-performance semiconductor products.
  • Deep expertise in package SIPI modeling, analysis, optimization, and signoff across the chip-package-board system, for high-speed SerDes, PCIe, CXL, Ethernet, etc.
  • Strong experience with PCIe 5.0/6.0, PAM4 SerDes channel design, high-speed S-parameter extraction, package model development, eye-diagram analysis, return/insertion-loss optimization, and crosstalk analysis.
  • Proven track record delivering high-performance packages using FCBGA, FCCSP, coreless substrates, advanced organic substrates, chiplet-based packages, 2.5D integration, silicon interposers, or heterogeneous integration platforms.
  • Hands-on expertise with EM extraction and SIPI simulation tools such as ANSYS HFSS, SIwave, Q3D, 3D Layout, Keysight ADS, Cadence Sigrity, or equivalent tools.
  • Expert-level knowledge of PDN design, including DC IR drop, AC impedance, target impedance, loop inductance, decoupling optimization, transient response, noise coupling, and chip-package-model methodology.
  • Demonstrated ability to correlate simulation to lab measurement (VNA, TDR, high-speed oscilloscope).
  • Strong understanding of tradeoffs between SIPI performance, cost, reliability, and manufacturability.
  • Experience leading vendor engagements and managing technical execution through production ramps.

Preferred Qualifications:
  • Experience influencing silicon floor planning, bump map definition, SerDes and power-grid planning, package escape strategy, and PCB breakout from a SIPI perspective.
  • Experience with automation and scripting for SIPI modeling flow.
  • Exposure to Allegro Package Designer (APD) for hands-on substrate editing.
  • Knowledge on traditional FCBGA type package and advanced package (chiplet/2.5D/3D) manufacturing and assembly process flows
  • Experience with CPO and NPO optical package SIPI design, including high-speed channel modeling between EIC/PIC/optical engine, PDN design, crosstalk/noise analysis, and chip-package-board co-design for optical connectivity applications.

The base salary range is $203,000 USD - $230,000 USD. Your base salary will be determined based on location, experience, and employees' pay in similar positions.
We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.