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Electronic Packaging Engineer Jobs (NOW HIRING)

Oclaro

Optical-Electronic Packaging Engineer

San Jose, CA · On-site

$130K - $186K/yr

Engineers in this role will define and deliver mechanical package solutions from early concept and ... Prior experience developing optoelectronic or high-speed electronic products for data center, AI ...

amphenol

Packaging Engineer

Allen, TX

... electronic components, cable assemblies, or mechanical products. • U.S. Citizen or permanent resident to satisfy AFSI ITAR requirements Work Environment: Fastpaced manufacturing floor with ESD ...

Apple

Process Engineer

San Francisco, CA · On-site

Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. In this role, you will own the ...

Collabera

Packaging Engineer

Decatur, IL

... 3D electronic drafting experience Responsibilities: This position designs and develops packaging ... The packaging engineer develops the packaging plan and works with key groups to ensure material is ...

Amphenol

Packaging Engineer

Allen, TX · On-site

$70K - $85K/yr

... electronic components, cable assemblies, or mechanical products. • U.S. Citizen or permanent resident to satisfy AFSI ITAR requirements Work Environment: Fast-paced manufacturing floor with ESD ...

Texas Instruments

Packaging Engineer

Dallas, TX · On-site

Track record of presenting at international conferences or symposiums related to power electronics, semiconductor packaging, or high-voltage technologies About Us Why TI? * Engineer your future. We ...

Texas Instruments

Packaging Engineer

Dallas, TX

As a member of our Packaging team, you'll have the chance to interact with many product groups and ... Come collaborate with some of the smartest people in the world to shape the future of electronics ...

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Electronic Packaging Engineer information

See salary details

$41K

$88.9K

$137.5K

How much do electronic packaging engineer jobs pay per year?

As of Jun 13, 2026, the average yearly pay for electronic packaging engineer in the United States is $88,896.00, according to ZipRecruiter salary data. Most workers in this role earn between $59,500.00 and $109,500.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as an Electronic Packaging Engineer, and why are they important?

To thrive as an Electronic Packaging Engineer, you need a solid background in mechanical or electrical engineering, materials science, and thermal management, often supported by a bachelor's degree or higher in a related field. Familiarity with CAD software (such as AutoCAD or SolidWorks), simulation tools, and industry standards like IPC is typically required. Strong problem-solving abilities, teamwork, and effective communication set top performers apart in this role. These skills and qualities are critical to designing reliable, manufacturable electronic products that meet performance and regulatory requirements.

What is the difference between Electronic Packaging Engineer vs PCB Design Engineer?

AspectElectronic Packaging EngineerPCB Design Engineer
CredentialsBachelor's or Master's in Electrical Engineering, Mechanical Engineering, or related fields; certifications like IPC Designer CertificationBachelor's in Electrical Engineering, Computer Engineering, or related; certifications like IPC Designer Certification
Work EnvironmentDesigning and testing physical enclosures, thermal management, and assembly processes in labs or manufacturing settingsCreating PCB layouts, schematic design, and signal integrity analysis primarily in office or design labs
Industry UsageUsed in electronics manufacturing, consumer electronics, aerospace, and automotive sectorsPrimarily in electronics manufacturing, consumer electronics, and embedded systems industries

Electronic Packaging Engineers focus on designing the physical and thermal aspects of electronic components, ensuring durability and manufacturability. PCB Design Engineers concentrate on creating circuit layouts and schematics for printed circuit boards. While both roles require electrical engineering knowledge and often overlap in the electronics industry, their core responsibilities and work environments differ significantly.

What are the most common challenges faced by Electronic Packaging Engineers when collaborating with multidisciplinary teams?

Electronic Packaging Engineers often work closely with electrical, mechanical, and thermal engineers to ensure that electronic components are both functional and manufacturable. One common challenge is balancing the physical constraints of the package with thermal management and signal integrity needs, which can require significant compromise and creative problem-solving. Effective communication is essential to align on design priorities and quickly resolve conflicts that may arise from differing technical perspectives. Building strong interdisciplinary relationships and staying updated on industry standards can help facilitate smoother collaborations.

What does an Electronic Packaging Engineer do?

An Electronic Packaging Engineer is responsible for designing and developing the physical enclosures, supports, and cooling systems that protect and integrate electronic components in devices and systems. They ensure that electronic assemblies are mechanically robust, thermally managed, and compliant with industry standards. Their work often involves selecting materials, creating layouts, and collaborating with electrical and mechanical engineers to ensure reliability and manufacturability. This role is crucial in industries such as consumer electronics, aerospace, automotive, and telecommunications.
More about Electronic Packaging Engineer jobs
What states have the most Electronic Packaging Engineer jobs? States with the most job openings for Electronic Packaging Engineer jobs include:
What job categories do people searching Electronic Packaging Engineer jobs look for? The top searched job categories for Electronic Packaging Engineer jobs are:
Electronic Packaging Engineer jobs near you
Semiconductor Packaging Engineer

Semiconductor Packaging Engineer

Sigma Design

Redmond, WA • On-site

$115K - $145K/yr

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

Posted 26 days ago

Job description

Semiconductor Packaging Engineer

Sigma Design is a product development, engineering, and manufacturing firm. Based out of the Pacific Northwest, we offer innovative concept through production services to diverse clients around the globe. Sigma Design believes in hiring, developing, and recognizing the best. We offer competitive compensation, a 401(k) with up to 4% company match, quarterly bonus program, 15-days of accrued PTO and 9 company paid holidays. In addition, Sigma Design has multiple options for medical insurance and dental insurance. We also offer voluntary benefits: vision, long-term disability, and life insurance. 
Position Details:
  • This position will be In-Office
  • $115,000 - $140,000 annually
  • This is a contract position with an expected duration of 12 months and the opportunity to be extended. 

Primary Function:
The Semiconductor Packaging Engineer is responsible for developing, executing, and optimizing semiconductor and advanced packaging assembly and integration processes. This role supports the design, fabrication, and validation of advanced electronic packaging solutions for heterogeneous, flexible, and stretchable electronic systems, while collaborating across research, hardware, and manufacturing teams to improve device performance, reliability, and scalability.
Essential Job Functions - Responsibilities:
  • Lead assembly and integration engineering efforts with emphasis on Surface Mount Technology (SMT), Die Bond/Wire Bond processes, and support activities related to molding, laser fabrication, panel or wafer lamination, and component thinning, planarization, and dicing.
  • Develop and implement advanced packaging solutions to enable heterogeneous, flexible, and stretchable integration of electronic components and devices.
  • Design and oversee internal, external, and hybrid manufacturing workflows to accelerate development, integration, and scale-up of advanced electronic packaging technologies.
  • Develop new methods and processes to close technology gaps, improve device performance, and increase manufacturing yield through process innovation and optimization.
  • Design and execute experiments (DOE), analyze experimental results, and apply findings to improve packaging processes, device performance, and yield.
  • Execute hands-on fabrication workflows using advanced packaging and assembly equipment, identify in-line process issues, and propose solutions or workarounds to improve manufacturing performance.
  • Collaborate closely with researchers, hardware engineers, system integration teams, and external manufacturing partners to support the development and production of advanced electronic packaging solutions.
  • Support the development and use of high-performance electronic materials in advanced packaging environments.
  • Contribute to instrumentation development, process characterization, mechanical or layout design, and data analysis methods used in hardware research and development environments.
  • Follow Business Technology policies to protect sensitive data and reduce information security occurrences.

Education and Experience: (Knowledge, Skills, & Abilities)
  • Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Aerospace Engineering, Chemical Engineering, Applied Physics, Materials Science, or related technical field or equivalent professional experience required
  • Minimum of 1+ years of relevant work experience in semiconductor manufacturing, advanced packaging, or related electronics manufacturing environments preferred
  • Strong background in semiconductor or advanced packaging processes, including wafer-level or panel-level manufacturing
  • Hands-on experience working with semiconductor assembly and packaging equipment
  • Experience designing and executing Design of Experiments (DOE), analyzing results, and optimizing manufacturing yield
  • Experience collaborating across research and development, hardware engineering, and manufacturing teams
  • Strong analytical, troubleshooting, and problem-solving skills with an innovation and scalability mindset
  • Experience with advanced packaging technologies such as Flexible Printed Circuits (FPC), Printed Circuit Board Assembly (PCBA), 2.5D/3D integration, or related electronic packaging technologies
  • Experience working with back-end-of-line (BEOL) and advanced packaging processes including technologies such as thinning, grinding, dicing, soldering, eutectic bonding, electrochemical deposition or metal finishing, through-silicon vias (TSV), flip-chip bonding, wire or die bonding, bumping, thermocompression bonding, copper pillar bonding, hybrid bonding, underfill processes, and overmolding or encapsulation
  • Experience handling and integrating thinned electronic components as part of advanced packaging workflows
  • Demonstrated success developing or maturing hardware research processes including instrumentation, characterization, mechanical or layout design, and/or advanced data analysis techniques
  • Experience developing or applying high-performance electronic materials in semiconductor or advanced packaging environments
  • Experience with advanced packaging domains including Flexible Printed Circuits (FPC), Multi-Chip Modules (MCM), System-in-Package (SiP), 2.5D/3D integration, Flexible Hybrid Electronics (FHE), or similar technologies preferred
  • Experience performing reliability testing and failure analysis including die or ball shear testing, wire pull testing, X-ray inspection, C-SAM inspection, thermal cycling, and environmental testing preferred
  • Experience with wearable technologies or technical soft goods preferred
  • Experience with hermetic or MEMS packaging, thermal management materials, or injection/transfer molding processes preferred
  • Experience using Finite Element Analysis (FEA) modeling or simulation tools to accelerate design and prevent failures preferred
  • Experience in System-in-Package (SiP) or Multi-Chip Module (MCM) design, manufacturing, and validation preferred
  • Experience with signal integrity or power integrity simulation tools (e.g., HFSS) and validation preferred
  • Strong written and verbal English language communication skills
  • Excellent teamwork/interpersonal skills and the ability to communicate effectively
  • Demonstrated ability to work collaboratively, both within and outside one's own work group
  • Demonstrate commitment and adherence to Sigma Design Core Values
  • Pass a post-offer background verification

Work Environment
Standard lab/production environment. Appropriate safety garments (PPE) must be worn. Occasionally may be required to work in environmental conditions that emulate typical user environments in order to facilitate design testing and validation. Occasionally may be required to travel as required to other facilities, clients, or suppliers. Must be able to stand and work as long as 12 hours in different positions. Must be able to lift up to 50 pounds unassisted.
 

SigmaDesign is an Equal Opportunity Employer

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