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Electronic Packaging Engineer Jobs (NOW HIRING)

About the role As a Packaging Engineer at fab2, you'll work with a full-stack team to develop a ... Knowledge of electronic design Working at fab2 We're an early-stage hardware startup with solid ...

Process Engineer

Bodega Bay, CA · On-site

$184K - $324K/yr

Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. In this role, you will own the ...

Essential Job Duties We are seeking an experienced semiconductor device Packaging Engineer to join ... High power electronic devices including HEMTs, FETs, and diodes * Visible spectrum optoelectronic ...

Process Engineer

Bodega Bay, CA · On-site

$184K - $324K/yr

Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. In this role, you will own the ...

Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Proven fundamentals in material/chemistry/mechanical engineering field(s). In-depth knowledge of ...

Advanced Packaging Engineer

San Diego, CA · On-site

$220K - $250K/yr

... electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid ... Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ...

Showing results 41-60

Electronic Packaging Engineer information

See salary details

$41K

$88.9K

$137.5K

How much do electronic packaging engineer jobs pay per year?

As of Sep 15, 2026, the average yearly pay for electronic packaging engineer in the United States is $88,896.00, according to ZipRecruiter salary data. Most workers in this role earn between $59,500.00 and $109,500.00 per year, depending on experience, location, and employer.

What does an electronic packaging engineer do?

An Electronic Packaging Engineer is responsible for designing and developing the physical enclosures, supports, and cooling systems that protect and integrate electronic components in devices and systems. They ensure that electronic assemblies are mechanically robust, thermally managed, and compliant with industry standards. Their work often involves selecting materials, creating layouts, and collaborating with electrical and mechanical engineers to ensure reliability and manufacturability. This role is crucial in industries such as consumer electronics, aerospace, automotive, and telecommunications.

What are the key skills and qualifications needed to thrive as an electronic packaging engineer, and why are they important?

To thrive as an Electronic Packaging Engineer, you need a solid background in mechanical or electrical engineering, materials science, and thermal management, often supported by a bachelor's degree or higher in a related field. Familiarity with CAD software (such as AutoCAD or SolidWorks), simulation tools, and industry standards like IPC is typically required. Strong problem-solving abilities, teamwork, and effective communication set top performers apart in this role. These skills and qualities are critical to designing reliable, manufacturable electronic products that meet performance and regulatory requirements.

What are the most common challenges faced by electronic packaging engineers when collaborating with multidisciplinary teams?

Electronic Packaging Engineers often work closely with electrical, mechanical, and thermal engineers to ensure that electronic components are both functional and manufacturable. One common challenge is balancing the physical constraints of the package with thermal management and signal integrity needs, which can require significant compromise and creative problem-solving. Effective communication is essential to align on design priorities and quickly resolve conflicts that may arise from differing technical perspectives. Building strong interdisciplinary relationships and staying updated on industry standards can help facilitate smoother collaborations.

What is the difference between Electronic Packaging Engineer vs PCB Design Engineer?

AspectElectronic Packaging EngineerPCB Design Engineer
CredentialsBachelor's or Master's in Electrical Engineering, Mechanical Engineering, or related fields; certifications like IPC Designer CertificationBachelor's in Electrical Engineering, Computer Engineering, or related; certifications like IPC Designer Certification
Work EnvironmentDesigning and testing physical enclosures, thermal management, and assembly processes in labs or manufacturing settingsCreating PCB layouts, schematic design, and signal integrity analysis primarily in office or design labs
Industry UsageUsed in electronics manufacturing, consumer electronics, aerospace, and automotive sectorsPrimarily in electronics manufacturing, consumer electronics, and embedded systems industries

Electronic Packaging Engineers focus on designing the physical and thermal aspects of electronic components, ensuring durability and manufacturability. PCB Design Engineers concentrate on creating circuit layouts and schematics for printed circuit boards. While both roles require electrical engineering knowledge and often overlap in the electronics industry, their core responsibilities and work environments differ significantly.

More about Electronic Packaging Engineer jobs

What states have the most Electronic Packaging Engineer jobs?

States with the most job openings for Electronic Packaging Engineer jobs include:

What are popular job titles related to Electronic Packaging Engineer jobs?

For Electronic Packaging Engineer jobs, the most frequently searched job titles are:

Infographic showing various Electronic Packaging Engineer job openings in the United States as of September 2026, with employment types broken down into 2% As Needed, 81% Full Time, 15% Part Time, and 2% Contract. Highlights an 83% Physical, 1% Hybrid, and 16% Remote job distribution, with an average salary of $88,896 per year, or $42.7 per hour.

Semiconductor Packaging Engineer

Austin, TX • On-site

$110K - $155K/yr

Other

Medical, Dental, Vision, Life, Retirement, PTO

Posted 28 days ago


Job description

About fab2

The fab2 team can build anything. We design all the hardware and software needed to make chips and we make the fabs, tools, and components ourselves.
We're looking for exceptional, hands-on people who can iterate to the limits of what's possible.

fab2 was founded by Sam Zeloof and Jim Keller. Sam is best known for making chips in his garage, and Jim has been a leader in the semiconductor industry for the past 40 years.

About the role

As a Packaging Engineer at fab2, you’ll work with a full-stack team to develop a complete process for fabricating semiconductor packaging devices. You’ll be working on things like process development, recipe creation, lithography, deposition, die attaching, bonding, etc.

We are seeking an experienced Semiconductor Packaging Engineer with deep expertise in packaging methods and a passion for exploring new technologies. This person will play a critical role in developing and optimizing processes that leverage 3D printing to create innovative packaging solutions, ensuring they meet performance, reliability, and manufacturability requirements. The ideal candidate will have a broad skill set and be open-minded about integrating 3D printing into semiconductor packaging.

Responsibilities
  • Working with the team to explore and validate innovative semiconductor packaging processes.

  • Conducting hands-on lab experiments end-to-end to test.

  • Innovating novel materials for packaging, considering factors such as conductivity, mechanical strength, and thermal expansion.

  • Evaluating the process to continuously improve performance.

  • Collaborating closely with team members to provide technical support for experiments and methodologies.

  • Creating thorough documentation, including Standard Operating Procedures (SOPs), and maintaining equipment to ensure optimal performance and safety.

Required Experience
  • Masters or equivalent experience in Electrical Engineering, Material Science, Mechanical Engineering, or a related field

  • 5+ years of experience in semiconductor packaging from research or industry, with a strong understanding of end-to-end packaging processes and technologies.

  • Knowledge of packaging materials, thermal management, and reliability testing

  • Strong analytical and problem-solving skills, with the ability to troubleshoot complex packaging issues effectively.

Nice-to-have
  • Experience in 3d printing

  • Experience in metal plating

  • Mechanical-related background

  • Knowledge of electronic design

Working at fab2

We’re an early-stage hardware startup with solid funding, world-class advisors, and offices in Austin and San Francisco.

Compensation:

fab2 is committed to fair and equitable compensation practices. The annual salary range for this role is $110,000 – $155,000. Compensation is determined based on your qualifications and experience. Our total compensation package also includes generous equity in fab2.

Benefits:

fab2 Semi offers the following benefits, subject to applicable eligibility requirements:

  • Medical, Dental, and Vision insurance

  • Generous Paid Time Off inclusive of Holidays and Sick Time

  • Visa Sponsorship

  • Life and Disability Insurance

  • Paid Parental Leave

  • 401(k) retirement plan

  • Weekly Learning & Development opportunities

  • Commuter Benefits including Parking and Late Night Uber rides from the office

  • Lunches daily, Dinners 3x per week, Stocked Office Kitchen with Snacks and Spindrifts

We are an equal-opportunity employer and do not discriminate on the basis of race, religion, national origin, gender, sexual orientation, age, veteran status, disability or other legally protected statuses.

Export Control Analysis:

This position involves access to technology that is subject to U.S. export controls. Any job offer made will be contingent upon the applicant’s capacity to serve in compliance with U.S. export controls.

fab2, formerly known as Atomic Semi

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