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Electronic Packaging Engineer Jobs in California

Apple

Process Engineer

San Francisco, CA · On-site

Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. In this role, you will own the ...

Moog

Design Engineer, Electronics Packaging

Los Angeles, CA · On-site

$100K - $130K/yr

Design Engineer, Electronics Packaging Reporting To: Management, Design Engineering Work Schedule ... Create conceptual and detailed designs for electronic packaging related tasks including controller ...

Apple

Process Engineer

Bodega Bay, CA

$184K - $324K/yr

Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. In this role, you will own the ...

Apple

Process Engineer

Bodega Bay, CA

$184K - $324K/yr

Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. In this role, you will own the ...

Apple

Packaging Substrate Engineer

San Francisco, CA · On-site

Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Proven fundamentals in material/chemistry/mechanical engineering field(s). In-depth knowledge of ...

Cspeed

FEA Packaging Engineer

Palo Alto, CA

MS or PhD in Mechanical Engineering, Materials Science, Engineering Mechanics, or equivalent practical background. * 6+ years of finite element analysis for semiconductor packaging or electronic ...

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All JobsElectronic Packaging Engineer JobsElectronic Packaging Engineer Jobs in California

Electronic Packaging Engineer information

See California salary details

$40.5K

$87.7K

$135.7K

How much do electronic packaging engineer jobs pay per year?

As of Aug 9, 2026, the average yearly pay for electronic packaging engineer in California is $87,732.00, according to ZipRecruiter salary data. Most workers in this role earn between $58,700.00 and $108,100.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as an electronic packaging engineer, and why are they important?

To thrive as an Electronic Packaging Engineer, you need a solid background in mechanical or electrical engineering, materials science, and thermal management, often supported by a bachelor's degree or higher in a related field. Familiarity with CAD software (such as AutoCAD or SolidWorks), simulation tools, and industry standards like IPC is typically required. Strong problem-solving abilities, teamwork, and effective communication set top performers apart in this role. These skills and qualities are critical to designing reliable, manufacturable electronic products that meet performance and regulatory requirements.

What is the difference between Electronic Packaging Engineer vs PCB Design Engineer?

AspectElectronic Packaging EngineerPCB Design Engineer
CredentialsBachelor's or Master's in Electrical Engineering, Mechanical Engineering, or related fields; certifications like IPC Designer CertificationBachelor's in Electrical Engineering, Computer Engineering, or related; certifications like IPC Designer Certification
Work EnvironmentDesigning and testing physical enclosures, thermal management, and assembly processes in labs or manufacturing settingsCreating PCB layouts, schematic design, and signal integrity analysis primarily in office or design labs
Industry UsageUsed in electronics manufacturing, consumer electronics, aerospace, and automotive sectorsPrimarily in electronics manufacturing, consumer electronics, and embedded systems industries

Electronic Packaging Engineers focus on designing the physical and thermal aspects of electronic components, ensuring durability and manufacturability. PCB Design Engineers concentrate on creating circuit layouts and schematics for printed circuit boards. While both roles require electrical engineering knowledge and often overlap in the electronics industry, their core responsibilities and work environments differ significantly.

What are the most common challenges faced by electronic packaging engineers when collaborating with multidisciplinary teams?

Electronic Packaging Engineers often work closely with electrical, mechanical, and thermal engineers to ensure that electronic components are both functional and manufacturable. One common challenge is balancing the physical constraints of the package with thermal management and signal integrity needs, which can require significant compromise and creative problem-solving. Effective communication is essential to align on design priorities and quickly resolve conflicts that may arise from differing technical perspectives. Building strong interdisciplinary relationships and staying updated on industry standards can help facilitate smoother collaborations.

What does an electronic packaging engineer do?

An Electronic Packaging Engineer is responsible for designing and developing the physical enclosures, supports, and cooling systems that protect and integrate electronic components in devices and systems. They ensure that electronic assemblies are mechanically robust, thermally managed, and compliant with industry standards. Their work often involves selecting materials, creating layouts, and collaborating with electrical and mechanical engineers to ensure reliability and manufacturability. This role is crucial in industries such as consumer electronics, aerospace, automotive, and telecommunications.
What are popular job titles related to Electronic Packaging Engineer jobs in California? For Electronic Packaging Engineer jobs in California, the most frequently searched job titles are:
What job categories do people searching Electronic Packaging Engineer jobs in California look for? The top searched job categories for Electronic Packaging Engineer jobs in California are:
Electronic Packaging Engineer jobs near you
Infographic showing various Electronic Packaging Engineer job openings in California as of August 2026, with employment types broken down into 1% As Needed, 79% Full Time, 17% Part Time, and 3% Contract. Highlights an 96% Physical, 1% Hybrid, and 3% Remote job distribution, with an average salary of $87,732 per year, or $42.2 per hour.

Optical-Electronic Packaging Engineer

Lumentum Operations LLC

San Jose, CA • On-site

Full-time

Re-posted 3 hours ago

Job description

It's fun to work in a company where people truly BELIEVE in what they're doing!
We're committed to bringing passion and customer focus to the business.
If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!
Position Title: Mechanical Engineer (AI & Data Center Optical Modules)
Employment Type: Full-time, Existing vacancy
Location: San-Jose (On-Site)
About Lumentum
At Lumentum, we're building the tech behind the world's fastest networks and most advanced systems. Our optical and photonic solutions power everything from AI and cloud computing to data centers, telecom, and advanced manufacturing.
We're a global team of innovators working where light meets technology, solving big challenges that keep the world connected and moving forward. If shaping the future of connectivity excites you, you'll fit right in.
Why You'll Love This Role
We are seeking Mechanical Engineers to support the design and development of next-generation high-speed optical modules for AI and data center interconnect applications. This role focuses on advanced mechanical and thermal packaging solutions for high-density, high-power optical modules, including pluggable form factors and emerging advanced packaging architectures.
Engineers in this role will define and deliver mechanical package solutions from early concept and system architecture through prototyping, validation (EVT/DVT), and high-volume manufacturing ramp. The scope of responsibility will scale with experience. Senior engineers are expected to provide technical leadership, influence mechanical and thermal architecture decisions, and contribute to long-term platform and technology roadmap development.
This position plays a critical role in enabling scalable, cost-effective optical module platforms that meet the performance, power, and manufacturability demands of AI-driven data center systems.
What You'll Be Doing
  • Design and develop mechanical packaging solutions for high-speed optical modules used in AI and data center interconnect systems
  • Drive mechanical concepts from architecture definition through detailed design, prototype build, validation, and production ramp
  • Develop detailed 3D CAD models and engineering documentation
  • Perform advanced thermal and mechanical stress analysis (FEA) to address high power density, airflow constraints, and long-term reliability
  • Own GD&T definition and tolerance stack-up analysis for high-density opto-electro-mechanical assemblies
  • Design fixtures, tooling, and test infrastructure to support optical alignment, module validation, and scalable manufacturing
  • Collaborate closely with optical, electrical, thermal, reliability, manufacturing, and supply-chain teams to deliver integrated, system-aware solutions
  • For senior-level engineers: provide technical direction, review designs, mentor junior engineers, and influence mechanical and thermal platform strategy

What We're Looking For
Education:
B.S. in Mechanical Engineering or a related discipline (M.S. or Ph.D. preferred)
Experience:
Core Requirements:
  • Experience level flexible: typically 5+ years of relevant industry experience for senior-level consideration; motivated early-career engineers with strong fundamentals and relevant project experience are also encouraged to apply
  • Prior experience developing optoelectronic or high-speed electronic products for data center, AI, or high-performance computing applications is highly valued
  • Strong proficiency in mechanical design and thermal simulation tools such as SolidWorks, FloTHERM, or equivalent CAD/FEA platforms
  • Deep understanding of thermal management, structural analysis, and high-density packaging design
  • Experience with GD&T and tolerance stack-up analysis for complex assemblies
  • Familiarity with high-density, non-hermetic optical module packaging and design for manufacturability (DFM/DFA)
  • Working knowledge of data analysis tools (e.g., JMP) and basic scripting or programming (VB, C, MATLAB, etc.) to support testing and automation is a plus
  • Ability to operate independently on complex technical problems while contributing effectively in a highly cross-functional environment.
  • Self-motivated and adaptable in a fast-paced R&D and NPI environment
  • Willingness to travel internationally (up to 25%) to manufacturing and contract manufacturing sites to drive NPI execution, manufacturing readiness, yield improvement, and high-volume production ramp

Perks You'll Love
  • Flexible time off
  • Health and wellness benefits (physical and mental)
  • Tuition reimbursement and career growth support
  • A workplace built for you: free gym, games room, prayer room
  • Subsidized meals, free coffee/tea
  • Employee stock options and incentive plans
  • A collaborative, innovative, and inclusive culture

Join a Team That's Shaping the Future
At Lumentum, we're more than just a workplace-we're a launchpad for creativity and innovation. We're committed to celebrating your unique talents and helping you grow. Our guiding principles-Innovate, Engage, Deliver, Excel, and Win-aren't just words; they're the heart of what we do.
Let's Build a Brighter Future Together!
We're committed to building an inclusive workplace where everyone feels valued and empowered. We welcome applicants from all backgrounds and provide accommodations for individuals with disabilities throughout the hiring process. Your uniqueness makes us stronger, sparks creativity, and drives our success.
Please contact us at talentacquisition@lumentum.com to request accommodation.
Join us-your future starts here!
Pay Range:
P70-USA-1 :$134,750.00 - $192,500.00
Disclaimer:
Final base salary for the successful candidate will depend on multiple factors, including but not limited to, job location, where work will be performed, qualifications, work history and relevant experience. With our continual goal of making Lumentum a best place to work for our employees, we strive to offer employees competitive total compensation packages, which may include annual bonus, commission for certain sales roles, equity, and health and welfare benefits.

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