The Staff Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products.
The Staff Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products.
The Staff Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products.
The Staff Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products.
The Senior Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products.
The Senior Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products.
The Senior Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products.
The Senior Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products.
As a Staff DFT Design Engineer, you will work on design, simulation, and validation of next ... Develop DFT solutions for both base die and DRAM die, considering stackeddie and cubelevel test ...
As a Staff DFT Design Engineer, you will work on design, simulation, and validation of next ... Develop DFT solutions for both base die and DRAM die, considering stackeddie and cubelevel test ...
... DRAM interfaces (DDR4), I2C, SPI, operational amplifiers, analog to digital and digital to analog ... programming languages (Python, C/C++) Demonstrated ability to work in a highly cross-functional ...
... DRAM interfaces (DDR4), I2C, SPI, operational amplifiers, analog to digital and digital to analog ... programming languages (Python, C/C++) Demonstrated ability to work in a highly cross-functional ...
Staff Design Verification Engineer, HBM Architecture
Richardson, TX · On-site
$125 - $150/hr
JR94772 Staff Design Verification Engineer, HBM Architecture Micron Technology is a world leader in ... stacking multiple DRAM chips on a high‑speed memory controller using TSV technology to ...
Staff Design Verification Engineer, HBM Architecture
Richardson, TX · On-site
$125 - $150/hr
JR94772 Staff Design Verification Engineer, HBM Architecture Micron Technology is a world leader in ... stacking multiple DRAM chips on a high‑speed memory controller using TSV technology to ...
Circuit / Memory Design Engineer | HBM - TPG
Richardson, TX · On-site
$125 - $150/hr
We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one ... As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and ...
Circuit / Memory Design Engineer | HBM - TPG
Richardson, TX · On-site
$125 - $150/hr
We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one ... As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and ...
As a Principal Design Engineer, you will build the future of memory by architecting and delivering ... Design and optimize DRAM circuits spanning digital, analog, and memory core subsystems to meet ...
As a Principal Design Engineer, you will build the future of memory by architecting and delivering ... Design and optimize DRAM circuits spanning digital, analog, and memory core subsystems to meet ...
As a Principal Design Engineer, you will build the future of memory by architecting and delivering ... Design and optimize DRAM circuits spanning digital, analog, and memory core subsystems to meet ...
As a Principal Design Engineer, you will build the future of memory by architecting and delivering ... Design and optimize DRAM circuits spanning digital, analog, and memory core subsystems to meet ...
As a Staff DFT Design Engineer, you will work on design, simulation, and validation of next ... Develop DFT solutions for both base die and DRAM die, considering stacked-die and cube-level test ...
As a Staff DFT Design Engineer, you will work on design, simulation, and validation of next ... Develop DFT solutions for both base die and DRAM die, considering stacked-die and cube-level test ...
Staff HBM Design Architect
Richardson, TX · On-site
$200 - $250/hr
Master's degree or higher in Electrical Engineering or related field. * Experience with advanced DRAM architectures such as 3D DRAM. * Background in high‑speed clocking, interfaces, or power ...
Staff HBM Design Architect
Richardson, TX · On-site
$200 - $250/hr
Master's degree or higher in Electrical Engineering or related field. * Experience with advanced DRAM architectures such as 3D DRAM. * Background in high‑speed clocking, interfaces, or power ...
We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one ... As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and ...
We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one ... As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and ...
We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one ... As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and ...
We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one ... As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and ...
Circuit / Memory Design Engineer | HBM - TPG
Richardson, TX · On-site
$100 - $125/hr
Bachelor's degree in Electrical Engineering or related field (or equivalent practical experience ... Strong understanding of timing, area, power, and complexity trade‑offs in DRAM or mixed‑signal ...
Circuit / Memory Design Engineer | HBM - TPG
Richardson, TX · On-site
$100 - $125/hr
Bachelor's degree in Electrical Engineering or related field (or equivalent practical experience ... Strong understanding of timing, area, power, and complexity trade‑offs in DRAM or mixed‑signal ...
Design Engineer- (Standard and Custom Cell Characterization) -HBM Richardson, Texas, United Sta[...]
Richardson, TX · On-site
$125 - $150/hr
## Design Engineer- (Standard and Custom Cell Characterization) -HBMRichardson, Texas, United States ... We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one ...
Design Engineer- (Standard and Custom Cell Characterization) -HBM Richardson, Texas, United Sta[...]
Richardson, TX · On-site
$125 - $150/hr
## Design Engineer- (Standard and Custom Cell Characterization) -HBMRichardson, Texas, United States ... We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one ...
Systems Performance Engineer
Austin, TX · On-site
$150 - $200/hr
The engineer works with senior engineers and researchers on AI training and inference systems ... Develop and evaluate data placement, migration, and prefetching algorithms across HBM, LP/DRAM, CXL ...
Systems Performance Engineer
Austin, TX · On-site
$150 - $200/hr
The engineer works with senior engineers and researchers on AI training and inference systems ... Develop and evaluate data placement, migration, and prefetching algorithms across HBM, LP/DRAM, CXL ...
Principal Design Verification Engineer, HBM
Richardson, TX · On-site
$150 - $200/hr
Verify IP, subsystem, full-chip, and system-level HBM and DRAM designs to ensure functional ... Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or ...
Principal Design Verification Engineer, HBM
Richardson, TX · On-site
$150 - $200/hr
Verify IP, subsystem, full-chip, and system-level HBM and DRAM designs to ensure functional ... Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or ...
Staff Engineer, HBM Verification Architecture
Richardson, TX · On-site
$150 - $200/hr
We stack multiple DRAM chips on a high‑speed memory controller using TSV (Through Silicon Via ... You will collaborate closely with Design Engineering, Product Engineering, Business Units, and ...
Staff Engineer, HBM Verification Architecture
Richardson, TX · On-site
$150 - $200/hr
We stack multiple DRAM chips on a high‑speed memory controller using TSV (Through Silicon Via ... You will collaborate closely with Design Engineering, Product Engineering, Business Units, and ...
Staff HBM Design Architect Richardson, Texas, United States of America + 1 more Posted a day ago
Richardson, TX · On-site
$200 - $250/hr
Master's degree or higher in Electrical Engineering or related field* Experience with advanced DRAM architectures such as 3D DRAM* Background in high‐speed clocking, interfaces, or power delivery ...
Staff HBM Design Architect Richardson, Texas, United States of America + 1 more Posted a day ago
Richardson, TX · On-site
$200 - $250/hr
Master's degree or higher in Electrical Engineering or related field* Experience with advanced DRAM architectures such as 3D DRAM* Background in high‐speed clocking, interfaces, or power delivery ...
Dram Engineer information
What is a DRAM engineer?
How does a DRAM engineer typically collaborate with cross-functional teams during the memory development process?
What are the key skills and qualifications needed to thrive as a DRAM engineer, and why are they important?
What is the difference between Dram Engineer vs Memory Engineer?
| Aspect | Dram Engineer | Memory Engineer |
|---|---|---|
| Credentials | Bachelor's or higher in Electrical Engineering, Computer Engineering, or related fields; certifications like IEEE are common | Similar educational background; often holds certifications in memory design or semiconductor manufacturing |
| Work Environment | Design labs, semiconductor fabs, R&D centers | Design labs, semiconductor manufacturing facilities, R&D centers |
| Industry Usage | Memory chip companies, electronics manufacturers | Memory chip companies, electronics manufacturers |
| Job Focus | Design and optimize DRAM modules, ensure performance and reliability | Design and develop various types of memory, including DRAM, SRAM, Flash |
Both Dram Engineers and Memory Engineers work in similar environments and industries, often sharing educational backgrounds and certifications. While Dram Engineers focus specifically on DRAM technology, Memory Engineers may work on a broader range of memory types. The roles are closely related, with overlapping skills in semiconductor design and testing.
What are popular job titles related to Dram Engineer jobs in Texas?
For Dram Engineer jobs in Texas, the most frequently searched job titles are:
What job categories do people searching Dram Engineer jobs in Texas look for?
The top searched job categories for Dram Engineer jobs in Texas are:
What cities in Texas are hiring for Dram Engineer jobs?
Cities in Texas with the most Dram Engineer job openings:

Principal Memory Design Engineer, HBM
Richardson, TX • On-site
Other
Medical, Dental, Vision, PTO
Re-posted 3 days ago
Micron Technology rating
8.6
Based on 43 frontline employees who took The Breakroom Quiz
28th of 162 rated electronics manufacturers
Job description
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
The Staff Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment.
Responsibilities
- Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution.
- Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan.
- Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership.
- Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts.
- Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits.
- Prepare and maintain design documentation while contributing to best‑known practices and departmental training.
- Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality.
- Manage layout and develop resources, track project tasks, and serve as the point of contact for design, layout, verification, and test issues.
- Prepare project status reports and lead design reviews to communicate progress and technical decisions.
Qualifications
- Coursework in CMOS Circuit Design, VLSI, and Analog Circuit Design, with understanding of device reliability and circuit floor planning.
- Proficiency with Cadence Virtuoso, and experience simulating with FINESIM, HSPICE, and VERILOG.
- Strong analytical and problem‑solving skills with proven significant technical contributions and a record of innovation.
- Expertise in DRAM subsystem architecture, specification, operation, or design, including cross‑department technical leadership experience.
- Ability to proactively collaborate across multiple engineering organizations to optimize manufacturing quality, cost, reliability, and time‑to‑market.
Preferred Qualifications
- Self‑motivated with strong problem‑solving abilities and a drive to discover new solutions.
- Deep knowledge of industry‑specific technologies and competitive trends.
- Excellent communication and interpersonal skills for cross‑functional collaboration.
- BS or MS in Electrical Engineering or related field plus 6 years of experience in DRAM design, product, or system.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn about your right to work click here.
To learn more about Micron, please visitmicron.com/careers
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
What Micron Technology employees say
Pay
Benefits
Hours and flexibility
Workplace
Get the full story on Breakroom
About Micron Technology
Sourced by ZipRecruiter
Industry
Semiconductor and electronic component manufacturing
Company size
10,000+ Employees
Headquarters location
Boise, ID, US
Year founded
2019