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Chip Manufacturing Jobs (NOW HIRING)

Corbin Engineering

Junior Mechanical Engineer

Beaverton, OR

$66K - $85K/yr

You will work with facility HVAC, process piping and exhaust, hydronic systems, and chip manufacturing equipment installations. Preparing engineering studies for mechanical and process systems that ...

Aus-Mex Company Inc

tortilla chip cutters

Midland, TX · On-site

$15.75 - $20.75/hr

Aus-Mex Company Inc is looking for hardworking and reliable Tortilla Chip Cutters to join our production team in Midland, TX! This is a great opportunity to be part of a hands-on food manufacturing ...

Conductor

Packaging Engineer- Flip Chip

Boston, MA · On-site

Work cross-functionally with design, reliability, thermal, and manufacturing teams to ensure robust ... Strong experience in flip chip packaging and assembly processes for Deep understanding of bumping ...

Aus-Mex Company Inc

tortilla chip cutters

Midland, TX · On-site

$15.75 - $20.75/hr

Aus-Mex Company Inc is looking for hardworking and reliable Tortilla Chip Cutters to join our production team in Midland, TX! This is a great opportunity to be part of a hands-on food manufacturing ...

Aus-Mex Company Inc

tortilla chip cutters

Midland, TX · On-site

$15.75 - $20.75/hr

Aus-Mex Company Inc is looking for hardworking and reliable Tortilla Chip Cutters to join our production team in Midland, TX! This is a great opportunity to be part of a hands-on food manufacturing ...

Lattice Semiconductor

SoC Chip Lead

San Jose, CA

Lattice is a worldwide community of engineers, designers, and manufacturing operations specialists ... We are seeking a SoC Chip Lead with deep technical expertise and a track record of delivering ...

Conductor

Packaging Engineer- Flip Chip

Austin, TX · On-site

Work cross-functionally with design, reliability, thermal, and manufacturing teams to ensure robust ... Strong experience in flip chip packaging and assembly processes for Deep understanding of bumping ...

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Chip Manufacturing information

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$30.5K

$97.6K

$153.5K

How much do chip manufacturing jobs pay per year?

As of Sep 14, 2026, the average yearly pay for chip manufacturing in the United States is $97,556.00, according to ZipRecruiter salary data. Most workers in this role earn between $78,000.00 and $120,500.00 per year, depending on experience, location, and employer.

What is a chip manufacturing job?

A Chip Manufacturing job involves overseeing the production of semiconductor chips used in electronic devices. It includes roles in wafer fabrication, process engineering, quality control, and equipment maintenance. Workers operate specialized machinery in cleanroom environments to ensure precision and efficiency. These jobs require knowledge of semiconductor materials, manufacturing processes, and industry standards. Chip manufacturing professionals play a vital role in advancing technology by improving chip performance and production efficiency.

What are the key skills and qualifications needed to thrive in chip manufacturing?

To thrive in chip manufacturing, you need a solid background in electronics, semiconductor processes, and quality control, often supported by a degree in engineering or a related technical field. Familiarity with cleanroom protocols, wafer fabrication equipment, and industry systems such as SEM (scanning electron microscopy) or lithography tools is critical. Attention to detail, problem-solving abilities, and effective teamwork are highly valued soft skills in this environment. These competencies ensure that chip production meets rigorous quality standards, minimizes defects, and maintains efficiency in a highly technical and collaborative setting.

What are some typical challenges faced in chip manufacturing roles?

Chip manufacturing professionals often face challenges such as maintaining high yields while minimizing defects, adapting to rapidly evolving technology, and adhering to strict cleanroom procedures. The work environment is highly controlled and can involve repetitive tasks, precise measurements, and troubleshooting complex equipment. Collaboration with engineering, quality assurance, and maintenance teams is common, requiring strong communication and coordination skills. Overcoming these challenges not only ensures the production of reliable chips but also provides valuable hands-on experience that can lead to advancement within the semiconductor industry.

How to work in chip manufacturing?

To work in chip manufacturing, candidates typically need a high school diploma or equivalent, with many roles requiring technical training or an associate degree in electronics, materials science, or a related field. Skills in cleanroom procedures, understanding of semiconductor fabrication processes, and familiarity with tools like photolithography equipment are important. Certifications such as IPC standards or specialized training can improve job prospects, and attention to detail and safety are critical in this environment.
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What are the most commonly searched types of Chip Manufacturing jobs?

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Chip Manufacturing jobs near you
Infographic showing various Chip Manufacturing job openings in the United States as of September 2026, with employment types broken down into 1% Internship, 2% As Needed, 88% Full Time, 4% Part Time, 2% Contract, and 3% Nights. Highlights an 94% Physical, 2% Hybrid, and 4% Remote job distribution, with an average salary of $97,556 per year, or $46.9 per hour.

Packaging Engineer- Flip Chip

San Francisco, CA • On-site

Conductor
See more jobs at Conductorexternal

Other

Posted 26 days ago

Job description

We're seeking experienced engineers to contribute to flip chip package development and assembly processes for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip).

This spans bump metallurgy, substrate integration, reflow and underfill processes, reliability, failure analysis, and cross-functional support through package and systemproductization.

Core Responsibilities:

  • Develop and optimize flip chip attach processes including bump formation,

placement, reflow, and underfill for high-performance semiconductor packages.

  • Define and manage bump metallurgy stacks (e.g., Cu pillar, SnAg, micro-bumps)

and substrate pad finishes for robust interconnect performance.

  • Drive package integration from die to substrate, ensuring alignment, coplanarity,

and yield optimization.

  • Evaluate and mitigate assembly risks including warpage, non-wet opens, voiding,

head-in-pillow, and interconnect defects.

  • Collaborate with substrate vendors, OSATs, and internal teams to define design

rules (pad pitch, bump pitch, keep-outs, stack-ups).

  • Lead process development for reflow profiles, flux selection, cleaning, and underfill

dispense/cure.

  • Perform root cause analysis of assembly and reliability failures using cross-

sectioning, SEM, CSAM, and other failure analysis techniques.

  • Support reliability qualification including thermal cycling, drop, mechanical shock,

and power cycling.

  • Work cross-functionally with design, reliability, thermal, and manufacturing teams

to ensure robust package performance from concept through high-volume

production.

Required Technical Skills:

  • Strong experience in flip chip packaging and assembly processes for

Deep understanding of bumping technologies (solder bumps, Cu pillar, micro-

  • bumps) and UBM/metallization systems.

Experience with underfill materials, dispense techniques, flow behavior, and cure

  • processes.

Understanding of thermo-mechanical behavior in flip chip assemblies (CTE

  • mismatch, warpage, solder fatigue, reliability risks).

Hands-on experience with failure analysis and reliability testing (cross-sections,

  • SEM, CSAM, thermal cycling).

Ability to work with OSATs and suppliers to develop and transfer assembly

  • processes into production.

Strong problem-solving skills with ability to debug yield and reliability issues in

  • manufacturing environments.

Preferred / Differentiating Skills:

  • Experience with III-V packaging, photonics packaging, and precision chip attach.

Experience with advanced packaging technologies including 2.5D interposers, 3D

  • stacking, chiplets, and CoWoS-like architectures.
  • Familiarity with bill of materials used in photonics packaging such as clear

adhesives and underfills as well as mold compounds and underfills for 2.5D

advanced packaging.

  • Familiarity with fine-pitch micro-bump and hybrid bonding approaches.
  • Experience integrating high-power or high-TDP devices with tight warpage and

thermal constraints.

  • Exposure to thermo-mechanical modeling or collaboration with simulation teams

for warpage and reliability prediction.

  • Understanding of system-level interactions (PCB attach, second-level interconnect

reliability).

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