Thin Films Process Engineer Jobs in Wisconsin (NOW HIRING)

• Develop and optimize processes for MEMS design and fabrication, focusing on innovative material solutions.
• Develop sensor chip design for pressure, air flow, liquid flow, magnetic, chemical, and electrochemical sensing.
• Conduct process development for semiconductor manufacturing, focusing on innovative techniques to enhance efficiency and performance.
• Oversee and collaborate with a cross-functional team including the Richardson fab engineering group, quality, planning, fab management, HSE, and packaged parts group to transition die from development into manufacturing.
• Ensure that products are delivered on time and meet customer specifications.
• Support scaling of processes from laboratory to pilot and production levels.
• Stay current with industry trends and advancements in MEMS technologies, materials science, and related fields.

Requirements

• **MUST HAVE:*
• - A minimum of a bachelor’s degree from an accredited institution in a technical discipline such as applied physics, electrical engineering, physics, materials science, chemistry, chemical engineering or related fields.
• - Minimum 5 years of experience in engineering roles, with a focus on semiconductor sensor design, semiconductor process development, microelectromechanical systems (MEMS), or related technologies.
• - Experience with Semiconductor manufacturing or design including 5 years of hands-on experience in an industrial fab.
• - Knowledge of semiconductor materials and processes.
• - Effective communication and interpersonal skills.
• - Expertise in analyzing data leading to informed decision-making.
• - Excellent written communication with proficiency in documenting processes and findings clearly.** *
• **WE VALUE:*
• - Understanding of physical principles relevant to semiconductor and/or MEMS technologies.
• - Skills in designing and optimizing manufacturing processes.
• - Ability to troubleshoot and offer technical solutions to complex issues in semiconductor design and manufacturing.
• - Skills in diagnosing and resolving technical problems.
• - Proficient in identifying issues and implementing solutions.
• - Capability to develop new ideas and approaches in engineering.
• - Ability to guide modelling of sensors with COMSOL, ANSYS, or other software tools.
• - Familiarity with quality assurance in semiconductor manufacturing.
• - Ability to work effectively in team settings across disciplines.
• - Exceptional problem-solving skills and the ability to work both independently and as part of a team.
• - Strong analytical skills to evaluate complex data and processes.** *
• **Experience in some of the following is of value: ** *
• - Experience in MEMS technology, with a solid understanding of sensor applications.
• - Familiarity with process development methodologies and tools used in semiconductor fabrication. Especially experience with thin film deposition, epitaxy, plasma processing, deep reactive ion etching (DRIE), chemical vapor deposition, sputter deposition, photolithography, anisotropic etching, ion implantation, diffusion, and aerosol jet printing.
• - Experience with thin films (metals, insulators, polymers, nanomaterials, polymers, or advanced composite materials) and interfaces.
• - Background in material characterization techniques and analytical chemistry, in particular, AFM, SEM, EDX, SIMS, XPS, FTIR, Auger, contact angle, spectroscopic ellipsometry, viscosity.
• - Experience with electrical characterization of solid-state devices.

🔍 ATS Optimization Keywords
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Hard Skills

• MEMS design
• semiconductor sensor design
• process development
• thin film deposition
• chemical vapor deposition
• plasma processing
• deep reactive ion etching
• material characterization
• electrical characterization
• data analysis

Soft Skills

• effective communication
• interpersonal skills
• problem-solving
• analytical skills
• team collaboration
• decision-making
• troubleshooting
• creativity
• documentation
• independent work