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Temporary Memory Design Engineer Jobs (NOW HIRING)

Intel Corporation

Memory Circuit Design Engineer

Austin, TX · On-site

$164K - $269K/yr

About the Role Intel's CPU Circuit Technology team is seeking a highly motivated Memory Circuit Design Engineer to drive the design and development of advanced memory circuits for future CPU and SoC ...

Intel Corporation

$164K - $269K/yr

About the Role Intel's CPU Circuit Technology team is seeking a highly motivated Memory Circuit Design Engineer to drive the design and development of advanced memory circuits for future CPU and SoC ...

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Principal Memory Design Engineer, HBM

Richardson, TX • On-site

1000 Micron Technology, Inc.
See more jobs at 1000 Micron Technology, Inc.external

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Medical, Dental, Vision, PTO

Re-posted 2 days ago

Job description

Micron Technology is a world leader in innovating memory and storage solutions. The Principal Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while leading layout processes and ensuring robust verification and reliability. The role collaborates cross‑functionally to support manufacturability, drive innovation for future memory generations, and oversee project activities from design through validation and review.

Responsibilities
  • Design and implement DRAM circuits, including digital, analog, and memory core circuitry, based on device specifications.
  • Create and optimize floorplans for circuit placement, signal routing, power delivery, sense margins, timings, and die size.
  • Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, speed, and reliability.
  • Model parasitics in simulation, verify routing and power integrity, and support validation, reticle experiments, and tape‑out revisions.
  • Confirm simulation‑to‑silicon correlation and recommend schematic edits.
  • Contribute to documentation, training, standardization efforts, and cross‑group communication.
  • Manage build and layout resources, monitor task progress, and lead technical reviews.
  • Serve as a primary contact for design, layout, verification, and testing while preparing project status reports.
Requirements
  • Coursework in CMOS Circuit Design, VLSI, and Analog Circuit Design, with knowledge of device reliability.
  • Expertise in Cadence Virtuoso, physical layout, and circuit floor planning.
  • Experience with FINESIM, HSPICE, and VERILOG simulation tools.
  • Strong analytical and problem‑solving abilities with a history of technical contributions and innovation.
  • Deep expertise in DRAM subsystem architecture, specification, operation, or design, including cross‑department technical leadership.
Preferred Qualifications
  • Highly self‑motivated with strong problem‑solving instincts and a passion for discovering new solutions.
  • In‑depth awareness of industry‑specific technologies and trends.
  • Excellent communication and interpersonal skills.
Benefits
  • Medical, dental, and vision plans available in all locations.
  • Income protection if unable to work due to illness or injury.
  • Paid family leave.
  • Robust paid time‑off program and paid holidays.

Micron is proud to be an equal opportunity workplace and an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.

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