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Temp Mechanical Test Engineer information
See salary details
$55.5K - $64K
4% of jobs
$64K - $72.4K
10% of jobs
$79.8K is the 25th percentile. Wages below this are outliers.
$72.4K - $80.9K
13% of jobs
$80.9K - $89.3K
15% of jobs
The median wage is $95K / yr.
$89.3K - $97.8K
13% of jobs
$97.8K - $106.2K
14% of jobs
$110.8K is the 75th percentile. Wages above this are outliers.
$106.2K - $114.7K
13% of jobs
$114.7K - $123.1K
6% of jobs
$123.1K - $131.6K
5% of jobs
$131.6K - $140K
3% of jobs
$140K - $148.5K
4% of jobs
$55.5K
$100.6K
$148.5K
How much do temp mechanical test engineer jobs pay per year?
What types of projects and testing equipment will I typically work with as a temp mechanical test engineer?
What is the difference between Temp Mechanical Test Engineer vs Mechanical Test Technician?
| Aspect | Temp Mechanical Test Engineer | Mechanical Test Technician |
|---|---|---|
| Credentials | Bachelor's in Mechanical Engineering or related field; certifications vary | Associate's or Bachelor's in Mechanical Technology or related field |
| Work Environment | Design labs, testing facilities, manufacturing plants | Testing labs, production lines, maintenance areas |
| Employer & Industry | Automotive, aerospace, manufacturing companies | Manufacturers, R&D departments, testing labs |
The Temp Mechanical Test Engineer typically handles testing design, analysis, and reporting, often requiring engineering degrees and certifications. Mechanical Test Technicians focus on executing tests, maintaining equipment, and recording data. Both roles are essential in testing environments but differ mainly in responsibilities and qualifications.
What does a temp mechanical test engineer do?
What are the key skills and qualifications needed to thrive as a temp mechanical test engineer, and why are they important?

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Re-posted 5 days ago
SpaceX rating
8.8
Based on 147 frontline employees who took The Breakroom Quiz
14th of 71 rated aerospace companies
Job description
THERMAL MECHANICAL TEST ENGINEER, SILICON PACKAGING (STARLINK)
SpaceX is leveraging our experience building rockets and spacecraft to deploy Starlink, the world's largest satellite constellation and most advanced broadband internet system. We provide reliable and fast internet to millions of users worldwide, including populations with little or no connectivity, rural communities, aircraft, watercraft, and places where existing services are unreliable, too expensive, or disconnected by natural disasters. We design, build, test, and operate all parts of the system, thousands of satellites and consumer dishes that allow users to connect within minutes of unboxing. The Starlink team is seeking out the best-in-class professionals to maximize Starlink's potential for communities and businesses around the globe.
As a Thermal Mechanical Test Engineer for Silicon Packaging at SpaceX, you will develop and execute thermal and mechanical modeling and test programs for advanced semiconductor packaging and board-level assemblies. You will support the silicon packaging process engineering organization by characterizing package and board thermal performance, validating mechanical robustness, and correlating simulation results with physical test data to enable high-volume production of reliable Starlink hardware.
RESPONSIBILITIES:
- Develop and run thermal and mechanical finite element models, and thermal simulations, to predict package and board-level behavior under operational and environmental conditions
- Develop process models to support new production line bring-up and investigations into packaging processes
- Design, set up, and execute thermal and mechanical test campaigns
- Perform board-level thermal characterization and testing to evaluate heat spreading, junction temperatures, and system-level thermal performance
- Operate and maintain thermal and mechanical test equipment, such as thermal chambers, along with instrumentation, including thermocouples and infrared cameras
- Analyze test data, correlate models with empirical results, and provide actionable feedback to packaging, silicon design, and manufacturing teams
- Support new package and board designs through test planning, execution, and data reporting
- Collaborate cross-functionally with packaging process engineers, hardware design teams, production operations, and quality to integrate test insights into product development and production ramp
BASIC QUALIFICATIONS:
- Bachelor's degree in an engineering, math, or science discipline
- 1+ years of experience with thermal or mechanical modeling and testing in an industry or academic setting
PREFERRED SKILLS AND EXPERIENCE:
- Bachelor's in mechanical engineering, materials science, aerospace engineering, physics, applied mathematics, or other STEM discipline
- Advanced degree in an engineering, math, or science discipline
- Experience with board-level thermal testing and characterization using thermocouple mapping, power dissipation testing, or infrared thermography
- Experience using finite element analysis or thermal simulation tools such as ANSYS, Abaqus, COMSOL, Flotherm, or Icepak
- Experience with 3D and reduced-order thermal and mechanical modeling
- Experience correlating simulation models with physical test data
- Experience in simulation and characterization of IC packaging thermal resistance parameters
- Proficiency in Python or MATLAB for data analysis and post-processing
- Background in semiconductor packaging or high-reliability electronics environments
- Experience working in a fast-paced, high-volume manufacturing or new product introduction setting
ADDITIONAL REQUIREMENTS:
- Ability to work extended hours or weekends as needed for mission critical deadlines
About SpaceX
Sourced by ZipRecruiter
Industry
Aerospace product and parts manufacturing, data services, guided missile and space vehicle manufacturing and satellite telecommunications
Company size
1,001 - 5,000 Employees
Headquarters location
Hawthorne, CA, US