1

Qfn Jobs (NOW HIRING)

Design using BGA, QFN, and other high-density packages. * Responsible for all relevant design documentation. Knowledge, Skills and Abilities * Must have familiarity with DxDesigner and PADS Power PCB ...

Experience with X‑ray inspection (BGA, QFN analysis). * Experience performing First Article Inspections to AS9102 format (if applicable). * Familiarity with ISO 9001 or related quality management ...

RF Hardware Engineer

Los Angeles, CA · On-site

$130K - $180K/yr

Solid experience soldering and reworking boards (0402 SMP components, QFN packages) * Experience performing communications link modeling and solid understanding of DSP fundamentals * Knowledge of ...

Solid experience soldering and reworking boards (0402 SMP components, QFN packages) * Experience performing communications link modeling and solid understanding of DSP fundamentals * Knowledge of ...

Rework Technician

Windsor, CT · On-site

$22 - $25/hr

Remove and replace BGA, LGA, QFN, and fine-pitch components Operate BGA rework stations, soldering equipment, hot air tools, and microscopes * Inspection of BGA/LGA rework using x-ray equipment.

RF Hardware Engineer

Los Angeles, CA · On-site

$130K - $180K/yr

Solid experience soldering and reworking boards (0402 SMP components, QFN packages) * Experience performing communications link modeling and solid understanding of DSP fundamentals * Knowledge of ...

Under fill components including but not limited to BGA, Connectors, QFN's, fine-pitch parts, quats parts About BAE Systems Electronic Systems BAE Systems, Inc. is a defense, aerospace, and security ...

Showing results 41-60

Qfn information

See salary details

$37K

$79.5K

$112K

How much do qfn jobs pay per year?

As of Sep 13, 2026, the average yearly pay for qfn in the United States is $79,480.00, according to ZipRecruiter salary data. Most workers in this role earn between $60,000.00 and $92,000.00 per year, depending on experience, location, and employer.

What are QFN packages?

QFN stands for Quad Flat No-lead, which is a type of surface-mount integrated circuit package. QFN packages are small, lightweight, and have no leads extending from the sides, making them ideal for applications where space and thermal performance are important. They feature a flat, exposed pad on the bottom for improved heat dissipation and electrical grounding. QFN packages are commonly used in consumer electronics, automotive systems, and communication devices.

What are common challenges faced by professionals working with QFN (Quad Flat No-Lead) packages in electronics manufacturing?

Professionals working with QFN packages often encounter challenges related to soldering and inspection due to the package's leadless design and exposed thermal pad. Ensuring reliable solder joints can be complex, as the connections are located underneath the component and are not visible after placement, making process control and X-ray inspection critical. Additionally, achieving proper thermal management and preventing voids during reflow soldering require attention to paste application and reflow profiles. Close collaboration with PCB designers, process engineers, and quality assurance teams is essential to address these challenges and ensure high assembly yields.

What are the key skills and qualifications needed to thrive as a QFN process engineer, and why are they important?

To thrive as a QFN Process Engineer, you need a solid background in materials science, semiconductor manufacturing processes, and quality control, typically supported by an engineering degree in a related field. Experience with equipment such as wire bonders, die attach machines, and statistical process control (SPC) software is often required. Strong problem-solving skills, attention to detail, and effective communication are essential soft skills for collaborating with cross-functional teams and resolving production issues. These skills ensure efficient production, high product quality, and continuous improvement in the fast-paced semiconductor packaging environment.

What is the difference between Qfn vs PCB Designer?

AspectQfnPCB Designer
Required credentialsTechnical certifications, electronics knowledgeElectrical engineering or related degree, CAD software skills
Work environmentElectronics manufacturing, assembly linesDesign offices, engineering teams
Industry usageElectronics manufacturing, component assemblyElectronics, telecommunications, consumer devices
Common search intentUnderstanding manufacturing roles, component assemblyDesigning PCBs, layout, and schematic work

Qfn (Quad Flat No-Lead) refers to a type of surface-mount package for integrated circuits, while PCB Designer focuses on creating printed circuit board layouts. The two roles are related but serve different functions: Qfn pertains to specific component packaging, whereas PCB Designer involves designing the entire circuit board that may include Qfn components. Both roles require electronics knowledge and often overlap in electronics manufacturing and design industries.

More about Qfn jobs

What cities are hiring for Qfn jobs?

Cities with the most Qfn job openings:

What states have the most Qfn jobs?

States with the most job openings for Qfn jobs include:

Infographic showing various Qfn job openings in the United States as of September 2026, with employment types broken down into 93% Full Time, and 7% Nights. Highlights an 100% Physical job distribution, with an average salary of $79,480 per year, or $38.2 per hour.

Process Development Engineer - SMT/PCB Assembly/Packaging

Richardson, TX • On-site

Qorvo, Inc.
Manufacturing • 5 - 10K employees

Full-time

Re-posted 7 days ago


Qorvo rating

8.3

Company rating: 8.3 out of 10

Based on 21 frontline employees who took The Breakroom Quiz


Job description

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.
RESPONSIBILITIES:
  • Develop and optimize SMT, semiconductor packaging, and advanced assembly processes.
  • Support both volume production as well as New Product Introduction (NPI) production.
  • Support manufacturing for surface mount electronics (SMT), Flip Chip Attach and Die Attach.
  • Lead process characterization, DOE execution, and process window development
  • Evaluate new equipment, processes, and materials.
  • Generating post build/DFM report.
  • Take 5S/process improvement initiatives.
  • Monitor Product Yields daily and work with appropriate engineers to take corrective actions.
  • Work with Fixturing vendors to design and support assembly in the factory.
  • Mentor technicians and operators on process control and best practices.
  • Develop process documentation, work instructions, control plans, and manufacturing standards.

QUALIFICATIONS:
  • BS in Mechanical, Electrical, Manufacturing, Material engineering degree or related discipline; MS degree preferred.
  • 2+ years industry experience required or postgraduate degree accepted in lieu of industry experience
  • Relevant industry internship experience desired.
  • Strong Semiconductor Assembly experience with High density of fine pitch components - BGA, LGA, QFN, 0201, 01005 components, etc
  • 1-2 years of experience in a mid to high-volume manufacturing environment preferred
  • Experience with reflow, pick and place and solder paste printing is preferred
  • Experience with SPC techniques and Lean practices is preferred
  • Knowledge of IPC-A-610 standard preferred

DESIRED SKILLS:
  • Strong technical leadership
  • Excellent communication skills
  • Project management capability
  • Cross-functional collaboration
  • Continuous improvement mindset

This position is not eligible for visa sponsorship by the Company.
#LI-KR1
MAKE A DIFFERENCE AT QORVO
We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets - we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.
We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.
Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.

What Qorvo employees say

Pay

Benefits

Hours and flexibility

Workplace

Get the full story on Breakroom