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Qfn Jobs in Ohio (NOW HIRING)

Design boards utilizing SMT, through-hole, BGA, QFN, and other high-density component packages. * Generate assembly drawings, fabrication packages, bills of materials (BOMs), and supporting ...

Machine Operator

Columbus, OH · On-site

$16.50 - $19.50/hr

Utilize X-ray function to verify proper placement and quality of solder joints on BGA/QFN parts * Tear down and restore parts to inventory upon job completion * Create new printer programs and teach ...

PWB Designer

West Chester, OH · On-site

$95K - $110K/yr

Design using BGA, QFN, and other high-density packages. * Responsible for all relevant design documentation. Knowledge, Skills and Abilities: * Must have familiarity with DxDesigner and PADS Power ...

Design using BGA, QFN, and other high-density packages. * Responsible for all relevant design documentation. Knowledge, Skills and Abilities: * Must have familiarity with DxDesigner and PADS Power ...

Design using BGA, QFN, and other high-density packages. * Responsible for all relevant design documentation. Knowledge, Skills and Abilities: * Must have familiarity with DxDesigner and PADS Power ...

Design using BGA, QFN, and other high-density packages. * Responsible for all relevant design documentation. Knowledge, Skills and Abilities: * Must have familiarity with DxDesigner and PADS Power ...

Design using BGA, QFN, and other high-density packages. * Responsible for all relevant design documentation. Knowledge, Skills and Abilities: * Must have familiarity with DxDesigner and PADS Power ...

Qfn information

What are QFN packages?

QFN stands for Quad Flat No-lead, which is a type of surface-mount integrated circuit package. QFN packages are small, lightweight, and have no leads extending from the sides, making them ideal for applications where space and thermal performance are important. They feature a flat, exposed pad on the bottom for improved heat dissipation and electrical grounding. QFN packages are commonly used in consumer electronics, automotive systems, and communication devices.

What are common challenges faced by professionals working with QFN (Quad Flat No-Lead) packages in electronics manufacturing?

Professionals working with QFN packages often encounter challenges related to soldering and inspection due to the package's leadless design and exposed thermal pad. Ensuring reliable solder joints can be complex, as the connections are located underneath the component and are not visible after placement, making process control and X-ray inspection critical. Additionally, achieving proper thermal management and preventing voids during reflow soldering require attention to paste application and reflow profiles. Close collaboration with PCB designers, process engineers, and quality assurance teams is essential to address these challenges and ensure high assembly yields.

What are the key skills and qualifications needed to thrive as a QFN process engineer, and why are they important?

To thrive as a QFN Process Engineer, you need a solid background in materials science, semiconductor manufacturing processes, and quality control, typically supported by an engineering degree in a related field. Experience with equipment such as wire bonders, die attach machines, and statistical process control (SPC) software is often required. Strong problem-solving skills, attention to detail, and effective communication are essential soft skills for collaborating with cross-functional teams and resolving production issues. These skills ensure efficient production, high product quality, and continuous improvement in the fast-paced semiconductor packaging environment.

What is the difference between Qfn vs PCB Designer?

AspectQfnPCB Designer
Required credentialsTechnical certifications, electronics knowledgeElectrical engineering or related degree, CAD software skills
Work environmentElectronics manufacturing, assembly linesDesign offices, engineering teams
Industry usageElectronics manufacturing, component assemblyElectronics, telecommunications, consumer devices
Common search intentUnderstanding manufacturing roles, component assemblyDesigning PCBs, layout, and schematic work

Qfn (Quad Flat No-Lead) refers to a type of surface-mount package for integrated circuits, while PCB Designer focuses on creating printed circuit board layouts. The two roles are related but serve different functions: Qfn pertains to specific component packaging, whereas PCB Designer involves designing the entire circuit board that may include Qfn components. Both roles require electronics knowledge and often overlap in electronics manufacturing and design industries.

What job categories do people searching Qfn jobs in Ohio look for?

The top searched job categories for Qfn jobs in Ohio are:

What cities in Ohio are hiring for Qfn jobs?

Cities in Ohio with the most Qfn job openings:

Infographic showing various Qfn job openings in Ohio as of August 2026, with employment types broken down into 84% Full Time, 13% Contract, and 3% Nights. Highlights an 97% Physical, and 3% Hybrid job distribution.

PCB Layout Designer

Belcan

Middletown, OH

$34 - $50/hr

Contractor

Re-posted 3 days ago


Job description

Job Title: PCB Layout Designer
Pay Rate: $34 - $50/hr
Job Type: Contract-to-Hire
Location: Middletown, OH
Schedule: Monday - Friday
#PCBDesigner #PCBLayout #Cadence #AllegroDesigner #OrCAD #RFEngineering #DefenseIndustry #ElectronicsDesign
Job Summary:
We are seeking a PCB Layout Designer to support the design and development of advanced RF, Microwave, Analog, Digital, and Mixed-Signal circuit boards for Department of Defense (DoD) applications. This role will work closely with electrical and mechanical engineering teams to develop high-quality printed circuit board layouts using Cadence design tools while supporting product development from concept through production.
The ideal candidate will have experience with PCB layout design, schematic capture, component library creation, and PCB manufacturing processes. This position offers the opportunity to contribute to cutting-edge RF and microwave technologies that support critical defense programs.
Job Responsibilities:
* Design RF/Microwave, analog, digital, and mixed-signal printed circuit boards using Cadence design tools.
* Develop PCB layouts to support new product development and product enhancements.
* Create and maintain schematic symbols, PCB footprints, and component libraries.
* Design boards utilizing SMT, through-hole, BGA, QFN, and other high-density component packages.
* Generate assembly drawings, fabrication packages, bills of materials (BOMs), and supporting manufacturing documentation.
* Collaborate with electrical and mechanical engineers to establish physical and electrical design parameters.
* Interpret schematics, engineering requirements, and technical specifications to produce accurate PCB layouts.
* Work directly with PCB manufacturers and assemblers to resolve design, fabrication, and production issues.
* Support design reviews, engineering change requests, and PCB revision activities.
* Assist with quality control activities to ensure designs meet product performance and reliability requirements.
* Participate in continuous improvement initiatives focused on reducing lead times and improving engineering efficiency.
* Support documentation updates and proposed engineering changes related to PCB designs.
* Operate within an AS9100 quality management system and follow established engineering processes and procedures.
* Manage multiple projects and priorities while maintaining quality and schedule commitments.
Required Qualifications:
* Associate degree, technical degree, specialty school training, or equivalent combination of education and experience.
* Must have experience with one or more; OrCAD Capture CIS, OrCAD PCB Editor, Allegro PCB Designer.
* Experience with PCB layout and schematic capture.
* Proficiency creating schematic symbols and PCB footprints.
* Ability to interpret engineering drawings, schematics, and technical specifications.
* Strong attention to detail and organizational skills.
* Ability to manage multiple projects and deadlines simultaneously.
* Strong written and verbal communication skills.
* Proficiency with Microsoft Office applications.
* Ability to work independently as well as within a collaborative engineering team environment.
* U.S. Citizenship is required.
Preferred Qualifications:
* 3+ years of experience using Cadence PCB design tools, including: OrCAD Capture CIS, OrCAD PCB Editor, Allegro PCB Designer.
* Experience designing RF/Microwave circuit boards.
* Experience with high-density PCB layouts using BGA, QFN, and other advanced packaging technologies.
* Experience supporting Aerospace and Defense electronics programs.
* Familiarity with PCB manufacturing, assembly, and design-for-manufacturing (DFM) principles.
* Experience working within AS9100 or other regulated quality management systems.
If you are interested in this role, please apply via the apply now link provided. Our overriding goal is to provide quality staffing solutions that help people, organizations, and communities succeed. Belcan is a leading provider of qualified personnel to many of the world's most respected enterprises. We offer excellent opportunities for contract, temporary, temp-to-hire, and direct assignments. We are the employer of choice for thousands worldwide. For more information, please visit our website at Belcan.com
Belcan is an equal opportunity employer. Your application and candidacy will not be considered based on race, color, sex, religion, creed, sexual orientation, gender identity, national origin, disability, genetic information, pregnancy, veteran status or any other characteristic protected by federal, state or local laws.

Belcan logo

About Belcan

Sourced by ZipRecruiter

Belcan is a leading provider of qualified personnel to many of the world's most respected enterprises. We offer excellent opportunities for contract/temporary, temp-to-hire, and direct assignments in the engineering, IT, and professional fields. We are the employer of choice for thousands worldwide. Our overriding goal is to provide quality staffing solutions that help people, organizations, and communities succeed.

Industry

It services

Company size

5,001 - 10,000 Employees

Headquarters location

Cincinnati, OH, US

Year founded

1958