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Qfn Jobs (NOW HIRING)

Qorvo, Inc.

Engineering Technician

Greensboro, NC

Hand solder components as small as 0402, QFN, using microscope. QUALIFICATIONS: * Associates degree in a technical field or equivalent military training * 1+ years of experience in an engineering lab ...

LSI Industries, Inc.

Machine Operator

Columbus, OH · On-site

$16.50 - $19.50/hr

Utilize X-ray function to verify proper placement and quality of solder joints on BGA/QFN parts * Tear down and restore parts to inventory upon job completion * Create new printer programs and teach ...

Glassboard, LLC

Senior Electrical Engineer

Indianapolis, IN · On-site

$102K - $133K/yr

... QFN, BGA) - Engineering team management - Project management Desired Skills - Schematic capture and layout experience in Altium Designer: multi-layer (6+), LVDS, USB, high speed, HDI, and flex-rigid ...

AnySignal LLC

Senior RF Hardware Engineer

Los Angeles, CA · On-site

$160K - $220K/yr

Solid experience soldering and reworking boards (0402 SMP components, QFN packages) * Experience performing communications link modeling and solid understanding of DSP fundamentals * Knowledge of ...

AnySignal

RF Hardware Engineer

Los Angeles, CA · On-site

$130K - $180K/yr

Solid experience soldering and reworking boards (0402 SMP components, QFN packages) * Experience performing communications link modeling and solid understanding of DSP fundamentals * Knowledge of ...

The Structures Company

SMT Assembler

Oldsmar, FL · On-site

$23 - $26/hr

Strong knowledge of SMT component types (0201-1206, QFN, BGA, CSP, FCBGA). * Experience with inspection tools (microscopes, AOI, SPI) and defect identification. * Experience with mixed technology ...

Glassboard, LLC

Senior Electrical Engineer

Indianapolis, IN · On-site

$102K - $133K/yr

... QFN, BGA) - Engineering team management - Project management Desired Skills - Schematic capture and layout experience in Altium Designer: multi-layer (6+), LVDS, USB, high speed, HDI, and flex-rigid ...

K2 Space

Senior PCBA Rework Technician

Los Angeles, CA

$38 - $48/hr

Proficiency with basic tools: soldering irons, hot air tools, and component handling for 0201, 0402, and BGA/QFN packages * Experience with reballing and reworking fine-pitch BGAs * Demonstrated ...

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Qfn information

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$37K

$79.5K

$112K

How much do qfn jobs pay per year?

As of Aug 22, 2026, the average yearly pay for qfn in the United States is $79,480.00, according to ZipRecruiter salary data. Most workers in this role earn between $60,000.00 and $92,000.00 per year, depending on experience, location, and employer.

What are QFN packages?

QFN stands for Quad Flat No-lead, which is a type of surface-mount integrated circuit package. QFN packages are small, lightweight, and have no leads extending from the sides, making them ideal for applications where space and thermal performance are important. They feature a flat, exposed pad on the bottom for improved heat dissipation and electrical grounding. QFN packages are commonly used in consumer electronics, automotive systems, and communication devices.

What are common challenges faced by professionals working with QFN (Quad Flat No-Lead) packages in electronics manufacturing?

Professionals working with QFN packages often encounter challenges related to soldering and inspection due to the package's leadless design and exposed thermal pad. Ensuring reliable solder joints can be complex, as the connections are located underneath the component and are not visible after placement, making process control and X-ray inspection critical. Additionally, achieving proper thermal management and preventing voids during reflow soldering require attention to paste application and reflow profiles. Close collaboration with PCB designers, process engineers, and quality assurance teams is essential to address these challenges and ensure high assembly yields.

What are the key skills and qualifications needed to thrive as a QFN process engineer, and why are they important?

To thrive as a QFN Process Engineer, you need a solid background in materials science, semiconductor manufacturing processes, and quality control, typically supported by an engineering degree in a related field. Experience with equipment such as wire bonders, die attach machines, and statistical process control (SPC) software is often required. Strong problem-solving skills, attention to detail, and effective communication are essential soft skills for collaborating with cross-functional teams and resolving production issues. These skills ensure efficient production, high product quality, and continuous improvement in the fast-paced semiconductor packaging environment.

What is the difference between Qfn vs PCB Designer?

AspectQfnPCB Designer
Required credentialsTechnical certifications, electronics knowledgeElectrical engineering or related degree, CAD software skills
Work environmentElectronics manufacturing, assembly linesDesign offices, engineering teams
Industry usageElectronics manufacturing, component assemblyElectronics, telecommunications, consumer devices
Common search intentUnderstanding manufacturing roles, component assemblyDesigning PCBs, layout, and schematic work

Qfn (Quad Flat No-Lead) refers to a type of surface-mount package for integrated circuits, while PCB Designer focuses on creating printed circuit board layouts. The two roles are related but serve different functions: Qfn pertains to specific component packaging, whereas PCB Designer involves designing the entire circuit board that may include Qfn components. Both roles require electronics knowledge and often overlap in electronics manufacturing and design industries.

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Qfn jobs near you
Infographic showing various Qfn job openings in the United States as of August 2026, with employment types broken down into 81% Full Time, 12% Contract, and 7% Nights. Highlights an 98% Physical, and 2% Remote job distribution, with an average salary of $79,480 per year, or $38.2 per hour.

Senior/Staff Quality Assurance Engineer or Manager (OSAT)

Doist

San Jose, CA • On-site

$120 - $170/hr

Other

This job post has expired today. Applications are no longer accepted.

Job description

# Senior/Staff Quality Assurance Engineer or Manager (OSAT)Lumilens • San Jose, CA • • 2h agoSave this role or tell us whether you want more jobs like it.## **Core Responsibilities:****Quality Management*** Design, monitor and maintain the overall quality standards for semiconductor assembly and test processes.* Develop and maintain quality documentation, including Control Plans, PFMEA, Process Flow Charts, incoming & outgoing Quality requirements and Work Instructions.* Ensure compliance with customer, industry, internal quality requirements, as well relevant ISO (such as ISO9001).**Problem Solving & Failure Analysis*** Lead root cause analysis (RCA) using 8D, 3x5 Why, Fishbone, and other quality tools.* Drive corrective and preventive actions (CAPA) for quality excursions and customer complaints.* Support failure analysis activities and coordinate with engineering teams for resolution.**Process Control & Improvement*** Monitor process capability using SPC methodologies.* Analyse yield, defect trends, and reliability data.* Lead continuous improvement projects to reduce defects and improve yield performance.**Supplier & Customer Quality*** Support supplier audits and qualification activities.* Interface with OSAT partners, customers, and internal stakeholders regarding quality issues at OSAT.* Manage the change control request review and approval, related to materials, processes, and equipment.**Audits & Compliance*** Conduct internal and external quality audits.* Support customer audits and certification activities.* Ensure compliance with QMS, ISO 9001, (16949), JEDEC, and customer-specific requirements where applicable.## **Required Qualifications*** Bachelor's Degree in Electrical Engineering, Electronics Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or related field.* 5+ years of semiconductor assembly and test Quality experience, preferably in OSAT, or IDMs.* Knowledge of semiconductor packaging technologies such as Flip Chip, BGA, QFN, WLCSP – bumping, fan-out, back-grind, wafer saw, 2.5D/interposer assembly. Wafer & Final Test quality experience is an added advantage.* **Technical Skills:** + Statistical Process Control (SPC) + Failure Analysis (FA) + FMEA / PFMEA + CAPA + 8D Problem Solving + DOE (Design of Experiments) + Yield Analysis & Defect Reduction + Reliability Engineering + QMS - ISO 9001, IATF 16949 + Minitab, JMP, Excel, SQL (preferred)## **Preferred Skills*** Strong analytical and troubleshooting skills.* Excellent communication and presentation abilities.* Experience working with OSAT subcontractors and cross-functional teams.* Ability to manage multiple projects and drive quality improvements independently. #J-18808-Ljbffr

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