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Process Td Engineer Intel Jobs (NOW HIRING)

Senior Thin Films Engineer

Phoenix, AZ

$54.75 - $70.75/hr

... TD) andHigh-VolumeManufacturing (HVM), advancing technology nodes and process capability ... Join Intel's Manufacturing Development and Customer Engineering (MDCE) team as a Senior Engineer ...

Senior Thin Films Engineer

Hillsboro, OR

$60.25 - $77.50/hr

... TD) andHigh-VolumeManufacturing (HVM), advancing technology nodes and process capability ... Join Intel's Manufacturing Development and Customer Engineering (MDCE) team as a Senior Engineer ...

Senior Foundry Device Engineer

Phoenix, AZ

$103K - $142K/yr

Our mission is to effectively bridge the transition from Technology Development (TD) to High Volume ... Intel's existing manufacturing processes and platforms. * Demonstrated expertise in CMOS ...

Senior Thin Films Engineer

Hillsboro, OR · On-site

$113K - $156K/yr

We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM ... a Senior Engineer driving process innovation across Intel's most advanced semiconductor ...

Senior Foundry Device Engineer

Phoenix, AZ · On-site

$103K - $142K/yr

Our mission is to effectively bridge the transition from Technology Development (TD) to High Volume ... Intel's existing manufacturing processes and platforms. * Demonstrated expertise in CMOS ...

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Process TD Engineer Intel information

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$49.5K

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How much do process td engineer intel jobs pay per year?

As of Jul 16, 2026, the average yearly pay for process td engineer intel in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What is a Process TD Engineer at Intel?

A Process TD (Technology Development) Engineer at Intel is responsible for developing and optimizing semiconductor manufacturing processes for next-generation technologies. They work in research and development to improve process efficiency, yield, and performance in high-volume production. This role involves data analysis, experimentation, and collaboration with cross-functional teams to drive innovation in chip manufacturing. Process TD Engineers often specialize in areas like lithography, etching, or thin films to refine Intel’s manufacturing capabilities.

What are the key skills and qualifications needed to thrive in the Process Td Engineer Intel position, and why are they important?

To thrive as a Process TD Engineer at Intel, you need a solid background in materials science, chemical engineering, or a related field, typically with at least a bachelor’s or master’s degree. Familiarity with semiconductor fabrication tools, process control systems, statistical analysis software (such as JMP or Matlab), and possibly Six Sigma certification is highly valued. Strong problem-solving skills, effective communication, and the ability to collaborate across multidisciplinary teams set high performers apart. These competencies are crucial for driving innovations, optimizing manufacturing processes, and ensuring the high-yield production of advanced semiconductor products.

What are the typical collaborative interactions for a Process TD Engineer at Intel?

As a Process TD Engineer at Intel, you will regularly collaborate with cross-functional teams, such as equipment engineering, product development, and manufacturing operations, to implement process improvements and resolve technical challenges. Many projects require close coordination with research scientists and yield enhancement groups to troubleshoot issues and ensure process stability. This collaborative environment fosters continuous learning and allows team members to share expertise in order to optimize processes and drive successful product launches. Working together effectively is key to achieving Intel’s high standards for quality and innovation.

More about Process TD Engineer Intel jobs
What cities are hiring for Process Td Engineer Intel jobs? Cities with the most Process Td Engineer Intel job openings:
What are the most commonly searched types of Process Td Engineer Intel jobs? The most popular types of Process Td Engineer Intel jobs are:
What states have the most Process Td Engineer Intel jobs? States with the most job openings for Process Td Engineer Intel jobs include:
Infographic showing various Process Td Engineer Intel job openings in the United States as of July 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution, with an average salary of $92,018 per year, or $44.2 per hour.
Senior Thin Films Engineer

Senior Thin Films Engineer

Intel

Phoenix, AZ

$54.75 - $70.75/hr

Full-time

Medical, Retirement, PTO

Posted 7 days ago


Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

11th of 142 rated electronics manufacturers


Job description

Job Details:Job Description: 

Organization Overview:Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) andHigh-VolumeManufacturing (HVM), advancing technology nodes and process capability frominitialproduct qualification to high-yield production across multiple products while enhancing technologies for our foundry customers.

About This Role:Join Intel's Manufacturing Development and Customer Engineering (MDCE) team as a Senior Engineer driving process innovation across Intel's most advanced semiconductor technologies in volume manufacturing. You will spearhead the development, optimization, and manufacturability of critical thin film deposition processes, ensuring seamless transitions from early development to high-volume production while meeting Intel foundry customer requirements.

Your Mission:Lead thin film process excellence across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and/or treatment technologies. Operating at the nexus of Technology Development and High-Volume Manufacturing, you will drive breakthrough solutions for Intel 18A, Intel 3, 12nm, and next-generation technology nodes.

Key Responsibilities

Process Innovation & Excellence

  • Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules
  • Drive defectivity reduction and uniformity improvements through systematic process enhancement
  • Lead technical problem resolution and deliver solutions that meet aggressive technology node targets
  • Optimize equipment performance working with internal teams and key suppliers

Strategic Technical Leadership

  • Align technical vision with customer requirements and business objectives
  • Synthesize complex technical data to formulate and execute strategic responses
  • Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines
  • Deliver rapid execution of innovative solutions to meet challenging development timelines

Cross-Functional Partnership

  • Collaborate closely with Technology Development, High Volume Manufacturing, and Business Groups
  • Build strong relationships with Integration, Device, Yield, Quality, Reliability teams, and external suppliers
  • Present technical findings effectively to diverse audiences from engineering teams to executive leadership
  • Foster in-person collaboration to accelerate decision-making and problem resolution

Industry Leadership

  • Stay current with semiconductor industry trends and emerging process technologies
  • Drive strategic initiatives that position Intel at the forefront of manufacturing innovation
  • Contribute to technology roadmaps through hands-on technical expertise and market insight

What We're Looking For

Technical Excellence

  • Results-driven professional with exceptional technical problem-solving abilities
  • Proven track record of significant accomplishments across multiple technology nodes
  • Strong analytical skills with expertise in yield improvement, performance enhancement, and variation reduction
  • Deep understanding of semiconductor manufacturing strategies, fab operations, and technology transfer

Leadership Capabilities

  • Outstanding communication skills for presenting complex technical information to varied audiences
  • Self-motivated with strong initiative and ability to navigate ambiguous technical challenges
  • Demonstrated ability to manage multiple high-priority projects under pressure while maintaining quality focus
  • Experience driving clarity in complex technical situations and leading cross-functional initiatives

Industry Expertise

  • Comprehensive knowledge of process development, materials science, and device physics
  • Ability to interpret industry trends and translate market dynamics into actionable technical strategies
  • Experience with foundry business models and customer engagement requirements
  • Proven capability to work independently while managing diverse technical assignments
Qualifications:

Minimum Qualifications

  • Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field
  • 5+ years semiconductor industry experience with strong focus on thin film deposition processes
  • Proven experience in process development, technical leadership, and manufacturing engineering
  • Extensive background working with equipment suppliers (AMAT, LAM, ASM, TEL) on process optimization
  • Comprehensive fab startup experience across manufacturing, quality, RandD, and supply chain functions
  • Proficiency with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems

Preferred Qualifications

  • Doctoral degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field with research publications and patent portfolio in thin film technologies
  • Expertise in Gate All Around (GAA) logic technologies within semiconductor foundry environments
  • Proven track record delivering customized solutions across Technology Development and HVM organizations
  • Cross-functional leadership experience managing diverse stakeholder groups
  • Semiconductor foundry experience
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:US, Arizona, PhoenixBusiness group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968