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Process Td Engineer Intel Jobs (NOW HIRING)

Solidigm

Process TD Engineer

Rancho Cordova, CA · On-site

$138.56K - $221.70K/yr

Process & Technology Development * Develop and implement rework solutions and techniques for SSD ... Materials Engineering with 5+ years of relevant experience; or Master's degree in the above ...

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How much do process td engineer intel jobs pay per year?

As of May 31, 2026, the average yearly pay for process td engineer intel in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What is a Process TD Engineer at Intel?

A Process TD (Technology Development) Engineer at Intel is responsible for developing and optimizing semiconductor manufacturing processes for next-generation technologies. They work in research and development to improve process efficiency, yield, and performance in high-volume production. This role involves data analysis, experimentation, and collaboration with cross-functional teams to drive innovation in chip manufacturing. Process TD Engineers often specialize in areas like lithography, etching, or thin films to refine Intel’s manufacturing capabilities.

What are the key skills and qualifications needed to thrive in the Process Td Engineer Intel position, and why are they important?

To thrive as a Process TD Engineer at Intel, you need a solid background in materials science, chemical engineering, or a related field, typically with at least a bachelor’s or master’s degree. Familiarity with semiconductor fabrication tools, process control systems, statistical analysis software (such as JMP or Matlab), and possibly Six Sigma certification is highly valued. Strong problem-solving skills, effective communication, and the ability to collaborate across multidisciplinary teams set high performers apart. These competencies are crucial for driving innovations, optimizing manufacturing processes, and ensuring the high-yield production of advanced semiconductor products.

What are the typical collaborative interactions for a Process TD Engineer at Intel?

As a Process TD Engineer at Intel, you will regularly collaborate with cross-functional teams, such as equipment engineering, product development, and manufacturing operations, to implement process improvements and resolve technical challenges. Many projects require close coordination with research scientists and yield enhancement groups to troubleshoot issues and ensure process stability. This collaborative environment fosters continuous learning and allows team members to share expertise in order to optimize processes and drive successful product launches. Working together effectively is key to achieving Intel’s high standards for quality and innovation.
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Process Td Engineer Intel jobs near you
Infographic showing various Process Td Engineer Intel job openings in the United States as of May 2026, with employment types broken down into 2% Locum Tenens, 1% Full Time, 94% Part Time, and 3% Temporary. Highlights an 100% Hybrid job distribution, with an average salary of $92,018 per year, or $44.2 per hour.
Process TD Engineer

Process TD Engineer

Solidigm

Rancho Cordova, CA • On-site

$138.56K - $221.70K/yr

Full-time

Posted 21 days ago

Job description

Company Description
Join a multibillion-dollar global company that brings together amazing technology, people, and operational scale to become a powerhouse in the memory industry. Headquartered in Rancho Cordova, California, Solidigm combines elements of an established, successful technology company with the spirit, agility, and entrepreneurial mindset of a start-up. In addition to the U.S. headquarters and other facilities in the U.S., the company has international presence in Asia, Europe, and the Americas. Solidigm will continue to lead the world in innovating new Memory technologies with aspirations to be the #1 NAND memory company in the world. At Solidigm, we view problems as opportunities to define innovative solutions that hold the power to change the world and unleash the potential technological needs that the future holds. At Solidigm, we are One Team that fosters a diverse, equitable, and inclusive culture that embraces individual uniqueness and empowers us to bring our best selves to deliver excellence in support of Solidigm's vision and mission to be the go-to partner for optimized data storage solutions. You can be part of the takeoff of an innovative business that develops cutting-edge products, delivers strong business value for customers, provides an engaging workplace for its employees, and serves a greater impact on the world. This is a golden opportunity for the right applicant to join us and help design, build, and lead Solidigm. We want a diverse team of dedicated professionals who will not just be Solidigm team members but contribute to how we shape the future of the organization. We are seeking applicants who will grow and thrive in our culture; be customer inspired, trusting, innovative, team-oriented, inclusive, results driven, collaborative, passionate, and flexible.
Job Description
Key Responsibilities
Simulation and Analysis:
  • Perform simulations using ANSYS to predict mechanical behavior
  • Analyze stress, strain, and failures in components and assemblies under environmental and operational conditions.
  • Analyze stress, strain, and failures in SSD rework and disassembly condition

New Product Introduction (NPI) Development
  • Define and establish SSD manufacturing process flows, procedures, and equipment configurations for electronic modules.
  • Develop and characterize new assembly and rework processes for SSDs across multiple form factors.
  • Select, qualify, and develop materials and equipment to meet manufacturability, reliability, yield, and productivity targets. Create, validate, and document manufacturing recipes and process parameters for High Volume Manufacturing (HVM) transfer.

Process & Technology Development
  • Develop and implement rework solutions and techniques for SSD modules, including PCBA component replacement and product disassembly.
  • Continuously explore and validate new rework techniques to support evolving SSD technologies and complex designs. Perform process data analysis, risk assessment (TRA), and implement process controls throughout the Product Life Cycle (PLC).
  • Support design for manufacturability and assembly (DFM/DFA) reviews and provide feedback to product development and cross-functional teams.

Cross-Functional Collaboration
  • Work closely with design, quality, planning, commercial, and supply chain teams to ensure seamless NPI to HVM transition and production ramp-up.
  • Collaborate with ODMs and suppliers to explore and develop advanced manufacturing and rework technologies. Required Skills & Competencies
  • Strong understanding of electronics product design, system analysis, and manufacturing processes
  • Expertise in component-level manufacturing with a focus on process, materials, and new technique development.
  • Experience in process development, integration, and continuous improvement.
  • Proficiency in DFX (Design for Excellence) principles for PCB and mechanical assemblies.
  • Solid foundation in statistics and data-driven process control.
  • Excellent problem-solving, communication, and cross-functional collaboration skills.

Qualifications
Education & Experience
Bachelor's degree in Electrical, Mechanical, Automation, or Materials Engineering with 5+ years of relevant experience; or Master's degree in the above disciplines with 3+ years of experience.
Additional Information
The compensation range for this role is $138,560 - $221,700. Actual compensation is influenced by a variety of factors including but not limited to skills, experience, qualifications, and geographic location.
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