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Process Td Engineer Intel Jobs (NOW HIRING)

Company Description We are seeking a highly skilled Mechanical Engineering professional with strong expertise in simulation and process development to join our team supporting next-generation SSD ...

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Process Td Engineer Intel information

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$49.5K

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$142.5K

How much do process td engineer intel jobs pay per year?

As of Aug 23, 2026, the average yearly pay for process td engineer intel in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What is a process TD engineer at Intel?

A Process TD (Technology Development) Engineer at Intel is responsible for developing and optimizing semiconductor manufacturing processes for next-generation technologies. They work in research and development to improve process efficiency, yield, and performance in high-volume production. This role involves data analysis, experimentation, and collaboration with cross-functional teams to drive innovation in chip manufacturing. Process TD Engineers often specialize in areas like lithography, etching, or thin films to refine Intel’s manufacturing capabilities.

What are the typical collaborative interactions for a process TD engineer at Intel?

As a Process TD Engineer at Intel, you will regularly collaborate with cross-functional teams, such as equipment engineering, product development, and manufacturing operations, to implement process improvements and resolve technical challenges. Many projects require close coordination with research scientists and yield enhancement groups to troubleshoot issues and ensure process stability. This collaborative environment fosters continuous learning and allows team members to share expertise in order to optimize processes and drive successful product launches. Working together effectively is key to achieving Intel’s high standards for quality and innovation.

What are the key skills and qualifications needed to thrive in the process TD engineer Intel position, and why are they important?

To thrive as a Process TD Engineer at Intel, you need a solid background in materials science, chemical engineering, or a related field, typically with at least a bachelor’s or master’s degree. Familiarity with semiconductor fabrication tools, process control systems, statistical analysis software (such as JMP or Matlab), and possibly Six Sigma certification is highly valued. Strong problem-solving skills, effective communication, and the ability to collaborate across multidisciplinary teams set high performers apart. These competencies are crucial for driving innovations, optimizing manufacturing processes, and ensuring the high-yield production of advanced semiconductor products.

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Infographic showing various Process Td Engineer Intel job openings in the United States as of August 2026, with employment types broken down into 80% Full Time, and 20% Contract. Highlights an 100% In-person job distribution, with an average salary of $92,018 per year, or $44.2 per hour.

Process TD Engineer

Solidigm

Rancho Cordova, CA • On-site

Full-time

Re-posted 13 days ago


Job description

Company Description
Job Description
We are seeking a highly skilled Mechanical Engineering professional with strong expertise in simulation and process development to join our team supporting next-generation SSD product development and manufacturing.
This is a niche and high-impact role where you will combine mechanical simulation, engineering analysis, and process innovation to enable scalable, reliable, and manufacturable designs. You will play a critical role in bridging product design and high-volume manufacturing (HVM).
Key Responsibilities
Mechanical Simulation & Engineering Analysis (Core Focus)
  • Perform advanced mechanical simulations using ANSYS, SolidWorks, or equivalent tools
  • Analyze stress, strain, deformation, fatigue, and failure mechanisms in components and assemblies
  • Evaluate product performance under thermal, environmental, and operational conditions
  • Conduct simulations supporting SSD rework, disassembly, and structural integrity
  • Conduct simulation on semiconductor packaging and solder joint reliability
  • Develop simulation workflows to verify and validate design concepts.
  • Identify potential design risks and propose mitigation strategies during disassembly.
  • Translate simulation results into actionable design and process improvements

Process Development & New Product Introduction (NPI)
  • Define and develop end-to-end SSD manufacturing process flows, including tooling and equipment configurations
  • Lead process development, characterization, and qualification for new products
  • Establish and validate manufacturing recipes and parameters for HVM transfer

Rework Technology & Mechanical Solutions
  • Develop advanced rework techniques, including PCBA component replacement and product disassembly
  • Evaluate new approaches to support complex mechanical structures and miniaturized designs
  • Perform risk assessments (TRA) and implement process controls across the product lifecycle

DFM/DFA & Cross-Functional Collaboration
  • Provide strong mechanical input into DFM/DFA reviews
  • Collaborate with design, manufacturing, quality, and supply chain teams
  • Ensure smooth transition from design to NPI to high-volume production
  • Work closely with ODMs and suppliers on process and technology development

Qualifications
Education
  • Master's or PhD in Mechanical Engineering (strongly preferred)
  • Bachelor's degree with significant relevant experience may be considered

Experience
  • 3+ years (Master's) or 5+ years (Bachelor's) in:
    • Mechanical simulation and analysis
    • Process development, NPI, or manufacturing engineering
  • Experience in one or more of the following industries:
    • Semiconductor
    • Electronics or consumer devices
    • Automotive or precision manufacturing

Technical Expertise
  • Hands-on experience with:
    • ANSYS (preferred), SolidWorks, or similar simulation tools
  • Strong understanding of:
    • Structural mechanics (stress, strain, fatigue, failure analysis)
    • Mechanical behavior of components and assemblies
  • Experience in:
    • Manufacturing process development and integration
    • Rework or failure analysis in electronic assemblies
  • Familiarity with:
    • DFM/DFA principles (mechanical focus)
    • Statistical analysis and process control

Skills & Competencies
  • Strong analytical and problem-solving skills
  • Ability to translate simulation data into practical engineering solutions
  • Effective communication and cross-functional collaboration
  • Comfortable working in a fast-paced, global environment

Additional Information
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