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Process Td Engineer Intel Jobs (NOW HIRING)

As a Process TD Engineer, you will play a key role in developing, validating, and improving Solidigm's products and technologies by leveraging advanced simulation tools and methodologies to solve ...

At Intel, the Foundry Technology Development (TD) unit is the driving force behind Moore's Law ... each process technology node, paving the way for tomorrow's computing solutions. Your ...

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Process Td Engineer Intel information

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How much do process td engineer intel jobs pay per year?

As of Sep 14, 2026, the average yearly pay for process td engineer intel in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What is a process TD engineer at Intel?

A Process TD (Technology Development) Engineer at Intel is responsible for developing and optimizing semiconductor manufacturing processes for next-generation technologies. They work in research and development to improve process efficiency, yield, and performance in high-volume production. This role involves data analysis, experimentation, and collaboration with cross-functional teams to drive innovation in chip manufacturing. Process TD Engineers often specialize in areas like lithography, etching, or thin films to refine Intel’s manufacturing capabilities.

What are the typical collaborative interactions for a process TD engineer at Intel?

As a Process TD Engineer at Intel, you will regularly collaborate with cross-functional teams, such as equipment engineering, product development, and manufacturing operations, to implement process improvements and resolve technical challenges. Many projects require close coordination with research scientists and yield enhancement groups to troubleshoot issues and ensure process stability. This collaborative environment fosters continuous learning and allows team members to share expertise in order to optimize processes and drive successful product launches. Working together effectively is key to achieving Intel’s high standards for quality and innovation.

What are the key skills and qualifications needed to thrive in the process TD engineer Intel position, and why are they important?

To thrive as a Process TD Engineer at Intel, you need a solid background in materials science, chemical engineering, or a related field, typically with at least a bachelor’s or master’s degree. Familiarity with semiconductor fabrication tools, process control systems, statistical analysis software (such as JMP or Matlab), and possibly Six Sigma certification is highly valued. Strong problem-solving skills, effective communication, and the ability to collaborate across multidisciplinary teams set high performers apart. These competencies are crucial for driving innovations, optimizing manufacturing processes, and ensuring the high-yield production of advanced semiconductor products.

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Infographic showing various Process Td Engineer Intel job openings in the United States as of September 2026, with employment types broken down into 1% As Needed, 77% Full Time, 18% Part Time, 3% Contract, and 1% Nights. Highlights an 89% Physical, 2% Hybrid, and 9% Remote job distribution, with an average salary of $92,018 per year, or $44.2 per hour.

Process TD Engineer

Rancho Cordova, CA • On-site

Full-time

Re-posted 5 days ago


Job description

Company Description
Job Description
At Solidigm, we are committed to innovation, performance, and reliability in data storage and memory technology.
We are seeking a highly skilled and motivated Process TD Engineer (Mechanical Simulation) to join our dynamic manufacturing engineering team. The ideal candidate will have a strong background in simulation-based design verification, structural analysis, and thermal-mechanical modeling, specifically in the context of advanced mechanical systems and cutting-edge technologies.
As a Process TD Engineer, you will play a key role in developing, validating, and improving Solidigm's products and technologies by leveraging advanced simulation tools and methodologies to solve complex engineering problems. You will collaborate closely with cross-functional teams to ensure optimized performance, reliability, and manufacturability of our products.
Key Responsibilities
Structural and Thermal-Mechanical Analysis:
  • Contribute to design for manufacturing and assembly studies
  • Perform simulations using advanced tools to predict mechanical behavior (e.g., finite element analysis for structural integrity or heat dissipation).
  • Analyze stress, strain, and failures in components and assemblies under environmental and operational conditions.

Design Validation:
  • Develop simulation workflows to verify and validate design concepts.
  • Identify potential design risks and propose mitigation strategies during disassembly.
  • Simulate and solve engineering problems such as solder joint reliability, temperature cycling fatigue, product disassembly and PCB strains, etc.

Method Development and Optimization:
  • Continuously improve simulation techniques and methodologies for enhanced accuracy and computational efficiency.
  • Evaluate emerging tools or technologies to advance simulation capabilities.
  • Develop experimental test models to build predictive confidence in simulation data.
  • Work cross-functionally with design, manufacturing, and quality teams to ensure alignment of performance requirements and material specifications.
  • Present findings and recommendations clearly to both technical and non-technical audiences.

Qualifications
Required education and skills:
  • Master's degree or PhD in mechanical engineering, applied mechanics, or a related field.
  • Minimum of 3 years of experience in simulation engineering for mechanical systems in industry or in academia.
  • Strong proficiency in finite element modeling tools (e.g., ANSYS, Abaqus, etc.).
  • Knowledge of CAD tools (e.g., SolidWorks, Creo, or equivalent) for model creation and integration.
  • Solid understanding of material properties, structural mechanics, and thermal dynamics principles.
  • Strong problem-solving skills and analytical mindset.
  • Ability to work in a collaborative environment.
  • Clear and effective written and verbal communication skills.
  • Proactive and self-motivated with attention to detail.

Preferred:
  • Design and or manufacturing experience in electronic devices
  • Familiarity with storage and memory products or a similar high-tech industry.
  • Experience with product qualification testing and simulation correlation.
  • Knowledge of best practices related to structural and thermal analysis.

Additional Information
All your information will be kept confidential according to EEO guidelines.
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