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Plating Engineer Jobs in Colorado (NOW HIRING)

Senior Materials Engineer

Berthoud, CO · On-site

$108K - $135K/yr

The Senior Materials Engineer will provide sustaining support on both production and development ... extrusion, plating, brazing, anodization, passivation). You will work alongside the Advanced ...

DFM Project Engineer

Denver, CO · Hybrid

$65K - $85K/yr

As a DFM Project Engineer, you're primarily responsible for working with customers across an array ... Familiarity with different types of post-processing/plating finishes for machined parts

DFM Project Engineer

Denver, CO · On-site

$65K - $85K/yr

As a DFM Project Engineer, you're primarily responsible for working with customers across an array ... Familiarity with different types of post-processing/plating finishes for machined parts

The Senior Materials Engineer will provide sustaining support on both production and development ... extrusion, plating, brazing, anodization, passivation). You will work alongside the Advanced ...

The Senior Materials Engineer will provide sustaining support on both production and development ... extrusion, plating, brazing, anodization, passivation). You will work alongside the Advanced ...

Senior Materials Engineer

Berthoud, CO · On-site

$108K - $135K/yr

The Senior Materials Engineer will provide sustaining support on both production and development ... extrusion, plating, brazing, anodization, passivation). You will work alongside the Advanced ...

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Showing results 1-20

Plating Engineer information

See Colorado salary details

$40K

$95.2K

$158.3K

How much do plating engineer jobs pay per year?

As of Jun 15, 2026, the average yearly pay for plating engineer in Colorado is $95,203.00, according to ZipRecruiter salary data. Most workers in this role earn between $75,200.00 and $105,200.00 per year, depending on experience, location, and employer.

What is the difference between Plating Engineer vs Electroplating Technician?

AspectPlating EngineerElectroplating Technician
CredentialsBachelor's degree in materials, chemistry, or engineeringHigh school diploma or equivalent, technical training
Work EnvironmentDesign, process development, quality control in manufacturingHands-on plating processes in production settings
Industry UsageDesigning and improving plating processes, overseeing qualityExecuting plating tasks, maintaining equipment

Plating Engineers focus on process design, development, and quality assurance, often requiring a degree. Electroplating Technicians handle the practical application of plating processes, typically with technical training. Both roles are essential in manufacturing but differ in responsibilities and qualifications.

What engineer makes $500,000 a year?

Highly experienced engineering roles such as senior petroleum engineers, aerospace engineers, or specialized software engineers can earn $500,000 or more annually, often with bonuses and stock options. These positions typically require advanced skills, extensive experience, and often work in high-demand industries or executive-level roles.

What are Plating Engineers?

Plating Engineers are professionals who specialize in the process of applying metal coatings to various materials, typically to enhance durability, prevent corrosion, or improve appearance. They design and oversee electroplating and other surface finishing processes in manufacturing settings. Plating Engineers are responsible for developing process parameters, troubleshooting plating issues, ensuring quality control, and maintaining compliance with safety and environmental standards. They work closely with production teams to optimize plating operations and may also research and implement new technologies in surface finishing.

Is plating a good job?

A plating engineer is responsible for applying metal coatings to parts to improve durability and appearance, often working in manufacturing or industrial settings. The job requires knowledge of chemical processes, attention to safety protocols, and sometimes certifications in hazardous materials handling. It can offer stable employment with opportunities for technical skill development.

What Does a Plating Engineer Do?

As a plating or electroplating engineer, your primary responsibilities include working on a team to manufacture conductors based on client designs and solving engineering issues that arise. You also work closely with suppliers to collect specifications on any new material, product, or equipment needed to fulfill customer requests. Other duties include improving the efficiency of the plating process by inspecting scraps, recommending solutions and improvements to chronic problems, and performing experiments to meet and exceed customer plating specs. You are expected to maintain compliance with federal and state regulations regarding hazardous waste, industrial waste, and the environment.

What does a plating engineer do?

A plating engineer is responsible for developing, implementing, and maintaining electroplating processes to apply metal coatings to products, ensuring quality and adherence to specifications. They analyze surface preparation, select appropriate materials, and use tools like thickness gauges and chemical solutions, often working in manufacturing or quality control environments. Strong knowledge of chemistry, process control, and safety protocols is essential for this role.

What are some common challenges faced by Plating Engineers, and how can they be addressed on the job?

Plating Engineers often encounter challenges such as maintaining consistent coating quality, managing waste and environmental regulations, and troubleshooting equipment malfunctions. Addressing these challenges requires a strong understanding of chemical processes, attention to detail, and effective collaboration with quality control and maintenance teams. Staying current with industry best practices and regularly calibrating equipment also helps ensure optimal results and compliance with safety standards.

What are the key skills and qualifications needed to thrive as a Plating Engineer, and why are they important?

To thrive as a Plating Engineer, you need a solid background in chemical engineering, materials science, and surface finishing processes, often supported by a relevant engineering degree. Familiarity with plating equipment, quality control systems, and safety protocols—plus certification in areas like Six Sigma or ISO standards—is highly valuable. Strong analytical thinking, problem-solving abilities, and attention to detail help you excel, alongside effective communication to collaborate with production and quality teams. These skills are critical for ensuring high-quality, cost-effective plating operations while maintaining safety and compliance in manufacturing environments.

What engineers make $300,000 a year?

Senior engineers in specialized fields such as petroleum, aerospace, or software engineering can earn $300,000 or more annually, especially with extensive experience, advanced skills, and leadership roles. High-paying engineering positions often require advanced degrees, certifications, and working in high-demand industries or executive-level roles.
What are popular job titles related to Plating Engineer jobs in Colorado? For Plating Engineer jobs in Colorado, the most frequently searched job titles are:
What are popular job titles related to Plating Engineer jobs in CO? For Plating Engineer jobs in CO, the most frequently searched job titles are:
Infographic showing various Plating Engineer job openings in Colorado as of June 2026, with employment types broken down into 96% Full Time, and 4% Nights. Highlights an 100% In-person job distribution, with an average salary of $95,203 per year, or $45.8 per hour.
Quality Process Engineer - Semiconductor Manufacturing

Quality Process Engineer - Semiconductor Manufacturing

Semtech

Colorado Springs, CO • On-site

Full-time

Posted 23 days ago


Job description

Location: Colorado Springs (Onsite)
Our Team:
Semtech Corporation (NASDAQ:SMTC; www.semtech.com) is a leading supplier of high-quality semiconductor products. Semtech's Analog Mixed Signal and Wireless (AMW) Business Unit develops a broad portfolio of high-performance semiconductor solutions that power, protect, and connect modern electronics. The group's products span circuit protection devices that shield sensitive systems from voltage spikes and electrical overstress, RF solutions serving industrial, medical, and communications applications, advanced power management ICs including switching regulators and wireless charging solutions, and specialized sensing technologies. AMW's innovations are embedded across some of the fastest-growing markets today - from mobile and consumer devices to industrial automation, medical equipment, and connected infrastructure - making it a critical driver of Semtech's mission to make the world safer, more productive, and more sustainable.
The Quality team at our Colorado Springs backend assembly site manages ISO 9001 certification and IATF 16949 transition, supporting chip-scale packaging operations including flip chip, wafer-level CSP, die attach, molding, and plating processes. We handle internal and external audits, process characterization, document control, and calibration - supporting two manufacturing sites and more than 1,000 controlled documents.
Job Summary:
We are seeking an experienced Quality Process Engineer with chip-scale packaging (CSP) expertise to drive corrective action closure and technical problem-solving across our Colorado Springs backend assembly operations. This role sits at the intersection of quality engineering and process engineering - combining deep technical knowledge of semiconductor packaging with structured problem-solving to eliminate chronic open corrective actions.
You will apply your CSP technical expertise to lead root cause investigations on flip chip, die attach, molding, and plating processes, partnering closely with process engineering, operations, maintenance, and systems engineering teams to diagnose recurring issues and deliver durable solutions. Your technical credibility in semiconductor packaging will enable you to influence cross-functional teams, facilitate collaborative problem-solving sessions, and ensure corrective actions address true root causes rather than symptoms.
Over time, this role may also contribute to quality system auditing as the team scales. If you thrive on applying deep technical knowledge to untangle complex manufacturing problems, influencing engineering teams through data-driven persuasion, and bringing order to ambiguity, this is your role.
Responsibilities:
Corrective Action Leadership (50%)
  • Own and drive closure of 70+ open corrective action reports (CARs) across engineering, operations, maintenance, and systems engineering through technical problem-solving and cross-functional collaboration
  • Lead cross-functional CAR review sessions, bringing together relevant stakeholders to solve problems comprehensively rather than superficially
  • Apply 8D methodology, 5-Why, fishbone, and fault tree analysis combined with CSP technical knowledge to identify true root causes in packaging processes
  • Design and execute Design of Experiments (DOE) to identify root causes of process variability and validate corrective actions
  • Track CAR closure progress and provide regular status reporting to Quality Director and site leadership
  • Verify effectiveness of implemented corrective actions through statistical analysis and follow-up validation
  • Identify systemic patterns across open CARs to prioritize high-impact interventions and prevent recurrence

Chip-Scale Packaging & Process Quality (40%)
  • Support qualification and validation of chip-scale packaging processes including flip chip, wafer-level CSP, die attach, molding, and plating operations
  • Investigate and resolve quality issues related to packaging processes including solder joint integrity, die cracking, underfill defects, warpage, and assembly yield
  • Apply Statistical Process Control (SPC) methodologies to monitor critical process parameters and process capability (Cpk/Ppk) for packaging operations
  • Perform Measurement System Analysis (MSA) and Gage R&R studies to validate inspection and test equipment capability
  • Support new product introduction (NPI) through process validation (IQ/OQ/PQ), first article inspection (FAI), and production readiness activities
  • Develop and maintain Process FMEAs (pFMEA), Control Plans, and process documentation for packaging operations
  • Conduct device characterization and reliability testing to support process optimization and validation

Quality Systems & Supplier Quality (10%)
  • Support maintenance of ISO 9001 quality management system; contribute to IATF 16949 automotive standards transition
  • Participate in internal and external audits as technical subject matter expert; audit ownership capability is a plus
  • Review and approve quality documentation including procedures, work instructions, and process specifications
  • Manage supplier non-conformances (SCARs) and corrective action follow-through as needed

Minimum Qualifications:
  • Bachelor's degree in Engineering, Materials Science, Physics, or related technical field
  • 5+ years of quality engineering experience in semiconductor backend assembly or microelectronics packaging
  • Direct hands-on experience with chip-scale packaging technologies including flip chip, wafer-level CSP, or advanced packaging processes
  • Demonstrated expertise in 8D methodology, root cause analysis (5-Why, fishbone, fault tree), and structured problem-solving
  • Strong statistical analysis skills including SPC, process capability (Cpk/Ppk), hypothesis testing, and Design of Experiments (DOE)
  • Working knowledge of AIAG Core Tools: PFMEA, Control Plans, MSA, PPAP, and APQP
  • Experience with ISO 9001 or equivalent quality management systems
  • Proficiency with statistical analysis software (Minitab, JMP, or equivalent) and Microsoft Office suite
  • Excellent written and verbal communication skills with ability to influence across organizational levels
  • Proven track record of building collaborative relationships with engineering, manufacturing, and supplier organizations

Desired Qualifications:
  • Master's degree in Materials Science, Engineering, or related technical field
  • Six Sigma Green Belt or Black Belt certification
  • Certified Quality Engineer (CQE) or Certified Quality Auditor (CQA) from ASQ
  • ISO 9001 or IATF 16949 Lead Auditor certification
  • Experience with wafer fabrication processes (etch, PVD, lithography, thin films) to support packaging integration
  • Direct experience with flip chip bumping, redistribution layer (RDL) processes, or advanced wafer-level packaging
  • Supplier quality experience with OSATs (Outsourced Semiconductor Assembly and Test) or foundries
  • Familiarity with automotive (IATF 16949), aerospace (AS9100), or medical device (ISO 13485) quality standards
  • Experience with reliability testing including temperature cycling, HAST, HTOL, and failure analysis techniques
  • Knowledge of semiconductor metrology and characterization techniques (SEM, X-ray, C-SAM, profilometry)
  • Advanced DOE expertise including fractional factorial, response surface methodology, and Taguchi methods
  • Experience with MES systems and quality data management platforms

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.
All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.
We are proud to be an EEO employer M/F/D/V. We maintain a drug-free workplace.
A reasonable estimate of the pay range for this position is $ 75,000 to $115,000 USD. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee's total compensation package.
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