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Packaging Director Semiconductor Jobs (NOW HIRING)

GPD Optoelectronics

Lead Optical Packaging Engineer

Salem, NH · On-site

$102K - $134K/yr

Preferred Experience • MSME with 6+ years of direct semiconductor or photonics die packaging experience. • 5 years plus of technical leadership experience in cross-functional teams. • Design ...

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Packaging Director Semiconductor information

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$23.5K

$121.5K

$189.5K

How much do packaging director semiconductor jobs pay per year?

As of Aug 16, 2026, the average yearly pay for packaging director semiconductor in the United States is $121,522.00, according to ZipRecruiter salary data. Most workers in this role earn between $95,000.00 and $147,500.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a packaging director in the semiconductor industry, and why are they important?

To excel as a Packaging Director in semiconductors, you need deep expertise in semiconductor packaging technologies, materials science, and process optimization, often backed by an engineering degree and significant industry experience. Familiarity with industry-standard design software (like Cadence or Mentor Graphics), statistical process control tools, and relevant certifications such as Six Sigma is highly beneficial. Strong leadership, project management, and cross-functional communication skills set top candidates apart in this role. These capabilities are critical for driving innovation, ensuring product quality, and leading teams to meet the fast-paced demands of the semiconductor market.

What does a packaging director in the semiconductor industry do?

A Packaging Director in the semiconductor industry oversees the development and implementation of advanced packaging solutions for semiconductor devices. They manage teams responsible for designing, testing, and optimizing the processes that encase semiconductor chips to protect them, enhance performance, and enable integration into electronic products. Their role involves collaborating with engineering, manufacturing, and supply chain teams to ensure packaging innovations meet technical, cost, and quality requirements. Additionally, they stay updated on industry trends to maintain competitiveness and drive the adoption of new technologies. Effective leadership and strategic planning are key aspects of this position.

What is the difference between Packaging Director Semiconductor vs Packaging Engineer Semiconductor?

AspectPackaging Director SemiconductorPackaging Engineer Semiconductor
ResponsibilitiesOversees entire packaging operations, strategic planning, team leadershipDesigns, develops, and tests packaging solutions, executes project tasks
Required CredentialsBachelor's/Master's in Engineering, extensive industry experienceBachelor's in Engineering, relevant certifications often preferred
Work EnvironmentManagement level, strategic focus, cross-department collaborationTechnical role, hands-on design and testing, project-focused
Industry UsageCommonly used in large semiconductor companies and fabsUsed across R&D labs, manufacturing, and design firms

The Packaging Director Semiconductor focuses on strategic leadership and managing packaging operations, while the Packaging Engineer Semiconductor is more involved in technical design and development tasks. Both roles require engineering background, but differ in scope and seniority within the industry.

What are the main challenges faced by a packaging director in the semiconductor industry?

A Packaging Director in the semiconductor industry often navigates challenges such as managing rapid advancements in packaging technologies, ensuring cost-effective production while maintaining high quality standards, and coordinating cross-functional teams across engineering, manufacturing, and supply chain. Staying ahead of competitors requires continuous learning and adaptation, as well as fostering strong partnerships with vendors and internal R&D teams. Additionally, balancing tight project timelines with the need for innovation and reliability in product design is a key aspect of this role.
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Packaging Director Semiconductor jobs near you
Infographic showing various Packaging Director Semiconductor job openings in the United States as of August 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution, with an average salary of $121,522 per year, or $58.4 per hour.

Lead Design Engineer - Semiconductor Lasers

The Hiring Method, LLC

Fremont, CA • On-site

$100K - $172K/yr

Full-time

Medical, Dental, Vision, Retirement, PTO

Re-posted 5 days ago

Job description

Location: Fremont, CA

Work Setting: 100% Onsite R&D and Semiconductor Development Environment

Compensation: $100,625 – $172,250 Base Salary

Bonus: Annual Bonus Opportunity up to 12%

Benefits: Medical, Dental, Vision, 401(k), Employee Stock Programs, Paid Time Off, and Comprehensive Benefits Package

Sponsorship: Will consider H1b-transfers/TN-1 Visas

Relocation: Available on a Case-by-Case Basis


Position Summary

A global leader in advanced photonics and semiconductor technologies is seeking a Lead Engineer, InP Laser Development & New Product Introduction to join its growing R&D organization in Fremont, California.

This role will focus on the design and development of high-power Indium Phosphide (InP) semiconductor lasers used in next-generation optical communications and AI-driven data center infrastructure. The successful candidate will take ownership of laser design activities from concept through fabrication, characterization, qualification, and new product introduction while working closely with internal engineering teams, manufacturing partners, customers, and suppliers.

This is a highly visible opportunity for an engineer who enjoys hands-on device development, technical leadership, and solving complex challenges at the forefront of optical networking technology.


Key Responsibilities

• Lead the design and development of InP-based semiconductor lasers for high-speed data communication applications

• Own critical aspects of laser development including device architecture, grating design, epitaxy, coatings, and performance optimization

• Utilize simulation tools to identify key design parameters and establish performance and yield targets

• Develop and execute design of experiments (DOE) to accelerate device development and process optimization

• Support wafer fabrication launches and coordinate activities across development and manufacturing teams

• Design and implement electrical and optical characterization methodologies to evaluate device performance

• Analyze fabrication and performance data using statistical methods and engineering tools

• Drive technical coordination across epitaxy, wafer fabrication, assembly, packaging, and test organizations

• Manage project schedules, milestones, documentation, and technical deliverables

• Translate customer requirements into product specifications and development objectives

• Interface directly with customers, suppliers, and external partners on both technical and business-related matters


Required Qualifications

• M.S. in Electrical Engineering, Physics, Optoelectronics, or a related discipline

• Ph.D. preferred

• 3–5+ years of industry experience in semiconductor lasers, photonics, optoelectronics, or related technologies

• Strong understanding of semiconductor physics, laser physics, and device operating principles

• Experience with semiconductor device characterization including electrical and optical measurements

• Working knowledge of semiconductor fabrication processes with hands-on development experience preferred

• Familiarity with Design of Experiments (DOE) methodologies

• Strong analytical and statistical data analysis skills

• Excellent project management, organization, and technical documentation capabilities

• Strong communication and collaboration skills within cross-functional engineering environments

Preferred Qualifications

• Direct experience developing InP-based semiconductor laser products

• Experience with device simulation and modeling tools

• Background supporting new product introduction and product commercialization

• Experience working with optical communications, datacom, networking, or AI infrastructure technologies

• Exposure to epitaxy, wafer fabrication, assembly, packaging, and semiconductor test processes

• Experience interacting directly with customers and external technology partners


Ideal Candidate Profile

The ideal candidate combines strong technical depth with the ability to lead complex development programs and drive results across multiple engineering disciplines.

This person enjoys working hands-on with advanced semiconductor devices while also managing projects, coordinating stakeholders, and influencing technical direction. They thrive in fast-paced development environments and are motivated by seeing innovative technologies move from concept into production.

Candidates from photonics, optical communications, semiconductor laser, or advanced optoelectronics backgrounds will be particularly well aligned.


Why This Opportunity

• Opportunity to develop industry-leading InP laser technologies that power global communications networks

• Direct impact on next-generation AI infrastructure, hyperscale data centers, and optical networking platforms

• Work on products that have enabled more than 100 million deployed optical devices worldwide

• Join a highly experienced and collaborative semiconductor R&D team

• Significant technical ownership and visibility across the product development lifecycle

• Exposure to customers, suppliers, and strategic technology initiatives

• Strong career growth opportunities within a global technology leader

• Competitive compensation, bonus opportunity, and comprehensive benefits package