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Packaging Director Semiconductor Jobs (NOW HIRING)

Cspeed

FEA Packaging Engineer

Palo Alto, CA · On-site

Cspeed IO is developing next-generation optical semiconductor solutions for the AI infrastructure ... Direct-to-chip liquid cooling, or chip-package interaction and low-k dielectric stress. * Scripting ...

GPD Optoelectronics

Lead Optical Packaging Engineer

Salem, NH · On-site

$102K - $134K/yr

Preferred Experience • MSME with 6+ years of direct semiconductor or photonics die packaging experience. • 5 years plus of technical leadership experience in cross-functional teams. • Design ...

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How much do packaging director semiconductor jobs pay per year?

As of Sep 5, 2026, the average yearly pay for packaging director semiconductor in the United States is $121,522.00, according to ZipRecruiter salary data. Most workers in this role earn between $95,000.00 and $147,500.00 per year, depending on experience, location, and employer.

What does a packaging director in the semiconductor industry do?

A Packaging Director in the semiconductor industry oversees the development and implementation of advanced packaging solutions for semiconductor devices. They manage teams responsible for designing, testing, and optimizing the processes that encase semiconductor chips to protect them, enhance performance, and enable integration into electronic products. Their role involves collaborating with engineering, manufacturing, and supply chain teams to ensure packaging innovations meet technical, cost, and quality requirements. Additionally, they stay updated on industry trends to maintain competitiveness and drive the adoption of new technologies. Effective leadership and strategic planning are key aspects of this position.

What are the main challenges faced by a packaging director in the semiconductor industry?

A Packaging Director in the semiconductor industry often navigates challenges such as managing rapid advancements in packaging technologies, ensuring cost-effective production while maintaining high quality standards, and coordinating cross-functional teams across engineering, manufacturing, and supply chain. Staying ahead of competitors requires continuous learning and adaptation, as well as fostering strong partnerships with vendors and internal R&D teams. Additionally, balancing tight project timelines with the need for innovation and reliability in product design is a key aspect of this role.

What are the key skills and qualifications needed to thrive as a packaging director in the semiconductor industry, and why are they important?

To excel as a Packaging Director in semiconductors, you need deep expertise in semiconductor packaging technologies, materials science, and process optimization, often backed by an engineering degree and significant industry experience. Familiarity with industry-standard design software (like Cadence or Mentor Graphics), statistical process control tools, and relevant certifications such as Six Sigma is highly beneficial. Strong leadership, project management, and cross-functional communication skills set top candidates apart in this role. These capabilities are critical for driving innovation, ensuring product quality, and leading teams to meet the fast-paced demands of the semiconductor market.

What is the difference between Packaging Director Semiconductor vs Packaging Engineer Semiconductor?

AspectPackaging Director SemiconductorPackaging Engineer Semiconductor
ResponsibilitiesOversees entire packaging operations, strategic planning, team leadershipDesigns, develops, and tests packaging solutions, executes project tasks
Required CredentialsBachelor's/Master's in Engineering, extensive industry experienceBachelor's in Engineering, relevant certifications often preferred
Work EnvironmentManagement level, strategic focus, cross-department collaborationTechnical role, hands-on design and testing, project-focused
Industry UsageCommonly used in large semiconductor companies and fabsUsed across R&D labs, manufacturing, and design firms

The Packaging Director Semiconductor focuses on strategic leadership and managing packaging operations, while the Packaging Engineer Semiconductor is more involved in technical design and development tasks. Both roles require engineering background, but differ in scope and seniority within the industry.

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Packaging Director Semiconductor jobs near you
Infographic showing various Packaging Director Semiconductor job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 85% Full Time, 12% Part Time, 1% Temporary, and 1% Contract. Highlights an 91% Physical, 3% Hybrid, and 6% Remote job distribution, with an average salary of $121,522 per year, or $58.4 per hour.

Senior Director, GaN Technology

Navitas Semiconductor

Torrance, CA • On-site, Remote

$225K - $275K/yr

Full-time

Medical, Dental, Vision, PTO

Re-posted 28 days ago

Key responsibilities

  • Define the long-term technical roadmap for GaN devices, driving innovation in material science, device/process design, and performance.

  • Lead GaN technology teams and serve as the key point of contact on LV/MV/HV power GaN development for existing and next-generation technologies.

  • Collaborate with external foundries to manage wafer fabrication, process technology development, and yield engineering.

Job description

Job Purpose:
Navitas Semiconductor (Nasdaq: NVTS) is a next-generation power semiconductor leader driving innovation in gallium nitride (GaN) and high-voltage silicon carbide (SiC) technologies. Our products enable faster, more efficient power delivery across AI data centers, high-performance computing, energy and grid infrastructure, and industrial electrification.
With more than 30 years of combined expertise in wide bandgap technologies, GaNFast™ power ICs integrate GaN power, drive, control, sensing, and protection, delivering faster power delivery, higher system density, and greater efficiency. GeneSiC™ high-voltage SiC devices leverage patented trench-assisted planar technology to provide industry-leading voltage capability, efficiency, and reliability for medium-voltage grid and infrastructure applications.
We are seeking a Senior Director of GaN Technology to join our fast-growing, collaborative team. The ideal candidate is self-motivated, energetic, and able to thrive in a high-growth, innovative environment, contributing directly to technologies that are shaping the future of power electronics.
The Senior Director of GaN Technology leads strategic R&D vision and epi/device/process architecture development activities for LV/MV/HV GaN power devices at Navitas. This role focuses on core innovation, managing relationships with external foundries, and driving the technology roadmap from concept to high-volume production. Key focus areas span the entire gamut of R&D activities from steering existing generation GaN technologies toward process freeze to developing the next-generation of world-leading power GaN technologies. The Senior Director of GaN Technology works closely with the internal business, operations teams as well as external foundry partners to deliver state of the art device technology platforms.
Key Responsibilities and Duties:
  • Technical Strategy and R&D Leadership: Define the long-term technical roadmap for GaN devices, driving innovation in material science, device/process design, and performance.
  • Device/Process Development: Leading our GaN technology teams and be the key PoC on LV/MV/HV power GaN development on existing and next-gen technologies
  • Foundry and Partner Management: Collaborate with external US and global foundries to manage wafer fabrication, process technology development, and yield engineering.
  • Product Development and NPI: Closely collaborate with the New Product Introduction (NPI) process teams, ensuring GaN products meet quality, cost, and time-to-market goals.
  • Packaging Technology: Work closely with internal and OSAT partners on high-performance packaging developments (e.g., Ag-sintering, flip-chip, embedding) to optimize thermal and electrical performance for high-volume production, specifically focused on die-package interactions on all new technologies
  • Reliability and Characterization: Lead efforts in developing GaN-specific reliability models, test methods (DOE), and TCAD simulations for product verification.
  • Team Leadership and Recruitment: Mentor and scale a high-performance R&D engineering team

Knowledge, Skills, Abilities, and Other Characteristics (KSAO's)
  • Strong analytical and problem-solving skills
  • Excellent technical communication and negotiation abilities
  • Comfortable working across cultures and global time zones
  • Strong knowledge of power GaN design and fabrication methodologies
  • Adequate knowledge of power GaN 100 V/650 V epitaxy
  • Familiarity with power manufacturing eco-system including vendors and OSATs
  • Experience with high-voltage and high-reliability applications
  • Leading by example

Required Qualifications
  • PhD degree in Electrical Engineering, Physics, or equivalent.
  • 10+ years in semiconductor R&D, with a strong background in GaN technology and power devices. Deep understanding of power semiconductor physics, particularly wide-bandgap devices (SiC, GaN).
  • Experience with scaling 150 mm to 200 mm power GaN technology
  • Demonstrated experience working with external foundries is preferred
  • In-depth knowledge of GaN materials, epitaxial growth, device physics, and characterization techniques.
  • Strong data analytics skills and exposure to machine learning for test optimization.
  • Experience working with external test houses and test equipment suppliers.

What We Offer
  • A front-row seat to the future of power electronics. Work on cutting-edge GaN and SiC technologies that are transforming AI data centers, electrification, and global energy infrastructure.
  • A fast-paced, high-energy environment. We move quickly, make decisions with purpose, and empower employees to take ownership and drive real impact from day one.
  • A team that shows up and delivers. We care deeply about our mission, our customers, and each other. We collaborate, support one another, and bring intensity and accountability to everything we do.
  • Full support to succeed. You'll have access to leadership, cross-functional collaboration, and the resources needed to innovate and execute at a high level.
  • Competitive total rewards. Comprehensive health, dental, and vision coverage, unlimited PTO, and a competitive compensation package including base salary, performance bonus, and equity awards.

Apply