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Packaging Director Semiconductor Jobs in Michigan

Performs theoretical and experimental scientific and technological investigation directed toward ... Experience with semiconductor packaging materials & strategies is a plus Preferred Education:

Company Overview KLA is a global leader in diversified electronics for the semiconductor ... Direct impact on product quality, manufacturing performance, and customer satisfaction.

Company Overview KLA is a global leader in diversified electronics for the semiconductor ... Direct impact on product quality, manufacturing performance, and customer satisfaction.

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Packaging Director Semiconductor information

What does a packaging director in the semiconductor industry do?

A Packaging Director in the semiconductor industry oversees the development and implementation of advanced packaging solutions for semiconductor devices. They manage teams responsible for designing, testing, and optimizing the processes that encase semiconductor chips to protect them, enhance performance, and enable integration into electronic products. Their role involves collaborating with engineering, manufacturing, and supply chain teams to ensure packaging innovations meet technical, cost, and quality requirements. Additionally, they stay updated on industry trends to maintain competitiveness and drive the adoption of new technologies. Effective leadership and strategic planning are key aspects of this position.

What are the main challenges faced by a packaging director in the semiconductor industry?

A Packaging Director in the semiconductor industry often navigates challenges such as managing rapid advancements in packaging technologies, ensuring cost-effective production while maintaining high quality standards, and coordinating cross-functional teams across engineering, manufacturing, and supply chain. Staying ahead of competitors requires continuous learning and adaptation, as well as fostering strong partnerships with vendors and internal R&D teams. Additionally, balancing tight project timelines with the need for innovation and reliability in product design is a key aspect of this role.

What are the key skills and qualifications needed to thrive as a packaging director in the semiconductor industry, and why are they important?

To excel as a Packaging Director in semiconductors, you need deep expertise in semiconductor packaging technologies, materials science, and process optimization, often backed by an engineering degree and significant industry experience. Familiarity with industry-standard design software (like Cadence or Mentor Graphics), statistical process control tools, and relevant certifications such as Six Sigma is highly beneficial. Strong leadership, project management, and cross-functional communication skills set top candidates apart in this role. These capabilities are critical for driving innovation, ensuring product quality, and leading teams to meet the fast-paced demands of the semiconductor market.

What is the difference between Packaging Director Semiconductor vs Packaging Engineer Semiconductor?

AspectPackaging Director SemiconductorPackaging Engineer Semiconductor
ResponsibilitiesOversees entire packaging operations, strategic planning, team leadershipDesigns, develops, and tests packaging solutions, executes project tasks
Required CredentialsBachelor's/Master's in Engineering, extensive industry experienceBachelor's in Engineering, relevant certifications often preferred
Work EnvironmentManagement level, strategic focus, cross-department collaborationTechnical role, hands-on design and testing, project-focused
Industry UsageCommonly used in large semiconductor companies and fabsUsed across R&D labs, manufacturing, and design firms

The Packaging Director Semiconductor focuses on strategic leadership and managing packaging operations, while the Packaging Engineer Semiconductor is more involved in technical design and development tasks. Both roles require engineering background, but differ in scope and seniority within the industry.

What are popular job titles related to Packaging Director Semiconductor jobs in Michigan?

For Packaging Director Semiconductor jobs in Michigan, the most frequently searched job titles are:

What job categories do people searching Packaging Director Semiconductor jobs in Michigan look for?

The top searched job categories for Packaging Director Semiconductor jobs in Michigan are:

What cities in Michigan are hiring for Packaging Director Semiconductor jobs?

Cities in Michigan with the most Packaging Director Semiconductor job openings:

Microelectronic Design Engineer

Eccalon LLC

Detroit, MI

Full-time

Posted 16 days ago


Job description

Job Description

We are seeking a highly skilled and experienced Microelectronic Design Engineer to join our semiconductor design team. You will be responsible for the design, development, simulation, and validation of advanced semiconductor devices and chip-scale systems for next-generation applications. This role requires deep expertise in chip-scale design, microelectronics architecture, and circuit-level implementation, with the ability to collaborate across multidisciplinary engineering teams and work on cutting-edge chip designs.

Responsibilities

  • Design and develop microelectronic circuits and systems at the chip scale level, from concept through production, for high-performance applications
  • Perform schematic capture, circuit simulations, modeling, and analysis using industry-standard tools
  • Execute layout design, place and route, parasitic extraction, and timing analysis of integrated circuits
  • Conduct physical design verification (DRC, LVS) and design validation, debugging, and performance optimization
  • Collaborate with system architects, device engineers, fabrication teams, verification engineers, manufacturing partners, and test engineers to ensure successful product development
  • Optimize designs for performance, power consumption, area, and cost
  • Implement design for manufacturability (DFM) and design for testability (DFT) best practices
  • Support silicon bring-up, characterization, and failure analysis
  • Troubleshoot design issues and implement corrective actions
  • Develop and document technical specifications, design schematics, and comprehensive technical reports
  • Participate in design reviews and contribute to continuous process improvement
  • Stay current with emerging technologies and industry trends in semiconductor design and microfabrication

Required Qualifications

  • Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Computer Engineering, or a related field
  • 5 years of hands-on, direct experience in chip-scale design and layout
  • Proven experience in microelectronic circuit design (analog, digital, or mixed-signal)
  • Proficiency with industry-standard EDA tools (e.g., Cadence, Synopsys, Mentor Graphics)
  • Strong understanding of semiconductor device physics, device modeling, IC fabrication processes, and circuit theory
  • Experience with CMOS design and manufacturing processes
  • Strong analytical, debugging, and problem-solving skills
  • Excellent written and verbal communication abilities
  • Familiarity with verification methodologies and simulation tools

Preferred Qualifications

  • Master's degree in Electrical Engineering or related field
  • Experience with advanced nodes (e.g., FinFET, CMOS scaling technologies, 5nm or below)
  • Knowledge of RF design, high-speed signal integrity, or high-speed interconnect circuits
  • Experience working with ASICs, SoCs, or FPGA-based prototyping
  • Experience with power delivery network (PDN) design
  • Familiarity with packaging and chip integration technologies
  • Experience with static and dynamic power analysis
  • Prior experience supporting government, defense, or regulated industry programs

Eccalon logo

About Eccalon

Sourced by ZipRecruiter

We are a cross-functional collective of innovative minds that leverages technology to tackle the most challenging problems of this generation for clients, the nation, and the world. Eccalon fosters creativity, curiosity, and imagination across all departments and divisions to pioneer new ideas, products, and services. We advance innovation.​

Industry

Guided missile and space vehicle manufacturing

Company size

11 - 50 Employees

Headquarters location

Hanover, MD, US

Year founded

2017