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Packaging Director Semiconductor Jobs (NOW HIRING)

Amat

Technologist, Advanced Packaging Director

Austin, TX · On-site

$176K - $242K/yr

Expertise in semiconductor processing and integration, including lithography, dry etch, thin film ... Strong understanding of process equipment and packaging specific materials, including selection ...

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$23.5K

$121.5K

$189.5K

How much do packaging director semiconductor jobs pay per year?

As of Jun 10, 2026, the average yearly pay for packaging director semiconductor in the United States is $121,522.00, according to ZipRecruiter salary data. Most workers in this role earn between $95,000.00 and $147,500.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a Packaging Director in the semiconductor industry, and why are they important?

To excel as a Packaging Director in semiconductors, you need deep expertise in semiconductor packaging technologies, materials science, and process optimization, often backed by an engineering degree and significant industry experience. Familiarity with industry-standard design software (like Cadence or Mentor Graphics), statistical process control tools, and relevant certifications such as Six Sigma is highly beneficial. Strong leadership, project management, and cross-functional communication skills set top candidates apart in this role. These capabilities are critical for driving innovation, ensuring product quality, and leading teams to meet the fast-paced demands of the semiconductor market.

What does a Packaging Director in the semiconductor industry do?

A Packaging Director in the semiconductor industry oversees the development and implementation of advanced packaging solutions for semiconductor devices. They manage teams responsible for designing, testing, and optimizing the processes that encase semiconductor chips to protect them, enhance performance, and enable integration into electronic products. Their role involves collaborating with engineering, manufacturing, and supply chain teams to ensure packaging innovations meet technical, cost, and quality requirements. Additionally, they stay updated on industry trends to maintain competitiveness and drive the adoption of new technologies. Effective leadership and strategic planning are key aspects of this position.

What is the difference between Packaging Director Semiconductor vs Packaging Engineer Semiconductor?

AspectPackaging Director SemiconductorPackaging Engineer Semiconductor
ResponsibilitiesOversees entire packaging operations, strategic planning, team leadershipDesigns, develops, and tests packaging solutions, executes project tasks
Required CredentialsBachelor's/Master's in Engineering, extensive industry experienceBachelor's in Engineering, relevant certifications often preferred
Work EnvironmentManagement level, strategic focus, cross-department collaborationTechnical role, hands-on design and testing, project-focused
Industry UsageCommonly used in large semiconductor companies and fabsUsed across R&D labs, manufacturing, and design firms

The Packaging Director Semiconductor focuses on strategic leadership and managing packaging operations, while the Packaging Engineer Semiconductor is more involved in technical design and development tasks. Both roles require engineering background, but differ in scope and seniority within the industry.

What are the main challenges faced by a Packaging Director in the semiconductor industry?

A Packaging Director in the semiconductor industry often navigates challenges such as managing rapid advancements in packaging technologies, ensuring cost-effective production while maintaining high quality standards, and coordinating cross-functional teams across engineering, manufacturing, and supply chain. Staying ahead of competitors requires continuous learning and adaptation, as well as fostering strong partnerships with vendors and internal R&D teams. Additionally, balancing tight project timelines with the need for innovation and reliability in product design is a key aspect of this role.
More about Packaging Director Semiconductor jobs
What cities are hiring for Packaging Director Semiconductor jobs? Cities with the most Packaging Director Semiconductor job openings:
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Packaging Director Semiconductor jobs near you
Infographic showing various Packaging Director Semiconductor job openings in the United States as of June 2026, with employment types broken down into 7% As Needed, 23% Full Time, and 70% Part Time. Highlights an 97% Physical, 1% Hybrid, and 2% Remote job distribution, with an average salary of $121,522 per year, or $58.4 per hour.
Technologist, Advanced Packaging Director

Technologist, Advanced Packaging Director

Applied Materials

Phoenix, AZ • On-site

$176K - $242K/yr

Full-time

Posted 10 days ago

Applied Materials rating

8.6

Company rating: 8.6 out of 10

Based on 54 frontline employees who took The Breakroom Quiz

23rd of 516 rated manufacturers

Job description

Who We Are
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world - like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.
What We Offer
Salary:
$176,000.00 - $242,000.00
Location:
Austin,TX, Santa Clara,CA
You'll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more.
At Applied Materials, we care about the health and wellbeing of our employees. We're committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.
About the Role
We are seeking a highly skilled Advanced Packaging Technologist to join the Disruptive Technology Pathfinding team within Applied Materials' Advanced Packaging division. This role focuses on advanced packaging process integration, with particular emphasis on materials and process development while ensuring seamless integration across manufacturing processes on large form factor substrates. This role leads and/or develops and executes exceptionally complex technology and engineering development projects.
Key Responsibilities
  • Lead cross-functional efforts to develop and enable next-generation 2.xD packaging concepts, architectures, and technologies
  • Define, document, and implement end-to-end process flows for panel-level packaging technologies
  • Lead material selection, characterization, and compatibility assessments for large form factor substrates
  • Partner with customers to define and align process specifications and acceptance criteria
  • Collaborate with business units on process development (lithography, etch, thin films, etc.), module co-optimization, and technology transfer to customers
  • Contribute to Applied's equipment product strategy by providing feedback to business unit leaders on process and hardware enhancements required to meet customer roadmaps
  • Analyze process data to identify trends, drive optimization, and improve performance
  • Conduct root-cause analyses of defects and implement corrective actions to improve yield and reliability
  • Within established safety guidelines, design and execute complex engineering experiments; collect and analyze data; and deliver rigorous reports with innovative, practical solutions
  • Publish and present technical findings at leading industry conferences and in peer-reviewed journals
  • Mentor and guide early-career engineers; provide technical direction and best practices

Requirements
  • Master's degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field
  • In-depth knowledge and hands-on experience with advanced 2.xD packaging technologies such as fan-out panel-level packaging (FOPLP), (organic) interposer, substrate and wafer-level back-end technologies and related process flows
  • Expertise in semiconductor processing and integration, including lithography, dry etch, thin film deposition and materials modification techniques on wafer and/or panel-level
  • Strong understanding of process equipment and packaging specific materials, including selection criteria, process interactions and performance trade-offs
  • Proficiency in statistical data analysis (e.g. DoE, JMP)
  • Knowledge of industry standards and best practices in semiconductor packaging
  • Solid understanding of process characterization, metrology, materials & failure analysis
  • Working knowledge of reliability requirements and qualification methodologies
  • Proven capability to lead multi-functional teams to resolve complex technical problems
  • Exceptional written and verbal communication skills
  • Develop clear, compelling technical presentations and executive-level slides to effectively convey complex concepts
  • Drive structured technical discussions with customers and suppliers
  • Articulate positions, influence decisions, and align technical direction
  • Ability to produce high-quality, technically rigorous written content such as reports, white papers, and publications
  • Ability to work effectively across geographies and time zones

Additional Information
Time Type:
Full time
Employee Type:
Assignee / Regular
Travel:
Yes, 10% of the Time
Relocation Eligible:
Yes
The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.
For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.

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About Applied Materials

Sourced by ZipRecruiter

Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We're the brain (and the brawn) behind every new technology development--whether it's building semiconductor chips for smartphones and computers, or the underpinnings for robotics, AI and even smart TV display screens. With 27,000 employees in 19 countries, we offer an exciting place to grow and learn alongside some of the best people you'll ever meet. We take deep pride in our Culture of Inclusion, and we celebrate the diverse backgrounds, perspectives and experiences that help us build stronger, more resilient teams. Join us as we innovate to Make Possible a Better Future!

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1967

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