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Packaging Director Semiconductor Jobs (NOW HIRING)

$180 - $280/hr

Director of Test Engineering -- RF & High‑Speed Semiconductor Overview Lead Point2's test ... Own test strategy, infrastructure, and execution across wafer, package, and system‑level testing ...

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Packaging Director Semiconductor information

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$23.5K

$121.5K

$189.5K

How much do packaging director semiconductor jobs pay per year?

As of Sep 5, 2026, the average yearly pay for packaging director semiconductor in the United States is $121,522.00, according to ZipRecruiter salary data. Most workers in this role earn between $95,000.00 and $147,500.00 per year, depending on experience, location, and employer.

What does a packaging director in the semiconductor industry do?

A Packaging Director in the semiconductor industry oversees the development and implementation of advanced packaging solutions for semiconductor devices. They manage teams responsible for designing, testing, and optimizing the processes that encase semiconductor chips to protect them, enhance performance, and enable integration into electronic products. Their role involves collaborating with engineering, manufacturing, and supply chain teams to ensure packaging innovations meet technical, cost, and quality requirements. Additionally, they stay updated on industry trends to maintain competitiveness and drive the adoption of new technologies. Effective leadership and strategic planning are key aspects of this position.

What are the main challenges faced by a packaging director in the semiconductor industry?

A Packaging Director in the semiconductor industry often navigates challenges such as managing rapid advancements in packaging technologies, ensuring cost-effective production while maintaining high quality standards, and coordinating cross-functional teams across engineering, manufacturing, and supply chain. Staying ahead of competitors requires continuous learning and adaptation, as well as fostering strong partnerships with vendors and internal R&D teams. Additionally, balancing tight project timelines with the need for innovation and reliability in product design is a key aspect of this role.

What are the key skills and qualifications needed to thrive as a packaging director in the semiconductor industry, and why are they important?

To excel as a Packaging Director in semiconductors, you need deep expertise in semiconductor packaging technologies, materials science, and process optimization, often backed by an engineering degree and significant industry experience. Familiarity with industry-standard design software (like Cadence or Mentor Graphics), statistical process control tools, and relevant certifications such as Six Sigma is highly beneficial. Strong leadership, project management, and cross-functional communication skills set top candidates apart in this role. These capabilities are critical for driving innovation, ensuring product quality, and leading teams to meet the fast-paced demands of the semiconductor market.

What is the difference between Packaging Director Semiconductor vs Packaging Engineer Semiconductor?

AspectPackaging Director SemiconductorPackaging Engineer Semiconductor
ResponsibilitiesOversees entire packaging operations, strategic planning, team leadershipDesigns, develops, and tests packaging solutions, executes project tasks
Required CredentialsBachelor's/Master's in Engineering, extensive industry experienceBachelor's in Engineering, relevant certifications often preferred
Work EnvironmentManagement level, strategic focus, cross-department collaborationTechnical role, hands-on design and testing, project-focused
Industry UsageCommonly used in large semiconductor companies and fabsUsed across R&D labs, manufacturing, and design firms

The Packaging Director Semiconductor focuses on strategic leadership and managing packaging operations, while the Packaging Engineer Semiconductor is more involved in technical design and development tasks. Both roles require engineering background, but differ in scope and seniority within the industry.

More about Packaging Director Semiconductor jobs

What cities are hiring for Packaging Director Semiconductor jobs?

Cities with the most Packaging Director Semiconductor job openings:

What states have the most Packaging Director Semiconductor jobs?

States with the most job openings for Packaging Director Semiconductor jobs include:

Infographic showing various Packaging Director Semiconductor job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 85% Full Time, 12% Part Time, 1% Temporary, and 1% Contract. Highlights an 91% Physical, 3% Hybrid, and 6% Remote job distribution, with an average salary of $121,522 per year, or $58.4 per hour.

Director Strategic Partnerships (Semiconductor)

Ethernovia, Inc.

San Jose, CA • Hybrid

$200K - $275K/yr

Full-time

Medical, Dental, Vision

Re-posted 5 days ago


Key responsibilities

  • Build and maintain strong relationships with AI platform companies' Automotive and Robotics organizations to support strategic partnerships.

  • Coordinate with internal teams to support strategic engagements and drive execution of partnership initiatives.

  • Identify new partnership opportunities across adjacent product areas, emerging platform programs, and joint go-to-market initiatives.


Job description

Director of Strategic Partnerships (Semiconductor)

Summary:

  • You will build and maintain strong relationships with leading AI platform companies, across their Automotive and Robotics organizations, in engineering, product, platform architecture, procurement, and executive leadership teams, within the key partner's organizations. This is a Hybrid-based position based in San Jose, CA.

Key Responsibilities:

  • Represent Ethernovia as a trusted long-term technology partner and work closely with customer and ecosystem teams to position Ethernovia solutions within Automotive and Robotics reference designs and platform roadmaps.
  • Coordinate cross-functionally with internal engineering, product, marketing, and executive teams to support strategic engagements and drive execution.
  • Identify new partnership opportunities across adjacent product areas, emerging platform programs, developer ecosystems, and joint go-to-market initiatives.
  • Provide structured market and competitive intelligence to Ethernovia leadership including insights into partner priorities, industry direction, and evolving trends in AI infrastructure, networking, robotics, and autonomous systems.
  • Significant experience working with leading AI, semiconductor, or infrastructure companies and understand how large technical organizations operate and make decisions.
  • Engage directly with semiconductor hardware architects, engineering teams, and senior business leaders and bring strong technical knowledge of Ethernet networking, high-speed interconnects, SerDes, PHY/MAC architectures, and sensor connectivity for AI or autonomous systems.
  • Think strategically about ecosystems, platform adoption, and long-term market positioning rather than focusing only on transactions.

Required Experience & Skills:

  • Semiconductor Industry Veteran: 12+ years of experience in strategic partnerships, business development, or technical sales within Semiconductors, AI infrastructure, networking, or HPC
  • Existing relationships across the Silicon Valley AI and semiconductor ecosystem
  • Strong technical understanding of Ethernet networking, high-speed interconnects, SerDes, PHY silicon or sensor networking architectures
  • Experience driving silicon or platform technologies into strategic customer programs or reference designs
  • Proven ability to navigate large cross-functional organizations and complex partnership cycles
  • B.S. in Electrical Engineering, Computer Science, or related field required
  • M.S. or MBA preferred

Nice to Have (The "Competitive Advantage"):

  • Experience with ROS / ROS2, Isaac Sim, CUDA, etc
  • Understanding and experience of OSI network layers 2+
  • Experience of Ethernet switches and understanding of IEEE802.1 protocols
  • Experience with TSN protocols
  • Experience with PCIe protocols and topologies

Personal Skills:

  • Excellent communication/documentation skills with ability to discuss technical or business information from Engineering to C-suite executives
  • Attention to details
  • Strong internal collaboration skills across product, engineering, marketing, and executive team located throughout the world 
  • Highly self-directed, organized, and proactive with strong follow-through. Able to work effectively both independently and in a team
  • Ability to identify organizational dynamics and key decision makers inside large companies
  • Entrepreneurial mindset with willingness to travel frequently and spend significant time onsite with partners

What You Can Expect From Ethernovia:

  • Technology depth and breadth expansion that can't be found in a large company
  • Opportunity to grow your career as the company grows
  • Pre IPO stock options
  • Cutting edge technology
  • World class team
  • Competitive base salary
  • Flexible hours
  • Medical, dental and vision insurance for employees

Salary Range:

  • The actual offered base salary for U.S. locations will vary depending on factors such as work location, individual qualifications, specializations, years of experience, skills, job-related knowledge, and internal equity. The annual salary range for this position is $200,000 - $275,000. The compensation package will also include incentive compensation in the form of pre-IPO ISO options, as well as eligibility for performance bonuses, in addition to base salary and a full range of medical and other benefits.

* Principals Only (No Agencies)

#LI-Hybrid