ADCE Packaging Design Architect
$220K - $311K/yr
Drives end-to-end development for substrate design from concept through tape out and implements physical layout and routing of the package design. Performs substrate fit and routing studies to ...
$220K - $311K/yr
Drives end-to-end development for substrate design from concept through tape out and implements physical layout and routing of the package design. Performs substrate fit and routing studies to ...
$220K - $311K/yr
Drives end-to-end development for substrate design from concept through tape out and implements physical layout and routing of the package design. Performs substrate fit and routing studies to ...
Hillsboro, OR · On-site
$148K/yr
Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving the end-to-end development of silicon interposer and bridge designs that define the future of ...
Hillsboro, OR · On-site
$148K/yr
Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving the end-to-end development of silicon interposer and bridge designs that define the future of ...
Lead design groups, coordinating efforts across multiple teams to achieve project goals. * Technical Expertise * Serve as the primary package design technical lead and guide customers through end-to ...
Lead design groups, coordinating efforts across multiple teams to achieve project goals. * Technical Expertise * Serve as the primary package design technical lead and guide customers through end-to ...
Ashland, OR · On-site
Conceptualize and design innovative consumer product packaging, merchandising displays, POP materials, product renderings, mock-ups, and other print and digital marketing assets. * Develop packaging ...
New
Ashland, OR · On-site
Conceptualize and design innovative consumer product packaging, merchandising displays, POP materials, product renderings, mock-ups, and other print and digital marketing assets. * Develop packaging ...
New
OR · On-site
$200K - $280K/yr
Define long-term packaging roadmap aligned with future ASIC nodes, bandwidth scaling, and multi-die integration. * Establish organizational package design standards, methodologies, and best practices.
OR · On-site
$180K - $260K/yr
Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field. * 5+ years of experience in ASIC package design, with deep expertise in FC-BGA.
In this position, you will get the chance to build complex chips and interact directly with unit-level ASIC, Physical Design, CAD, Package Design, Software, DFT and other teams. What you'll be doing:
New
In this position, you will get the chance to build complex chips and interact directly with unit-level ASIC, Physical Design, CAD, Package Design, Software, DFT and other teams. What you'll be doing:
New
General knowledge of packaging design, packaging test protocols, international sourcing, supply chain optimization, business case development. College degree in related field or equivalent Business ...
General knowledge of packaging design, packaging test protocols, international sourcing, supply chain optimization, business case development. College degree in related field or equivalent Business ...
Hillsboro, OR · On-site
$113K - $156K/yr
Define, design and develop test vehicles to validate Silicon, Package, System performance. * Drive supplier assessments and manage suppliers through definition, development, qualification and ...
Hillsboro, OR · On-site
$113K - $156K/yr
Define, design and develop test vehicles to validate Silicon, Package, System performance. * Drive supplier assessments and manage suppliers through definition, development, qualification and ...
OR · Hybrid
In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical ... Optimize package pinout incorporating system level trade-offs of pins assignment. * Help perform ...
Hillsboro, OR · On-site
$220K/yr
In this collaborative role, you will work with cross-functional teams, including analog circuit design, process technology, and package design, to deliver layouts that are efficient, robust, and ...
Hillsboro, OR · On-site
$220K/yr
In this collaborative role, you will work with cross-functional teams, including analog circuit design, process technology, and package design, to deliver layouts that are efficient, robust, and ...
Hillsboro, OR · On-site
$78K - $146K/yr
As a key member of the MSAT Process Engineering - Finished Goods team, this exciting role will focus on the design, sourcing, and qualification of secondary/tertiary packaging configurations and ...
Hillsboro, OR · On-site
$78K - $146K/yr
As a key member of the MSAT Process Engineering - Finished Goods team, this exciting role will focus on the design, sourcing, and qualification of secondary/tertiary packaging configurations and ...
$78K - $146K/yr
As a key member of the MSAT Process Engineering - Finished Goods team, this exciting role will focus on the design, sourcing, and qualification of secondary/tertiary packaging configurations and ...
$78K - $146K/yr
As a key member of the MSAT Process Engineering - Finished Goods team, this exciting role will focus on the design, sourcing, and qualification of secondary/tertiary packaging configurations and ...
Portland, OR · On-site
You will be responsible for preparing custom engineering packages, providing technical support ... This role blends engineering design, project coordination, technical communication, and product ...
Quick apply
Portland, OR · On-site
You will be responsible for preparing custom engineering packages, providing technical support ... This role blends engineering design, project coordination, technical communication, and product ...
OR · Remote
Brand & Packaging Design - Especially those with CPG experience who can bring a fresh lens to upcoming packaging redesigns * Web Design - Design sleek, user-friendly digital experiences that drive ...
OR · Remote
Brand & Packaging Design - Especially those with CPG experience who can bring a fresh lens to upcoming packaging redesigns * Web Design - Design sleek, user-friendly digital experiences that drive ...
Wilsonville, OR · Hybrid
$130K - $160K/yr
Utilize engineering software packages such as Midas Civil, LEAP Bridge Enterprise, L-Pile, LEAP ... Apply advanced seismic design principles and non-linear analysis techniques to bridge projects.
Wilsonville, OR · Hybrid
$130K - $160K/yr
Utilize engineering software packages such as Midas Civil, LEAP Bridge Enterprise, L-Pile, LEAP ... Apply advanced seismic design principles and non-linear analysis techniques to bridge projects.
$90K - $120K/yr
Job Title: Product Design Engineer Region: Portland or Salt Lake City Department: Advanced ... Updated 6-5-26 Full compensation packages are based on candidate experience and certifications.
Quick apply
$90K - $120K/yr
Job Title: Product Design Engineer Region: Portland or Salt Lake City Department: Advanced ... Updated 6-5-26 Full compensation packages are based on candidate experience and certifications.
Wilsonville, OR · Hybrid
$130K - $160K/yr
Utilize engineering software packages such as Midas Civil, LEAP Bridge Enterprise, L-Pile, LEAP ... Apply advanced seismic design principles and non-linear analysis techniques to bridge projects.
Wilsonville, OR · Hybrid
$130K - $160K/yr
Utilize engineering software packages such as Midas Civil, LEAP Bridge Enterprise, L-Pile, LEAP ... Apply advanced seismic design principles and non-linear analysis techniques to bridge projects.
Familiarity with versioned monorepos or multi-package design system releases, including change management and migration planning. #LI-Remote
Familiarity with versioned monorepos or multi-package design system releases, including change management and migration planning. #LI-Remote
Wilsonville, OR · On-site
$130K - $160K/yr
Utilize engineering software packages such as Midas Civil, LEAP Bridge Enterprise, L-Pile, LEAP ... Apply advanced seismic design principles and non-linear analysis techniques to bridge projects.
Wilsonville, OR · On-site
$130K - $160K/yr
Utilize engineering software packages such as Midas Civil, LEAP Bridge Enterprise, L-Pile, LEAP ... Apply advanced seismic design principles and non-linear analysis techniques to bridge projects.
$95.2K - $99.6K
0% of jobs
$99.6K - $104.1K
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$104.1K - $108.6K
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$108.6K - $113K
0% of jobs
$113K - $117.5K
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$117.5K - $122K
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$122K - $126.4K
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$126.4K - $130.9K
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$130.9K - $135.4K
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$135.4K - $139.8K
0% of jobs
$141K is the 25th percentile. Wages below this are outliers.
$139.8K - $144.3K
100% of jobs
$95.2K
$144.3K
| Aspect | Packaging Design | Graphic Designer |
|---|---|---|
| Credentials | Design degree, packaging certifications | Design degree, graphic design certifications |
| Work Environment | Packaging companies, branding agencies | Advertising agencies, media companies |
| Industry Usage | Product packaging, retail | |
| Search Intent | Packaging design jobs, packaging artist | Graphic design jobs, visual artist |
Packaging Design and Graphic Designer roles share similar design skills and educational backgrounds, but differ in focus. Packaging Design specializes in creating functional and attractive packaging for products, often requiring knowledge of materials and manufacturing. Graphic Designers work on visual communication across various media, emphasizing branding, advertising, and digital content. Both roles are vital in branding and marketing, but Packaging Design is more industry-specific to product presentation and retail packaging.

$220K - $311K/yr
Full-time
Medical, Retirement, PTO
Re-posted 13 days ago
8.7
Based on 147 frontline employees who took The Breakroom Quiz
11th of 143 rated electronics manufacturers
Drives end-to-end development for substrate design from concept through tape out and implements physical layout and routing of the package design. Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs. Works closely with silicon and hardware teams to optimize silicon-package-board performance and pinout. Defines substrate design rules, conducts internal and external reviews, analyzes data, and resolves DRCs to optimize package design. Completes documentation and collateral into the product lifecycle management system of record.
Required Skills and Experience:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $220,920.00-311,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.The application window for this job posting is expected to end by 06/09/2026*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Sourced by ZipRecruiter
Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
Manufacturing
10,000+ Employees
Santa Clara, CA, US
1968