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Internship Brain Machine Interface Jobs (NOW HIRING)

Devyantram

Lead Biohybrid Systems Engineer

Ashburn, VA · On-site

$145K - $165K/yr

... brain-machine interfaces. • Experience bridging wet-lab, hardware, and robotics teams. A Successful Candidate Will Be Measured By • Stability, function, and learning capacity of the neural ...

Alumni Ventures

Materials Engineer

Cambridge, MA · On-site

$70 - $100/hr

Summary Axoft is building the most advanced infrastructure for implantable brain-machine interfaces. Our mission is to enable long-term stable and ultra-high bandwidth communication with the brain ...

University of Michigan

RESEARCH FELLOW

Ann Arbor, MI · On-site

Job Summary We are seeking a post-doctoral fellow to conduct research on novel brain machine interface technology. The role involves comprehensive testing of chronically implanted carbon fiber ...

Neuralink

UI Design Engineer

Austin, TX · On-site

$135K - $281K/yr

We are creating devices that enable a bi-directional interface with the brain. These devices allow ... Our team spans a wide range of disciplines, from neuroscience and machine learning to software ...

Neuralink

CNC Machinist

South San Francisco, CA · On-site

$42.55 - $75.48/hr

We are creating devices that enable a bi-directional interface with the brain. These devices allow ... The Machine Shop is a vital component of Neuralink's mission to develop the world's best and most ...

Neuralink

Neuroengineer Intern

South San Francisco, CA · On-site

$35/hr

... brain-computer interfaces. We are laying the groundwork for intuitive, high-dimensional, and bidirectional interfaces between brains and machines, with the goal of helping people challenged by a ...

Neuralink

Neuroengineer, Next Gen

South San Francisco, CA · On-site

$122K - $226K/yr

... brain-computer interfaces. We are laying the groundwork for intuitive, high-dimensional, and bidirectional interfaces between brains and machines, with the goal of helping people challenged by a ...

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Internship Brain Machine Interface information

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$25.5K

$42.6K

$88K

How much do internship brain machine interface jobs pay per year?

As of Sep 7, 2026, the average yearly pay for internship brain machine interface in the United States is $42,584.00, according to ZipRecruiter salary data. Most workers in this role earn between $32,500.00 and $46,000.00 per year, depending on experience, location, and employer.

What is an internship brain machine interface?

Internship Brain Machine Interface positions are short-term roles typically offered to students or recent graduates to gain hands-on experience working with brain-machine interface (BMI) technologies. These internships involve assisting with research, development, and testing of systems that connect the human brain to external devices, often in fields like neuroscience, biomedical engineering, or computer science. Interns may work on tasks such as data analysis, programming, hardware development, or conducting experiments under the supervision of experienced professionals. The goal is to provide practical exposure and skill development in cutting-edge neurotechnology.

What are the key skills and qualifications needed to thrive as an internship brain machine interface?

To thrive in a Brain Machine Interface internship, you typically need a background in neuroscience, biomedical engineering, computer science, or a related field, with coursework or experience in signal processing and neural data analysis. Familiarity with programming languages like Python or MATLAB, as well as experience with neural recording systems and data acquisition tools, is often required. Strong analytical thinking, problem-solving abilities, and effective communication skills help interns collaborate and contribute meaningfully to research teams. These skills enable interns to support innovative projects at the intersection of neuroscience and technology, ensuring they can learn quickly and add value to complex research environments.

What types of projects or tasks can I expect to work on during a brain machine interface internship?

As a Brain Machine Interface (BMI) intern, you'll typically assist with experimental design, data collection, and analysis involving neurophysiological signals, such as EEG or intracortical recordings. You may help develop or test algorithms for signal processing and decoding brain activity, or support the integration of hardware and software systems. Collaboration with neuroscientists, engineers, and software developers is common, so you’ll gain exposure to both research and technical development environments. Interns often have the opportunity to contribute to ongoing research publications or product development, which can be valuable experience for future roles.

What is the difference between Internship Brain Machine Interface vs Research Assistant in Brain-Computer Interface?

AspectInternship Brain Machine InterfaceResearch Assistant in Brain-Computer Interface
Required CredentialsEnrolled in relevant undergraduate or graduate programGraduate degree or ongoing research experience in neuroscience or engineering
Work EnvironmentInternship setting, often in labs or tech companiesAcademic or research institution labs
Employer & Industry UsageTech companies, startups, research labsUniversities, research institutes, industry R&D
Common Search & Comparison IntentUnderstanding internship roles in BMIResearch roles in brain-computer interfaces

While both roles involve working with brain-machine interface technology, an Internship Brain Machine Interface typically targets students gaining initial industry experience, whereas a Research Assistant in Brain-Computer Interface usually involves more advanced research responsibilities within academic or research institutions.

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Internship Brain Machine Interface jobs near you
Infographic showing various Internship Brain Machine Interface job openings in the United States as of August 2026, with employment types broken down into 50% Internship, and 50% Full Time. Highlights an 100% In-person job distribution, with an average salary of $42,584 per year, or $20.5 per hour.

Semiconductor Process Applications Engineer

Finetech

Chandler, AZ • On-site

Other

Posted 7 days ago

Job description

Job description

Position Overview

We are seeking an experienced and highly motivated Semiconductor Process Applications Engineer to join our team. We are a leading capital equipment company specializing in sub-micron die bonding solutions for the semiconductor industry. This role is ideal for professionals with several years of hands-on experience in semiconductor manufacturing and advanced packaging processes. The successful candidate will play a key role in supporting our sales team, interfacing with our customers, and driving technical success for our cutting-edge, die-bonding equipment.

Key Responsibilities

  • Serve as a technical resource for customers and internal sales teams regarding sub-micron die bonding equipment and applications in leading-edge technologies like quantum computing and brain-machine interface.
  • Conduct product demonstrations, process development trials, and technical presentations to showcase equipment capabilities.
  • Collaborate with customers to understand application requirements and develop customized process solutions.
  • Support the installation, qualification, and troubleshooting of die bonding equipment at customer sites domestically.
  • Provide technical training to customers and internal staff on equipment operation and process optimization.
  • Gather customer feedback and work with international engineering teams to drive product improvements and new feature development.
  • Prepare and maintain technical documentation, including application notes, process guidelines, and training materials.
  • Represent the company at industry events, conferences, and customer meetings as a technical expert.

Qualifications

  • Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
  • Minimum 3-5 years of experience in semiconductor manufacturing, advanced packaging, or process engineering.
  • Proven expertise working with die bonding, wire bonding, or related semiconductor assembly equipment.
  • Strong understanding of sub-micron process control, wafer-level packaging, and yield optimization.
  • Excellent problem-solving skills and the ability to troubleshoot complex hardware and process issues.
  • Outstanding communication and interpersonal skills; ability to present technical information clearly to diverse audiences.
  • Able to work daily from our office and demo lab in Chandler, AZ. Willingness to travel domestically and internationally as required (up to 30%).

Preferred Skills

  • Customer-focused mindset with a proactive approach to solving challenges.
  • Team player able to collaborate across departments and with external partners.
  • Adaptable and eager to learn about new technologies and industry trends.
  • Self-motivated, organized, and able to manage multiple priorities effectively.
  • Familiarity with advanced packaging trends such as flip-chip, wafer-level bonding, and heterogeneous integration.

Why Join Us?

Become part of an innovative, close-knit team at the forefront of semiconductor assembly technology. You will have the opportunity to make a tangible impact on the industry, work with cutting-edge equipment, and advance your career in a collaborative environment that offers a competitive salary and a comprehensive benefits package.


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