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Executive Packaging Automation Jobs (NOW HIRING)

Abbott

Automation Engineer

Tipp City, OH · On-site

... executives, and scientists. The Opportunity This position works out of our Tipp City, OH location ... The Packaging Automation Engineer improves and maintains plant equipment, systems and other fixed ...

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Executive Packaging Automation information

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$26.5K

$93.6K

$184K

How much do executive packaging automation jobs pay per year?

As of May 31, 2026, the average yearly pay for executive packaging automation in the United States is $93,552.00, according to ZipRecruiter salary data. Most workers in this role earn between $58,000.00 and $120,500.00 per year, depending on experience, location, and employer.

What is the difference between Executive Packaging Automation vs Packaging Technician?

AspectExecutive Packaging AutomationPackaging Technician
CredentialsRelevant certifications in automation and engineering, bachelor’s degree often preferredHigh school diploma or equivalent, technical certifications optional
Work EnvironmentOffice settings, overseeing automation systems, collaborating with engineering teamsManufacturing floors, operating packaging machinery, hands-on tasks
Industry UsageUsed in industries with advanced automation needs like pharmaceuticals, consumer goodsCommon in manufacturing plants for routine packaging tasks
Search & Comparison IntentUnderstanding automation management roles, career advancementLearning about packaging operations, entry-level roles

Executive Packaging Automation focuses on managing and optimizing automated packaging systems, requiring technical expertise and strategic oversight. Packaging Technicians perform hands-on tasks operating packaging machinery. The former involves higher-level planning and supervision, while the latter emphasizes operational skills on the production line.

More about Executive Packaging Automation jobs
What cities are hiring for Executive Packaging Automation jobs? Cities with the most Executive Packaging Automation job openings:
What are the most commonly searched types of Packaging Automation jobs? The most popular types of Packaging Automation jobs are:
What states have the most Executive Packaging Automation jobs? States with the most job openings for Executive Packaging Automation jobs include:
What job categories do people searching Executive Packaging Automation jobs look for? The top searched job categories for Executive Packaging Automation jobs are:
Executive Packaging Automation jobs near you
Infographic showing various Executive Packaging Automation job openings in the United States as of May 2026, with employment types broken down into 75% Full Time, 15% Part Time, and 10% Contract. Highlights an 81% Physical, 5% Hybrid, and 14% Remote job distribution, with an average salary of $93,552 per year, or $45 per hour.
Lead Packaging Automation Engineer

Lead Packaging Automation Engineer

Advanced Micro Devices, Inc

Austin, TX • On-site

$127.19K/yr

Full-time

Posted 21 days ago

Advanced Micro Devices rating

7.8

Company rating: 7.8 out of 10

Based on 6 frontline employees who took The Breakroom Quiz

53rd of 137 rated electronics manufacturers

Job description

WHAT YOU DO AT AMD CHANGES EVERYTHING
At AMD, our mission is to build great products that accelerate next-generation computing experiences-from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you'll discover the real differentiator is our culture. We push the limits of innovation to solve the world's most important challenges-striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.
THE ROLE:
We are looking for a forward-thinking candidate to drive the development and deployment of next-generation packaging design automation and AI-assisted workflows. You will focus on accelerating the design of advanced heterogeneous integration technologies, specifically substrates, organic interposers, and bridge interconnects. AMD's environment is fast-paced, results-oriented, and built upon a legion of innovators with a passion for winning technology.
THE PERSON:
The successful candidate must be a technical innovator who can bridge the gap between physical design requirements and software automation. He or she must have a drive for solutions and an aptitude to thrive in a multi-tasking environment, translating complex design challenges into scriptable, scalable workflows. They should possess excellent cross-functional collaboration skills to work between Design, EDA, and AI teams, with good executive presentation skills. Demonstrating strong technical leadership to excel in his/her work with minimum supervision and a strong interest in growing within the technical or management ladder.
KEY RESPONSIBILITIES:
  • Drive the development and maintenance of automation scripts and tools for Substrate, Interposer, and Silicon Bridge design flows.
  • Deploy AI/ML methodologies to optimize critical design stages, including auto-routing, component placement, and signal integrity optimization.
  • Collaborate with EDA vendors and internal stakeholders to define and implement next-generation feature roadmaps for 2.5D and 3D packaging.
  • Lead the transition from manual design practices to "Agentic" and algorithmic design operational models.
  • Coordinate with electrical and mechanical analysis teams to build closed-loop optimization systems that feed simulation results back into design construction.
  • Prepare & present Executive Summaries of automation ROI, efficiency gains, and tool capability advancements.
  • Coordination of activities within/external teams to deliver critical design tape-outs and methodology milestones.
  • Mentoring junior engineers in coding best practices and advanced packaging concepts.

PREFERRED EXPERIENCE:
  • Strong knowledge of EDA packaging design tools (Cadence APD/SIP, Siemens Xpedition, or Synopsys 3DIC/Compiler).
  • Proven track record of developing automation using Python, Tcl, SKILL, or C++.
  • Experience with applying AI/ML frameworks (PyTorch, TensorFlow, etc.) to engineering or design problems.
  • Familiarity with Advanced Packaging architectures (2.5D/3D, Chiplets, Fan-Out, Hybrid Bonding).
  • Familiar with design verification flows (DRC/LVS) and electrical extraction concepts.
  • Good leadership and interpersonal skills.

ACADEMIC CREDENTIALS:
  • Bachelor/MS degree in Electrical Engineering, Computer Engineering, Computer Science, or related field with relevant packaging experience.

This role is not eligible for Visa Sponsorship
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Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD's "Responsible AI Policy" is available here.
This posting is for an existing vacancy.

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