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Etch Process Engineer Jobs in Arizona (NOW HIRING)

Collaborate with fellow innovators across device, product engineering, lithography, etch, and thin films process teams to identify integrated process solutions that address customer issues or ...

Collaborate with fellow innovators across device, product engineering, lithography, etch, and thin films process teams to identify integrated process solutions that address customer issues or ...

Process Technician III

Phoenix, AZ · On-site

$25 - $34.70/hr

Who We Are Applied Materials is a global leader in materials engineering solutions used to produce ... Operate semiconductor lab tools (e.g., etch, deposition, metrology, FIB, SEM depending on ...

Who We Are Applied Materials is a global leader in materials engineering solutions used to produce ... Operate semiconductor lab tools (e.g., etch, deposition, metrology, FIB, SEM depending on ...

Chemical Vapor Deposition, Atomic Layer Deposition, Plasma Reactive Ion Etch, Physical Vapor ... process support engineer knowledge and skills not covered by other training (such as AGS HW or AGU ...

Chemical Vapor Deposition, Atomic Layer Deposition, Plasma Reactive Ion Etch, Physical Vapor ... process support engineer knowledge and skills not covered by other training (such as AGS HW or AGU ...

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Etch Process Engineer information

See Arizona salary details

$46.1K

$85.8K

$132.8K

How much do etch process engineer jobs pay per year?

As of Jun 15, 2026, the average yearly pay for etch process engineer in Arizona is $85,750.00, according to ZipRecruiter salary data. Most workers in this role earn between $69,400.00 and $96,000.00 per year, depending on experience, location, and employer.

What are the typical challenges faced by an Etch Process Engineer, and how can they be addressed?

Etch Process Engineers often encounter challenges such as maintaining process stability, optimizing etch selectivity, and minimizing defects in semiconductor manufacturing. Addressing these challenges requires strong analytical skills, attention to detail, and frequent collaboration with equipment engineers and process integration teams. Staying current with new etching techniques and maintaining thorough documentation can help resolve issues efficiently. Additionally, clear communication within cross-functional teams is essential for troubleshooting and continuous improvement.

What is the difference between Etch Process Engineer vs Plasma Process Engineer?

AspectEtch Process EngineerPlasma Process Engineer
CredentialsBachelor's in Chemical, Materials, or Electrical EngineeringBachelor's in Chemical, Materials, or Electrical Engineering
Work EnvironmentCleanroom semiconductor fabrication facilitiesCleanroom semiconductor fabrication facilities
Industry UsageSemiconductor manufacturing, microfabricationSemiconductor manufacturing, microfabrication
Job FocusEtching patterns onto wafers using chemical or plasma processesDeveloping and optimizing plasma-based processes for etching and deposition

Both roles are integral to semiconductor fabrication, often working in similar environments and requiring comparable technical backgrounds. The Etch Process Engineer primarily focuses on the etching process itself, while the Plasma Process Engineer specializes in plasma-based techniques that can include etching and deposition. Understanding these distinctions helps in choosing the right career path or job search focus.

What are the key skills and qualifications needed to thrive as an Etch Process Engineer, and why are they important?

To thrive as an Etch Process Engineer, you need a strong background in materials science, chemical engineering, or a related field, typically supported by a relevant bachelor's or master's degree. Familiarity with semiconductor fabrication tools, such as plasma etchers and process control systems, as well as knowledge of industry standards like SEMI and SPC, is essential. Strong analytical thinking, problem-solving abilities, and effective communication skills help in troubleshooting complex processes and collaborating with cross-functional teams. These skills and qualities are vital for optimizing manufacturing yields, ensuring process stability, and driving innovation in semiconductor production.

What are Etch Process Engineers?

Etch Process Engineers are specialized professionals who develop, optimize, and monitor the etching processes used in semiconductor manufacturing. They work to ensure precise removal of material from silicon wafers using chemical or plasma etching techniques, which is critical for defining micro- and nano-scale patterns on chips. Their responsibilities include process development, troubleshooting, equipment maintenance, and data analysis to improve yield and device performance. Etch Process Engineers often collaborate with other engineering teams to support new technology introductions and meet production goals.
Infographic showing various Etch Process Engineer job openings in Arizona as of June 2026, with employment types broken down into 5% Locum Tenens, 81% Full Time, and 14% Part Time. Highlights an 87% Physical, 6% Hybrid, and 7% Remote job distribution, with an average salary of $85,750 per year, or $41.2 per hour.

Process Integration Engineer

TSMC

Phoenix, AZ • On-site

Full-time

Posted 24 days ago


TSMC rating

8.2

Company rating: 8.2 out of 10

Based on 19 frontline employees who took The Breakroom Quiz

36th of 139 rated electronics manufacturers


Job description

A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona's first fab will operate it's leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America's leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future.
TSMC Arizona is seeking a Process Integration Engineer (PIE) for a pivotal role dedicated to ensuring customers achieve success throughout the full lifecycle of their products. This includes New Product Introduction (NPI), device performance, yield, and reliability, leveraging our most advanced technology. Engage your passion for semiconductors and engineering by utilizing cutting-edge, agile, and intelligent operating systems to drive manufacturing excellence. Collaborate with fellow innovators across device, product engineering, lithography, etch, and thin films process teams to identify integrated process solutions that address customer issues or specific requests. Your contributions will be instrumental in achieving exceptional outcomes for our customers.
Job Description:
Your main responsibilities include:
  • New product qualification and technology transfers from a mother fab.
  • Big data analysis to identify process design weaknesses and/or manufacturing tool issues.
  • Designing, executing, and analyzing experiments to improve yield and performance for each specific product.
  • Collaborating with the engineering teams to maintain process stability and provide technical solutions to customers.
  • Scheduled night shifts and weekend on-call rotations in a 24/7 high-volume manufacturing environment.

Qualifications:
Applicants must be legally eligible to work in the United States and have:
  • Bachelor, Master or Ph.D. degree in Electrical Engineering, Material Science or Physics.
  • Experience in leading the improvement of the silicon process flow Including front-end-of-line (FEOL), middle-end-of-line (MEOL), and back-end-of-line (BEOL)
  • Experience with process shifts, changes with design rules and product layout with individual process steps and their impact on Function Yield, Electrical Test and Product Performance as well as short- and long-term reliability implications.
  • Good communication and interpersonal skills.
  • Able to work on cross-functional and geographically dispersed teams with diverse backgrounds.
  • A team player that can multitask and thrive in a very dynamic and fast-paced environment.

Interpersonal Skills:
  • Good communication and interpersonal skills that enable you to work on cross-functional and geographically dispersed teams.
  • Able to take initiatives, adapt priorities and responsibilities to support business needs.
  • Hands-on participant with a strong sense of ownership.
  • A team player with leadership skills that can multitask and thrive in a very dynamic and fast-paced environment.
  • Goal driven with demonstrated ability of working in a high performing team culture.
  • Quick assimilation to new technology.
  • Ability to troubleshoot complex problems and to own the efforts to address and resolve root causes.

Shift expectations:
  • Standard work hours are Monday through Friday, with rotational shifts including swing shifts from 3:30 PM to 12:00 AM and occasional weekend shifts.

Candidates must be willing and able to work on-site at our Phoenix Arizona facility.
Work Location: Phoenix, AZ
Travel: May require travel dependent on business needs
#LI-Onsite
TSMC is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, veteran status, or any other protected characteristic. We encourage all qualified individuals to apply, and we welcome applications from individuals with diverse backgrounds and experiences.
Date: Jun 4, 2026
Country/Region: US
City: Phoenix
Company: TSMC Arizona

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