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Internship Electroplating Process Engineer Jobs in Arizona

About the Role We are seeking a Process Engineer (Photolithography) to join our Tempe team. In this ... Knowledge of copper electroplating Pay range and compensation package Salary Range: US $110k ...

Provide daily engineering support to wet process production areas, including troubleshooting ... Desired Qualifications Experience with electroplating or surface treatment processes. Familiarity ...

Process Engineer II

Glendale, AZ · On-site

$84K - $116K/yr

Required Qualifications • Bachelor's degree in Engineering, Chemistry, Chemical Engineering, or a ... Desired Qualifications • Experience with electroplating or surface treatment processes. • ...

Process Engineer II

Glendale, AZ · On-site

$84K - $116K/yr

Required Qualifications • Bachelor's degree in Engineering, Chemistry, Chemical Engineering, or a ... Desired Qualifications • Experience with electroplating or surface treatment processes. • ...

Senior Process Engineer - Dry Etch

Phoenix, AZ · On-site

$103K - $133K/yr

... process technology feasibility studies using theoretical simulations and practical engineering ... experience, internship experience and / or schoolwork/classes/research. The preferred ...

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Internship Electroplating Process Engineer information

What is the difference between Internship Electroplating Process Engineer vs Electroplating Process Engineer?

AspectInternship Electroplating Process EngineerElectroplating Process Engineer
QualificationsEnrolled in or recent graduate of relevant engineering or chemistry programBachelor's or higher in chemical, materials, or metallurgical engineering
Work EnvironmentInternship setting, supervised, entry-level tasksFull-time, professional environment, responsible for process optimization
ResponsibilitiesAssisting with electroplating processes, data collection, learning proceduresDesigning, improving, and overseeing electroplating processes, troubleshooting

In summary, the Internship Electroplating Process Engineer role is an entry-level position focused on learning and assisting, while the Electroplating Process Engineer is a full-time professional responsible for process development and optimization.

What are the most commonly searched types of Electroplating Process Engineer jobs in Arizona? The most popular types of Electroplating Process Engineer jobs in Arizona are:
What are popular job titles related to Internship Electroplating Process Engineer jobs in Arizona? For Internship Electroplating Process Engineer jobs in Arizona, the most frequently searched job titles are:
What job categories do people searching Internship Electroplating Process Engineer jobs in Arizona look for? The top searched job categories for Internship Electroplating Process Engineer jobs in Arizona are:
What cities in Arizona are hiring for Internship Electroplating Process Engineer jobs? Cities in Arizona with the most Internship Electroplating Process Engineer job openings:

Process Engineer - Photolithography

belSearch

Tempe, AZ

$110K - $150K/yr

Other

Medical, Dental, Vision, Retirement, PTO

Posted 5 days ago


Job description

About the Company



Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into a single tool. We do that by achieving high-speed, high resolution metallization at significantly lower costs and energy use, while minimizing emissions and waste. Founded in Australia, our growing footprint in the US represents a key milestone in our journey. We are building a world-class team where seasoned engineers and ambitious emerging talent collaborate to solve some of the toughest challenges in semiconductor manufacturing.



About the Role



We are seeking a Process Engineer (Photolithography) to join our Tempe team. In this hands-on role, you will develop and manufacture critical components of Syenta’s LEM process, with a strong focus on photolithography and high-resolution patterning. You will work across microfabrication and characterisation, contributing directly to the development of next-generation stamping processes and helping translate prototypes into scalable manufacturing solutions.



Responsibilities



Process Development & Fabrication

  • Develop and refine process flows for fabrication of LEM stamps
  • Push the boundaries of high-resolution microfabrication and stamping processes
  • Develop tool and material specific recipes for high aspect ratio structures
  • Manufacture prototype components to support mechanical, mechatronic, and software systems


Cross-Functional Collaboration

  • Collaborate closely with Sydney team to develop stamps
  • Work closely with materials scientists, chemists, and engineers to deliver an integrated product
  • Support transfer of developed processes to national and international commercial fabs
  • Ensures clear, timely, and well-documented engagement with external suppliers


Characterisation & Analysis

  • Perform metrology and inspection to assess process quality and reproducibility
  • Analyse experimental data and translate findings into process improvements


Innovation & Continuous Improvement

  • Explore new lithography and fabrication techniques to improve resolution and performance
  • Contribute to continuous improvement of fabrication workflows and process capability




Qualifications



  • Bachelor’s degree in Nanotechnology, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science, or related field
  • Minimum 6 years combined experience in MEMS/microfabrication, academia or industry
  • Experience with DWL, MLA, mask aligner, stepper, and EBL
  • Experience with wet etching processes
  • Experience with photosensitive materials to produce high aspect ratio structures
  • Experience working in semiconductor-grade cleanroom environments
  • Experience in metallisation, lithography, wet etching and thin film deposition



Preferred Skills



  • Master of Research or Ph.D. with relevant research or industry experience
  • Experience working within commercial semiconductor fabs or local university fabs
  • Experience with lithography materials (SU-8, AZ resist, dry film resist, etc)
  • Exposure to advanced packaging techniques (wafer bonding, die bonding)
  • Exposure to nano-imprint lithography or hot embossing
  • Knowledge of copper electroplating



Pay range and compensation package



Salary Range: US $110k – $150k (negotiable)



  • Early-stage equity opportunities
  • Potential 401(k) and other benefits
  • Comprehensive health, dental, and vision coverage plans, supported by Company
  • Professional Growth – We’re scaling fast, so responsibilities can expand significantly in tandem with the business
  • Team Events – Annual company event in Australia to collaborate and celebrate
  • Work-Life Balance – Flexible leave policies and an understanding that meaningful work can coexist with a fulfilling personal life
  • 15 days PTO and 10 days sick leave



Equal Opportunity Statement



Syenta is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, age, or any other characteristic protected by law.