Internship Electroplating Process Engineer Jobs in Arizona

About Syenta

Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into a single tool. We do that by achieving high-speed, high-resolution metallization at significantly lower costs and energy use, while minimizing emissions and waste.

Founded in Australia, our growing footprint in the US represents a key milestone in our journey. We are building a world‑class team where seasoned engineers and ambitious emerging talent collaborate to solve some of the toughest challenges in semiconductor manufacturing.

About the Role

We are seeking a Process Engineer (Metallization) to support the development and optimization of Syenta’s core LEM metallization processes. This is a hands‑on, high‑impact role working at the heart of our technology — bridging experimental R&D, process engineering, and early‑stage manufacturing.

You will take ownership of designing and executing experiments, improving process performance, and translating learnings into robust, repeatable workflows. Working closely with cross‑functional teams, you will play a key role in advancing our prototype systems toward scalable production.

Responsibilities Electroplating Process Ownership

• Support the development and performance of electroplating processes within Syenta’s LEM platform
• Develop and refine electrolyte chemistries, including optimization of additive systems (suppressors, accelerators, levellers, inhibitors)
• Define electrochemical deposition windows that balance performance, repeatability, and manufacturability
• Drive improvements in film properties including adhesion, stress, microstructure, uniformity, and defectivity

Process Development & Optimization

• Design and execute structured experiments (DOE, parameter sweeps) across tightly coupled chemical and process variables
• Optimise deposition conditions (e.g. current density, waveform, transport effects) to improve yield and consistency
• Establish process control strategies, acceptance criteria, and repeatability standards
• Translate experimental results into actionable process improvements

Defect Analysis & Process Improvement

• Investigate plating defects such as voids, seams, roughness, non‑uniformity, stress cracking, and adhesion failures
• Correlate defects to chemistry, interfaces, transport, waveform, and tool behavior
• Implement corrective actions to improve process robustness and reduce variability
• Build mechanistic understanding to support long‑term stability and scalability

Scale‑Up & Manufacturing Integration

• Translate lab‑scale processes into stable, repeatable manufacturing workflows
• Support process transfer to pilot lines and external fabrication partners
• Identify and mitigate risks related to yield, cost, and scalability
• Contribute to process standardization and documentation for manufacturing readiness

Technical Leadership & Cross‑Functional Collaboration

• Act as a subject matter expert in electroplating and electrochemistry within the organization
• Work closely with materials, hardware, and product teams to integrate metallization processes into the broader system

Requirements

• B.S., M.S., or Ph.D. or equivalent industry experience in Chemistry, Electrochemistry, Materials Science, or Chemical Engineering
• 5+ years of hands‑on experience in electroplating or electrochemical process development
• Strong experience with copper electroplating or similar metal deposition systems
• Background in semiconductor manufacturing, advanced packaging, or related high‑precision industries
• Proven ability to solve complex process and defect‑related challenges
• Strong experimental design (DOE), data analysis, and problem‑solving capabilities
• Experience working in laboratory and/or cleanroom environments

Preferred Qualifications

• Experience in semiconductor fabs (FEOL/BEOL plating, RDL, bumping) or OSAT environments
• Experience scaling processes from R&D through to manufacturing
• Familiarity with metrology and characterization tools (SEM, profilometry, electrical testing)
• Experience working with prototype or custom‑built hardware systems
• Exposure to adjacent industries (PCB, MEMS, surface finishing) with relevance to high‑resolution systems

Why Choose Syenta?

We’re passionate about building a diverse, people‑first company. We believe that our culture of collaboration and mutual respect fuels the kind of innovation that can redefine an industry.

What We Offer

Salary Range: US $100k – $130k (negotiable)

• Early‑stage equity opportunities
• Potential 401(k) and other benefits
• Comprehensive health, dental, and vision coverage plans, supported by Company
• Professional Growth – We’re scaling fast, so responsibilities can expand significantly in tandem with the business
• Team Events – Annual company event in Australia to collaborate and celebrate
• Work‑Life Balance – Flexible leave policies and an understanding that meaningful work can coexist with a fulfilling personal life
• 15 days PTO and 10 days sick leave

Syenta is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, age, or any other characteristic protected by law.