Cadence Allegro Package Designer / APD+ / SiP, Siemens Xpedition Package Designer, Synopsys IC ... Layout for 112G/224G SerDes or comparable high-speed interfaces; familiarity with signal and power ...
Cadence Allegro Package Designer / APD+ / SiP, Siemens Xpedition Package Designer, Synopsys IC ... Layout for 112G/224G SerDes or comparable high-speed interfaces; familiarity with signal and power ...
Analog IC Design Engineer
$129K - $225K/yr
Medical
Dental
Retirement
Drive mask design to implement layout view of designs. Top-level simulations to validate top-level ... it applies to analog IC designs Proven working experience in using spectrum analyzers ...
Analog IC Design Engineer
$129K - $225K/yr
Medical
Dental
Retirement
Drive mask design to implement layout view of designs. Top-level simulations to validate top-level ... it applies to analog IC designs Proven working experience in using spectrum analyzers ...
Analog IC Design Engineer
$129K - $225K/yr
Medical
Dental
Retirement
Drive mask design to implement layout view of designs. Top-level simulations to validate top-level ... it applies to analog IC designs Proven working experience in using spectrum analyzers ...
Analog IC Design Engineer
$129K - $225K/yr
Medical
Dental
Retirement
Drive mask design to implement layout view of designs. Top-level simulations to validate top-level ... it applies to analog IC designs Proven working experience in using spectrum analyzers ...
Analog IC Design Engineer
$129K - $225K/yr
Medical
Dental
Retirement
Drive mask design to implement layout view of designs. Top-level simulations to validate top-level ... it applies to analog IC designs Proven working experience in using spectrum analyzers ...
Analog IC Design Engineer
$129K - $225K/yr
Medical
Dental
Retirement
Drive mask design to implement layout view of designs. Top-level simulations to validate top-level ... it applies to analog IC designs Proven working experience in using spectrum analyzers ...
The Automotive Solutions Group needs entry level computer draftsman interested in learning mask ... Responsibilities include all aspects of IC mask design from creating full chip floor plans ...
The Automotive Solutions Group needs entry level computer draftsman interested in learning mask ... Responsibilities include all aspects of IC mask design from creating full chip floor plans ...
IC Packaging Design Engineer
Chandler, AZ · On-site
$138K/yr
Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP) Candidates should have ... Substrate design and layout * SI/PI aware design implementation * Design for performance ...
IC Packaging Design Engineer
Chandler, AZ · On-site
$138K/yr
Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP) Candidates should have ... Substrate design and layout * SI/PI aware design implementation * Design for performance ...
Cadence Allegro Package Designer / APD+ / SiP, Siemens Xpedition Package Designer, Synopsys IC ... Layout for 112G/224G SerDes or comparable high-speed interfaces; familiarity with signal and power ...
Cadence Allegro Package Designer / APD+ / SiP, Siemens Xpedition Package Designer, Synopsys IC ... Layout for 112G/224G SerDes or comparable high-speed interfaces; familiarity with signal and power ...
The Automotive Solutions Group needs entry level computer draftsman interested in learning mask ... Responsibilities include all aspects of IC mask design from creating full chip floor plans ...
The Automotive Solutions Group needs entry level computer draftsman interested in learning mask ... Responsibilities include all aspects of IC mask design from creating full chip floor plans ...
Entry Level PCB Designer
Medical
Dental
Vision
Life
Retirement
PTO
The Entry Level PCB Designer's role will be responsible for executing PCB designs that meet ... Apply RF layout techniques including isolation, via stitching, and shielding strategies * Support ...
Entry Level PCB Designer
Medical
Dental
Vision
Life
Retirement
PTO
The Entry Level PCB Designer's role will be responsible for executing PCB designs that meet ... Apply RF layout techniques including isolation, via stitching, and shielding strategies * Support ...
Entry Level PCB Designer
Medical
Dental
Vision
Life
Retirement
PTO
The Entry Level PCB Designer's role will be responsible for executing PCB designs that meet ... Apply RF layout techniques including isolation, via stitching, and shielding strategies * Support ...
Entry Level PCB Designer
Medical
Dental
Vision
Life
Retirement
PTO
The Entry Level PCB Designer's role will be responsible for executing PCB designs that meet ... Apply RF layout techniques including isolation, via stitching, and shielding strategies * Support ...
Entry Level PCB Designer
Camarillo, CA · On-site
Medical
Dental
Vision
Life
Retirement
PTO
The Entry Level PCB Designer's role will be responsible for executing PCB designs that meet ... Apply RF layout techniques including isolation, via stitching, and shielding strategies * Support ...
Entry Level PCB Designer
Camarillo, CA · On-site
Medical
Dental
Vision
Life
Retirement
PTO
The Entry Level PCB Designer's role will be responsible for executing PCB designs that meet ... Apply RF layout techniques including isolation, via stitching, and shielding strategies * Support ...
Entry Level PCB Designer
Camarillo, CA · On-site
Medical
Dental
Vision
Life
Retirement
PTO
The Entry Level PCB Designer's role will be responsible for executing PCB designs that meet ... Apply RF layout techniques including isolation, via stitching, and shielding strategies * Support ...
Entry Level PCB Designer
Camarillo, CA · On-site
Medical
Dental
Vision
Life
Retirement
PTO
The Entry Level PCB Designer's role will be responsible for executing PCB designs that meet ... Apply RF layout techniques including isolation, via stitching, and shielding strategies * Support ...
... designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar). - Support package ...
... designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar). - Support package ...
... designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar). - Support package ...
... designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar). - Support package ...
... designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar). - Support package ...
... designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar). - Support package ...
... designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar). - Support package ...
... designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar). - Support package ...
Entry Level PCB Designer-Camarillo,California
Malibu, CA · On-site
Medical
Dental
Vision
Life
Retirement
PTO
The Entry Level PCB Designer's role will be responsible for executing PCB designs that meet ... Apply RF layout techniques including isolation, via stitching, and shielding strategies * Support ...
Entry Level PCB Designer-Camarillo,California
Malibu, CA · On-site
Medical
Dental
Vision
Life
Retirement
PTO
The Entry Level PCB Designer's role will be responsible for executing PCB designs that meet ... Apply RF layout techniques including isolation, via stitching, and shielding strategies * Support ...
Entry Level PCB Designer-Camarillo,California
Medical
Dental
Vision
Life
Retirement
PTO
The Entry Level PCB Designer's role will be responsible for executing PCB designs that meet ... Apply RF layout techniques including isolation, via stitching, and shielding strategies * Support ...
Entry Level PCB Designer-Camarillo,California
Medical
Dental
Vision
Life
Retirement
PTO
The Entry Level PCB Designer's role will be responsible for executing PCB designs that meet ... Apply RF layout techniques including isolation, via stitching, and shielding strategies * Support ...
Entry Level Graphic Designer
Austin, TX · On-site
$45K/yr
About the role Wander is looking for an entry-level Graphic Designer to join our team in Austin ... Genuine interest in graphic design, layout, typography, and visual branding, with an eye for luxury ...
Entry Level Graphic Designer
Austin, TX · On-site
$45K/yr
About the role Wander is looking for an entry-level Graphic Designer to join our team in Austin ... Genuine interest in graphic design, layout, typography, and visual branding, with an eye for luxury ...
Annapurna Labs (our organization within AWS) designs silicon and software that accelerates ... We are seeking a Sr Package Layout Engineer to lead the end-to-end physical design of advanced IC ...
Annapurna Labs (our organization within AWS) designs silicon and software that accelerates ... We are seeking a Sr Package Layout Engineer to lead the end-to-end physical design of advanced IC ...
Entry Level Ic Layout Designer information
See salary details
$16.79 is the 25th percentile. Wages below this are outliers.
$10.10 - $18.36
31% of jobs
$18.36 - $26.62
16% of jobs
The median wage is $29.10 / hr.
$26.62 - $34.88
11% of jobs
$34.88 - $43.14
15% of jobs
$48.30 is the 75th percentile. Wages above this are outliers.
$43.14 - $51.40
4% of jobs
$51.40 - $59.66
6% of jobs
$59.66 - $67.92
5% of jobs
$67.92 - $76.18
3% of jobs
$76.18 - $84.44
2% of jobs
$84.44 - $92.70
3% of jobs
$92.70 - $100.96
3% of jobs
$10
$41
$100
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Full-time
Posted 12 days ago
Job description
You will own the physical design of our optical engine packages - redistribution layers, substrate, and the bump and ball maps that tie the die stack to the host board. This is a hands-on layout role with real architectural influence.
You will work between our PIC and EIC design teams, our SI/PI and thermal engineers, and our supply chain (wafer fab, substrate vendor, OSAT). You will not be handed a finished floorplan to route - you will help define it.
What You'll DoLayout execution
- Deliver RDL/UBM and package substrate layouts for our optical engine products and test vehicles, from floorplan through tape-out.
- Define and release bump maps, ball maps, and escape routing strategies for multi-die assemblies (PIC, EIC, and light source die).
- Design to 200G/lane-class electrical requirements: differential pair routing, reference-plane integrity, crosstalk isolation, and power delivery for high-current, low-noise rails.
Co-design and floor planning
- Participate from concept phase: produce preliminary floorplans and stack-up proposals that reconcile electrical, optical, thermal, and mechanical constraints before they are frozen.
- Iterate with SI/PI engineers on test routes to converge routing topologies and design rules.
Design rules, DFM, and supplier engagement
- Work directly with wafer fabs, substrate suppliers, and OSATs to capture and negotiate design rules, stack-ups, and assembly constraints.
- Generate fab and assembly release packages; drive DFM/DFA closure and design reviews through to sign-off.
- Flag rule conflicts early and propose alternatives rather than routing around them silently.
Verification and automation
- Run and own physical verification: DRC, connectivity/LVS-style netlist checks, and cross-domain consistency between die, package, substrate, and board.
- Manage netlists for heterogeneous assemblies across revisions and product variants.
- Build scripted automation (SKILL, Python, or equivalent) for repetitive layout, checking, and release tasks.
Build support
- Support test vehicle definition, first builds, bring-up, failure analysis, and yield learning - including layout changes driven by assembly reality.
- BS or MS in Electrical Engineering, or equivalent practical background.
- 6+ years of IC package physical design, including at least one product taken from concept through tape-out and volume-relevant build.
- Expert-level proficiency in a package layout tool: Cadence Allegro Package Designer / APD+ / SiP, Siemens Xpedition Package Designer, Synopsys IC Package, or equivalent.
- Demonstrated experience with multi die packaging: 2D or 2.5/3D integration.
- Working fluency with multi-layer organic substrate construction and how material and stack-up choices constrain routing.
- Practical experience closing DFM/DFA with external substrate suppliers and OSATs.
- Comfortable working in English across a distributed team and multiple time zones.
- Demonstrated experience with advanced packaging: 2.5D/3D integration, RDL, TSV interposers, fan-out, microbump or Cu-pillar flip-chip.
- Layout for 112G/224G SerDes or comparable high-speed interfaces; familiarity with signal and power integrity workflows (e.g. Cadence Sigrity/PowerSI, Ansys).
- Familiarity with mask and RDL vendor flows, GDS-based layout environments (Virtuoso, KLayout), and AutoCAD file exchange.
- Experience with package/IC co-design environments (e.g. Cadence Integrity 3D-IC).
- Scripting for design automation and rule checking.
- Experience at a startup or on a first-of-its-kind product, where the design rules did not exist yet.
Most package layout roles are a step in someone else's flow. Here, the package is the product. You will be one of a handful of people who determine whether a next-generation optical engine is manufacturable, and you will see your layout decisions land in silicon and in an OSAT line within months, not years.