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Chip Design Jobs in Georgia (NOW HIRING)

Senior IC Packaging Designer

Atlanta, GA ยท On-site

$98K - $104K/yr

Participate in design reviews, prototype builds, and failure analysis to improve RF performance and yield. * Collaborate with RFIC designers to co-optimize chip and package performance, minimizing ...

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... design and develop reliable, secure cloud applications for high profile Irish and international blue\-chip clients. \n \n \n \n \n \n If you are a talented PHP Developer who would like to work as ...

Pega PRPC Developer (CSA/CSSA)

Atlanta, GA ยท On-site

$54 - $71/hr

Experience in eligibility and enrollment systems (e.g., Medicaid, ACA marketplace, CHIP or ... design * Troubleshoot and resolve defects, ensuring performance and scalability

Technical Director Validation

Johns Creek, GA ยท Hybrid

$160K - $298K/yr

Overview Rambus, a premier chip and silicon IP provider, is seeking to hire an exceptional ... Work with silicon design teams to develop experiments, drive data collection, and present results ...

Technical Director Validation

Johns Creek, GA ยท Hybrid

$160K - $298K/yr

Rambus, a premier chip and silicon IP provider, is seeking to hire an exceptional Technical ... Work with silicon design teams to develop experiments, drive data collection, and present results ...

Technical Director Validation

Johns Creek, GA ยท On-site

$160K - $298K/yr

Overview Rambus, a premier chip and silicon IP provider, is seeking to hire an exceptional ... Work with silicon design teams to develop experiments, drive data collection, and present results ...

... blue-chip companies. Combining the platform's global reach with market intelligence in both ... Manage multiple design projects simultaneously, meet deadlines, and prioritize tasks effectively.

... blue-chip companies. Combining the platform's global reach with market intelligence in both ... Manage multiple design projects simultaneously, meet deadlines, and prioritize tasks effectively.

Senior Staff Analog Engineer

Suwanee, GA ยท On-site

$97K - $133K/yr

Provide floor-planning and support integration of digital & analog circuits at the full-chip level; * Work in cooperation with the methodology and CAD groups; * Interface between different teams to ...

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Rambus, a premier chip and silicon IP provider, is seeking to hire an exceptional Sr. Principal Engineer with signal integrity and package design experience to join our Memory Interface Chips BU ...

SPE Signal Integrity Engineer

Johns Creek, GA ยท On-site

$133K - $248K/yr

Overview Rambus, a premier chip and silicon IP provider, is seeking to hire an exceptional Sr. Principal Engineer with signal integrity and package design experience to join our Memory Interface ...

Overview Rambus, a premier chip and silicon IP provider, is seeking to hire an exceptional Sr. Principal Engineer with signal integrity and package design experience to join our Memory Interface ...

... blue-chip companies. Combining the platform's global reach with market intelligence in both ... Process minor project work, defined as work not requiring extensive design or coordination ...

... blue-chip companies. Combining the platform's global reach with market intelligence in both ... Process minor project work, defined as work not requiring extensive design or coordination ...

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Showing results 1-20

Chip Design information

See Georgia salary details

$35.5K

$96.7K

$170.1K

How much do chip design jobs pay per year?

As of Jul 6, 2026, the average yearly pay for chip design in Georgia is $96,674.00, according to ZipRecruiter salary data. Most workers in this role earn between $70,500.00 and $121,600.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive in the Chip Design position, and why are they important?

To excel in Chip Design, a strong background in electrical engineering, digital and analog circuit design, and semiconductor physics is typically required, often supported by a relevant engineering degree. Familiarity with electronic design automation (EDA) tools like Cadence, Synopsys, and Mentor Graphics, as well as proficiency in hardware description languages (HDLs) such as Verilog or VHDL, are standard prerequisites. Outstanding problem-solving skills, attention to detail, and the ability to collaborate closely with cross-functional teams set candidates apart. These competencies are essential for designing efficient, reliable integrated circuits and meeting the evolving needs of the semiconductor industry.

What are the typical career progression opportunities in a Chip Design role?

Chip Design offers a clear pathway for career growth, starting from entry-level positions such as Design Engineer or Verification Engineer and progressing to roles like Lead Designer, Project Manager, or Technical Architect. As you gain experience and demonstrate expertise, opportunities often open up in specialized areas such as physical design, timing analysis, or system architecture. Many professionals also advance to leadership or managerial positions, overseeing teams or entire design projects. Additionally, working in such a fast-evolving field keeps you engaged with the latest technologies and can provide options to transition into adjacent areas like product management or application engineering.

Is chip design a good career?

Chip design is a specialized field within electronics engineering focused on creating integrated circuits and microchips. It offers high demand, competitive salaries, and opportunities to work with advanced technology, but requires strong skills in electronics, programming, and often a relevant degree or certification. Career growth depends on industry trends and individual expertise in areas like VLSI design and CAD tools.

How do you become a chip designer?

To become a chip designer, typically a candidate needs a bachelor's degree in electrical engineering, computer engineering, or a related field, along with strong skills in digital logic, circuit design, and hardware description languages like VHDL or Verilog. Gaining experience through internships, developing proficiency with CAD tools, and staying updated on industry standards are also important steps in pursuing a career in chip design.

What is a Chip Design job?

A Chip Design job involves creating and developing semiconductor circuits used in electronic devices. Engineers in this field work on designing, verifying, and testing integrated circuits (ICs) to ensure performance, power efficiency, and reliability. They use specialized software tools for designing hardware and optimizing functionality. Chip designers collaborate with cross-functional teams to bring new processors, memory chips, or custom ASICs from concept to production. This role is crucial in industries like computing, telecommunications, and consumer electronics.

How much do chip designers make?

Chip designers, also known as integrated circuit designers, typically earn between $80,000 and $150,000 annually, depending on experience, education, and location. Senior roles or those with specialized skills in hardware description languages and CAD tools can earn higher salaries, often exceeding $200,000.

What engineer makes $500,000 a year?

Senior chip design engineers with extensive experience, advanced skills in hardware description languages, and expertise in complex integrated circuit development can earn salaries approaching or exceeding $500,000 annually, especially in high-cost living areas or within leading technology companies. Such roles often require advanced degrees, certifications, and a strong track record of successful project delivery.
What are the most commonly searched types of Chip Design jobs in Georgia? The most popular types of Chip Design jobs in Georgia are:
What job categories do people searching Chip Design jobs in Georgia look for? The top searched job categories for Chip Design jobs in Georgia are:
What cities in Georgia are hiring for Chip Design jobs? Cities in Georgia with the most Chip Design job openings:

Senior IC Packaging Designer

Falcomm

Atlanta, GA โ€ข On-site

$98K - $104K/yr

Full-time

Medical, Dental, Vision, Retirement, PTO

Posted 25 days ago

Be an early applicant


Job description

Are you passionate about advancing semiconductor technologies and enabling next-generation wireless systems? At Falcomm, we are transforming innovative semiconductor research into real-world solutions through high-performance, energy-efficient RF power amplifier technologies. Our mission is to deliver cutting-edge wireless solutions that push the boundaries of performance, efficiency, and integration.

Falcomm is seeking an IC Packaging Designer to support the development and implementation of advanced semiconductor packaging solutions for RF integrated circuits. This role will focus on designing and optimizing package architectures that support high-frequency performance, thermal efficiency, and manufacturability. The position requires close collaboration with RFIC designers, layout engineers, testing teams, and manufacturing partners to ensure successful integration of silicon, GaN, or III-V MMICs devices into production-ready packages.

Responsibilities:
  • Design and develop RFIC packages and substrates optimized for high-frequency performance, including laminate, ceramic, or leadframe-based packages.
  • Create package layouts, bond diagrams, and substrate routing using semiconductor packaging EDA tools.
  • Work with signal integrity, EM, and thermal simulation teams to validate package performance.
  • Generate package documentation, fabrication drawings, and assembly specifications.
  • Participate in design reviews, prototype builds, and failure analysis to improve RF performance and yield.
  • Collaborate with RFIC designers to co-optimize chip and package performance, minimizing parasitics and signal loss.
  • Support package integration with PCB design teams to ensure optimal RF performance at the system level.
  • Coordinate with fabrication and assembly partners.

Requirements

  • Bachelorโ€™s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline.
  • 3-5 years of experience designing advanced RFIC semiconductor packages up to 50GHz (e.g., wirebond, flip-chip, PoP, or SiP) using tools such as Cadence Allegro APD/SiP or Mentor Xpedition.
  • Strong foundation in electrical, thermal, materials, or mechanical engineering principles relevant to IC packaging.
  • Must be willing to work full-time, onsite, in Atlanta, GA.
Preferred Skills:
  • Familiarity with signal and power integrity analysis tools (e.g., HFSS, Q3D, PowerSI) and understanding of high-speed interface requirements such as DDR or PCIe.
  • Knowledge of substrate manufacturing processes, package layout constraints, and design verification tools including CAM350, Valor, or Calibre.
  • Experience with RFIC or 5G packaging design, along with scripting or automation skills (Python, TCL, Perl, or shell) to support design workflows.
  • Ability to build accurate 3-D models of packages using Ansys Electronics Desktop and EM-simulate them in HFSS and run thermal simulations on them with Icepak

Benefits

  • Competitive Salary and Equity Package
  • Comprehensive Health, Dental, and Vision Insurance
  • 401(k) Retirement Plan
  • Paid Time Off (PTO) and Sick Leave

Disclosure:

  • Falcomm is an Equal Opportunity Employer; employment with Falcomm is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
  • Applicants wishing to view a copy of Falcommโ€™s Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should notify Falcomm.
  • To conform to U.S. Government export regulations, including the International Traffic in Arms Regulations (ITAR) you must be a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. Department of State.