Board Level Hardware Design Jobs (NOW HIRING)

Senior Hardware Design Engineer – Imaging Systems and High-Speed Electronics

We are seeking an experienced Senior Hardware Design Engineer to lead the design and development of advanced PCB-based imaging platforms for next-generation CMOS image sensors, board-level cameras, and X-ray camera systems. This role requires deep expertise in high-speed digital hardware design, signal integrity, sensor integration, and system-level optimization for imaging performance and interface interoperability.

In addition to hands-on technical leadership, this role may include responsibility for mentoring engineers, driving technical direction across projects, and contributing to team growth and engineering excellence.

Key Responsibilities

Technical Leadership and Team Development

• Provide technical leadership across hardware development programs for imaging and sensor-based products.
• Mentor and guide junior and mid-level hardware engineers in schematic design, PCB layout, debug methodologies, and engineering best practices.
• Lead hardware design reviews, architecture discussions, and cross-functional technical decision-making.
• Establish and promote engineering standards for high-speed PCB design, signal integrity, documentation, and validation.
• Support project planning, task prioritization, resource estimation, and execution tracking for hardware development activities.
• May directly manage a small team of hardware engineers, including:

• goal setting and performance feedback,
• career development and coaching,
• hiring and onboarding support.

Board-Level Camera and CMOS Image Sensor Platforms

• Architect, design, and validate high-performance PCBs for board-level camera systems supporting state-of-the-art CMOS image sensors.
• Develop hardware platforms for:

• image sensor bring-up and debugging,
• electrical and optical characterization,
• internal evaluation platforms,
• customer demonstration systems.

• Design interfaces and interconnects for high-speed sensor communication, including:

• SLVS/SLVS-EC
• MIPI CSI-2 / D-PHY / C-PHY
• LVDS and other high-speed serial interfaces.

• Collaborate with sensor, firmware, software, and applications teams to ensure successful sensor integration and system functionality.
• Optimize board architecture, power delivery, grounding, clocking, and layout to maximize sensor performance and minimize electrical noise.
• Evaluate and mitigate hardware design impacts on end-user image quality, including:

• noise floor,
• fixed pattern noise,
• EMI/EMC coupling,
• timing integrity,
• power integrity artifacts.

X-ray Camera Electronics

• Design and develop hardware platforms for X-ray camera systems integrating image sensors, detector electronics, and high-speed data interfaces.
• Architect PCB solutions for sensor interface, power management, control electronics, and data acquisition subsystems.
• Lead hardware development focused on robust USB-C interoperability, including:

• USB-C orientation support,
• enumeration and configuration reliability,
• sustained high-bandwidth streaming performance,
• cable and host interoperability robustness.

• Analyze and debug signal integrity challenges across USB-C and other high-speed interfaces in demanding imaging applications.

Signal Integrity and Hardware Excellence

• Serve as subject matter expert in PCB design for high-speed/high-density electronics.
• Perform and guide best practices for:

• signal integrity analysis,
• impedance control,
• differential pair routing,
• return path management,
• power integrity optimization.

• Drive design reviews, schematic reviews, layout reviews, and hardware validation plans.
• Support prototype bring-up, debug, failure analysis, and design iteration.

Required Qualifications

• BS/MS in Electrical Engineering or related field.
• 8+ years of hardware design experience, including complex multilayer PCB design.
• Proven expertise designing high-speed digital systems and high-density PCBs.
• Demonstrated technical leadership, mentoring, or team lead experience.
• Strong hands-on experience with CMOS image sensor integration and board-level camera development.
• Deep working knowledge of:

• SLVS / SLVS-EC,
• MIPI CSI-2,
• USB-C,
• LVDS and related high-speed interfaces.

• Strong understanding of:

• signal integrity,
• power integrity,
• EMI/EMC considerations,
• high-speed layout constraints.

• Experience with schematic capture and PCB layout tools such as Altium Designer, Cadence Allegro, or equivalent.
• Hands-on lab debugging skills using oscilloscopes, protocol analyzers, logic analyzers, and related instrumentation.

Preferred Qualifications

• Prior direct people management experience.
• Experience with X-ray imaging systems or medical/industrial imaging electronics.
• Familiarity with detector electronics, analog front ends, and low-noise sensor systems.
• Experience supporting customer evaluation platforms and demo systems.
• Knowledge of image quality characterization and hardware contributions to imaging artifacts.

Desired Attributes

• Strong system-level thinking across hardware, firmware, optics, and software boundaries.
• Ability to independently drive complex hardware projects from concept through validation.
• Strong technical communication and stakeholder management skills.
• Ability to balance hands-on engineering depth with technical leadership and team development.

Why Join Us

• Work on cutting-edge imaging technology with real-world impact.
• High level of technical ownership and influence on system architecture.
• Collaborative, engineering-driven culture.
• Competitive compensation and benefits package.

Fairchild Imaging provides our employees with a range in benefits offerings that includes:

• 9/80 Schedule - You get every other Friday off!
• Medical, Dental and Vision coverage with multiple plan offerings
• Health Savings Account with an employer contribution annually
• 401(k) retirement plans with Employer matching
• Tuition Reimbursement
• Generous Paid Time Off policy

The compensation salary range for this role is $180,000 to $200,000. Actual compensation packages are based on several factors that are unique to each candidate, including but not limited to skill set, depth of experience, education, certifications, and knowledge.