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Advanced Packaging Jobs (NOW HIRING)

Amat

Technologist, Advanced Packaging Director

Austin, TX · On-site

$176K - $242K/yr

This role focuses on advanced packaging process integration, with particular emphasis on materials and process development while ensuring seamless integration across manufacturing processes on large ...

Sigma Design

Semiconductor Packaging Engineer

Redmond, WA · On-site

$115K - $145K/yr

Develop and implement advanced packaging solutions to enable heterogeneous, flexible, and stretchable integration of electronic components and devices. * Design and oversee internal, external, and ...

Sigma Design

Semiconductor Packaging Engineer

Redmond, WA · On-site

$115K - $145K/yr

Develop and implement advanced packaging solutions to enable heterogeneous, flexible, and stretchable integration of electronic components and devices. * Design and oversee internal, external, and ...

Etched

Advanced Packaging SI/PI Engineer

San Jose, CA · On-site

$150K - $275K/yr

The ideal candidate will have extensive experience with high-power package and board designs, robust power delivery networks, and high-speed signaling solutions in advanced packaging. You will work ...

Etched

Advanced Packaging SI/PI Engineer

San Jose, CA · On-site

$150K - $275K/yr

The ideal candidate will have extensive experience with high-power package and board designs, robust power delivery networks, and high-speed signaling solutions in advanced packaging. You will work ...

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How much do advanced packaging jobs pay per hour?

As of Jun 4, 2026, the average hourly pay for advanced packaging in the United States is $18.85, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.95 per hour, depending on experience, location, and employer.

What is an Advanced Packaging job?

An Advanced Packaging job involves developing and implementing semiconductor packaging technologies to enhance performance, power efficiency, and miniaturization. Professionals in this role work on heterogeneous integration, 2.5D/3D packaging, wafer-level packaging, and advanced interconnect solutions. They collaborate with design, process, and manufacturing teams to optimize package reliability and scalability. This role is critical in enabling next-generation chips for applications like AI, high-performance computing, and mobile devices.

What are the key skills and qualifications needed to thrive in the Advanced Packaging position, and why are they important?

To excel in Advanced Packaging, you need a strong background in materials science, engineering, semiconductor fabrication, and process optimization, often supported by a relevant degree and industry experience. Familiarity with advanced packaging equipment, cleanroom protocols, and design software such as CAD tools or SEM analysis is typically required. Attention to detail, problem-solving abilities, and effective cross-functional communication are valuable soft skills in this role. These competencies are vital for developing innovative packaging solutions that meet stringent technical standards and support product reliability in high-tech manufacturing environments.

What are the most common challenges faced by professionals in Advanced Packaging roles?

Professionals in Advanced Packaging frequently encounter challenges related to keeping pace with rapidly evolving semiconductor technologies and strict quality control standards. The work often requires collaborating closely with R&D, process engineering, and manufacturing teams to troubleshoot issues and continuously improve packaging designs. Maintaining precision in a high-stakes, cleanroom environment and adapting to new materials or methods are also common aspects of the job. These challenges offer valuable opportunities for skill development and innovation, making the role both demanding and rewarding for those passionate about advanced manufacturing.
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Advanced Packaging jobs near you
Infographic showing various Advanced Packaging job openings in the United States as of May 2026, with employment types broken down into 2% Locum Tenens, 3% As Needed, 33% Full Time, 54% Part Time, 7% Contract, and 1% Nights. Highlights an 97% Physical, 1% Hybrid, and 2% Remote job distribution, with an average salary of $39,198 per year, or $18.8 per hour.
Semiconductor Advanced Packaging Engineer - Irvine, California

Semiconductor Advanced Packaging Engineer - Irvine, California

Intermedia Group, Inc.

Lake Forest, CA • On-site

$120K - $150K/yr

Other

Posted 3 days ago

Job description

OPEN JOB: Principal Application Engineer - Semiconductor Advanced Package
LOCATION:Irvine, California
***Relocation Assistance Available
SALARY: $120,000 to $150,000
INDUSTRY:Manufacturing & Production
JOB CATEGORY:Engineering - Industrial / Manufacturing
This position is with our Adhesive Technologies business unit - where we empower our people to transform industries and provide our customers with a competitive advantage through adhesives, sealants and functional coatings.
What youll do
  • Technical service engineer who provides technical engineering support for the company's Advanced Packaging Material products and responsible for developing in depth application knowledge for the company's Electronics markets.
  • Primary responsibilities are technical leading on developmental and commercialized products by optimization of material application processes, and direct interaction with customers to troubleshoot and solve product and process related problems.
  • She/he ensures that new and existing products can be successfully employed by the customers in a manner that brings clear and identifiable value.
  • Solves technology-specific fundamental problems associated with entire product lines and/or product classes by novel approaches to application process development, troubleshooting, and material characterization.

What makes you a good fit
  • Minimum of a bachelor's degree in Material Science/Engineering, Mechanical Engineering, Chemical Engineering, or other related fields, with 10+ years of experience working in a chemical for semiconductor advanced packaging environment.
  • ***Good understanding for the latest Semiconductor Packaging trend. Especially 2.5D and 3D package
  • Expertise in wafer level encapsulation and molding process in semiconductor package
  • Have strong verbal communication skills one-on-one with colleagues/customers as well as in front of groups with solid interpersonal skills, with ability to work as a team member and independently on multi-task assignments
  • Strong ownership and responsibility with customer-oriented mindset and good understanding of customer request & culture
  • Effective in using project and time management skills to drive projects to completion and focus on commitment to deliver the highest level of quality work consistently
  • Traveling of up to 10% will be part of this role.

If you are interested in pursuing this opportunity, please respond back and include the following:
  • Full MS WORD Resume
  • Required compensation
  • Contact information
  • Availability
Upon receipt, one of our managers will contact you to discuss in full
JASON DENMARK
Recruiting Manager
INTERMEDIA GROUP, INC.
EMAIL:jdenmark@intermediagroup.com
LINKEDIN:https://www.linkedin.com/in/jasondenmark

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