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How much do advanced packaging jobs pay per hour?

As of Aug 9, 2026, the average hourly pay for advanced packaging in the United States is $18.85, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.95 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive in advanced packaging?

To excel in Advanced Packaging, you need a strong background in materials science, engineering, semiconductor fabrication, and process optimization, often supported by a relevant degree and industry experience. Familiarity with advanced packaging equipment, cleanroom protocols, and design software such as CAD tools or SEM analysis is typically required. Attention to detail, problem-solving abilities, and effective cross-functional communication are valuable soft skills in this role. These competencies are vital for developing innovative packaging solutions that meet stringent technical standards and support product reliability in high-tech manufacturing environments.

What are the most common challenges faced by professionals in advanced packaging roles?

Professionals in Advanced Packaging frequently encounter challenges related to keeping pace with rapidly evolving semiconductor technologies and strict quality control standards. The work often requires collaborating closely with R&D, process engineering, and manufacturing teams to troubleshoot issues and continuously improve packaging designs. Maintaining precision in a high-stakes, cleanroom environment and adapting to new materials or methods are also common aspects of the job. These challenges offer valuable opportunities for skill development and innovation, making the role both demanding and rewarding for those passionate about advanced manufacturing.

What is an advanced packaging?

An Advanced Packaging job involves developing and implementing semiconductor packaging technologies to enhance performance, power efficiency, and miniaturization. Professionals in this role work on heterogeneous integration, 2.5D/3D packaging, wafer-level packaging, and advanced interconnect solutions. They collaborate with design, process, and manufacturing teams to optimize package reliability and scalability. This role is critical in enabling next-generation chips for applications like AI, high-performance computing, and mobile devices.

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Advanced Packaging jobs near you
Infographic showing various Advanced Packaging job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 80% Full Time, 16% Part Time, and 3% Contract. Highlights an 86% Physical, 2% Hybrid, and 12% Remote job distribution, with an average salary of $39,198 per year, or $18.8 per hour.

Advanced Packaging Integration Engineer

Applied Materials

Santa Clara, CA • On-site

$161K - $221K/yr

Full-time

Re-posted 24 days ago

Applied Materials rating

8.7

Company rating: 8.7 out of 10

Based on 57 frontline employees who took The Breakroom Quiz

15th of 537 rated manufacturers

Job description

Who We Are
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world - like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.
What We Offer
Salary:
$161,000.00 - $221,000.00
Location:
Santa Clara,CA
You'll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more.
At Applied Materials, we care about the health and wellbeing of our employees. We're committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.
Join the Photonics Platform Business Group at Applied Materials located in Santa Clara headquarters, work with a high caliber cross-functional research team to develop advanced packaging solutions for next-generation smart glasses and high-performance optical interconnects.
As an Advanced Packaging Integration Engineer, you will lead process integration for high-performance interconnects and micro-LED panels. You will architect robust, scalable integration flows that meet manufacturability and reliability requirements while driving differentiated technology development. Success in this role requires close collaboration with fabs, assembly houses, suppliers, and cross-functional teams across Applied Materials and external partners. You will work closely with design, process, integration, and metrology teams to deliver production-ready solutions.
Key Responsibilities:
  • Define, develop, execute, and optimize advanced packaging process integration flows (e.g., hybrid bonding, 2.5D/3D heterogeneous integration), to ensure the highest possible product performance, yield, and reliability.

  • Own, manage, and drive complex technical projects, track progress and solve roadblocks to ensure on time delivery with high quality.

  • Design experiments, systematically collect and analyze data, drive root-cause analysis and implement corrective actions.

  • Collaborate with foundries, OSATs, and internal research teams to define and implement improved integration strategies and methodologies.

  • Stay abreast of the latest field advancements. Apply such knowledge to drive innovations.

Qualifications
  • Ph.D. or M. S. degree in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or a related STEM field.

  • In-depth knowledge and hands-on experience in advanced packaging technologies, including wafer-to-wafer or die-to-wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes. Candidates with varying experience levels are encouraged to apply. Micro-LED or CPO experience is a plus.

  • Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams.

  • Proficient in statistical data analysis and process optimization and control techniques (e.g., Design of Experiments, SPC, JMP). Coding capability is a plus.

  • Experience with MES systems is a plus.

  • Ability to prepare clear, compelling executive-level or customer-facing presentations is a plus.

  • Self-starter with strong problem-solving skills; able to work both independently and in team environments with minimal supervision.

Additional Information
Time Type:
Full time
Employee Type:
Assignee / Regular
Travel:
Yes, 10% of the Time
Relocation Eligible:
Yes
The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.
For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.

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About Applied Materials

Sourced by ZipRecruiter

Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We're the brain (and the brawn) behind every new technology development--whether it's building semiconductor chips for smartphones and computers, or the underpinnings for robotics, AI and even smart TV display screens. With 27,000 employees in 19 countries, we offer an exciting place to grow and learn alongside some of the best people you'll ever meet. We take deep pride in our Culture of Inclusion, and we celebrate the diverse backgrounds, perspectives and experiences that help us build stronger, more resilient teams. Join us as we innovate to Make Possible a Better Future!

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1967

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