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Advanced Packaging Jobs in Arizona (NOW HIRING)

Marvell

Package Design Engineer

Chandler, AZ · On-site

$133K/yr

Your Team, Your Impact Advanced Packaging Physical Design for Photonic Fabric BU What You Can Expect * Package Design: * Lead Si/package/PCB/system co-design work collaborating with downstream system ...

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...

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How much do advanced packaging jobs pay per hour?

As of Jun 25, 2026, the average hourly pay for advanced packaging in Arizona is $17.56, according to ZipRecruiter salary data. Most workers in this role earn between $15.24 and $18.61 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive in the Advanced Packaging position, and why are they important?

To excel in Advanced Packaging, you need a strong background in materials science, engineering, semiconductor fabrication, and process optimization, often supported by a relevant degree and industry experience. Familiarity with advanced packaging equipment, cleanroom protocols, and design software such as CAD tools or SEM analysis is typically required. Attention to detail, problem-solving abilities, and effective cross-functional communication are valuable soft skills in this role. These competencies are vital for developing innovative packaging solutions that meet stringent technical standards and support product reliability in high-tech manufacturing environments.

What are the most common challenges faced by professionals in Advanced Packaging roles?

Professionals in Advanced Packaging frequently encounter challenges related to keeping pace with rapidly evolving semiconductor technologies and strict quality control standards. The work often requires collaborating closely with R&D, process engineering, and manufacturing teams to troubleshoot issues and continuously improve packaging designs. Maintaining precision in a high-stakes, cleanroom environment and adapting to new materials or methods are also common aspects of the job. These challenges offer valuable opportunities for skill development and innovation, making the role both demanding and rewarding for those passionate about advanced manufacturing.

What is an Advanced Packaging job?

An Advanced Packaging job involves developing and implementing semiconductor packaging technologies to enhance performance, power efficiency, and miniaturization. Professionals in this role work on heterogeneous integration, 2.5D/3D packaging, wafer-level packaging, and advanced interconnect solutions. They collaborate with design, process, and manufacturing teams to optimize package reliability and scalability. This role is critical in enabling next-generation chips for applications like AI, high-performance computing, and mobile devices.

What are popular job titles related to Advanced Packaging jobs in Arizona? For Advanced Packaging jobs in Arizona, the most frequently searched job titles are:
What job categories do people searching Advanced Packaging jobs in Arizona look for? The top searched job categories for Advanced Packaging jobs in Arizona are:
What cities in Arizona are hiring for Advanced Packaging jobs? Cities in Arizona with the most Advanced Packaging job openings:
Advanced Packaging jobs near you
Infographic showing various Advanced Packaging job openings in Arizona as of June 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution, with an average salary of $36,529 per year, or $17.6 per hour.

Advanced Packaging Principal Integration Technologist

Merck Group

Tempe, AZ • On-site

$178K - $287K/yr

Full-time

Medical, Retirement, PTO

Posted 5 days ago

Job description

Work Your Magic with us! Start your next chapter and join EMD Electronics.
Ready to explore, break barriers, and discover more? We know you've got big plans - so do we! Our colleagues across the globe love innovating with science and technology to enrich people's lives with our solutions in Healthcare, Life Science, and Electronics. Together, we dream big and are passionate about caring for our rich mix of people, customers, patients, and planet. That's why we are always looking for curious minds that see themselves imagining the unimaginable with us.
Everything we do in EMD Electronics is to help us deliver on our purpose of being the company behind the companies, advancing digital living. We are dedicated to being the trusted supplier of high-tech materials, services and specialty chemicals for the electronics, automotive and cosmetics industries. We foster a global collaborative organization made up of individuals who have the passion to win, obsess about the customer, are relentlessly curious and act with urgency. Together, we push the boundaries of science to make more possible for our customers.
This role does not offer sponsorship for work authorization. External applicants must be eligible to work in the US.
Current Your Role:
In this role you will be instrumental in developing our High Performance Packaging (Advanced Packaging) opportunity definition, ecosystem engagement strategy and program development. By connecting across key business unit partners and leveraging EMD Electronics core competencies, the candidate will drive business and product development from idea to proof of concept for transfer to high volume manufacturing.
The ideal candidate will combine a deep equipment, process and integration knowledge of High Performance Packaging technologies (including Wafer Level Packaging, Hybrid Bonding, Fusion bonding and adjacent technologies) with a vast ecosystem network (both equipment suppliers and IDM/Foundry/Memory customers).
The perferred location for this role is Tempe, AZ. Other US locations may be considered.
Responsibilities:
  • Through technical expertise, identify and stay ahead of key High Performance Packaging (Advanced Packaging) technology inflection points and roadmaps
  • Through industry/ecosystem connections continue to acquire in-depth strategic knowledge of customer and OEM roadmaps
  • Transfer knowledge/educate peers (both laterally and up) on High Performance Packaging (Advanced Packaging) roadmaps
  • Leverage industry knowledge to identify process/equipment/integration challenges
  • Work across BU's and CTO office to identify material solutions/developments to solve industry challenges
  • Leverage industry network and connections to engage the ecosystem on collaborative development opportunities
  • Leverage deep technical knowledge to ensure development programs are identifying and meeting industry standard datasets
  • Ensure development programs are leveraging industry expertise to deliver relevant datasets in the timeliest manner

Who You Are
Minimum Qualifications:
  • MSc or higher (Mechanical Eng, Electrical Eng, Chem Eng or related engineering fields)
  • 10+ Years 300mm Process/ Equipment R&D hands on experience
    • Advanced Packaging (300mm) Equipment Tool owner
    • Advanced Packaging Thin Films Dep/CMP/Bonding or Patterning Process development
    • Developing integration and process flows
  • 7+ years of collaborative external business developments
    • SOW (Scope of Work)/ POC (Proof of Concept)/DOE's on equip/material definition

Preferred Qualifications:
  • 5+ years experience of Adv Pkg Consortia engagements (IMEC, Fraunhofer, CEA Leti, etc) including engagement model definition/ SOW development/ POC execution
  • Demonstrated ability to work in highly ambiguous environments
  • Demonstrated ability to work across matrixed organizations and deliver results
  • Demonstrated ability to influence up to garner resources
  • Entrepreneurial mindset
  • Ability to condense complicated material down to key actionable items
  • Ability to enroll resources to deliver success
  • Demonstrated knowledge of customer/supplier interactions and how best to 'mine' the 'why's & how's' from those conversations
  • Self-starter, ability to operate with little direction

Pay Range for this position: $178,600 - $287,900
The offer range represents the anticipated low and high end of the base pay compensation for this position. The actual compensation offered will be determined by factors such as location, level of experience, education, skills, and other job-related factors. Position may be eligible for sales or performance-based bonuses. Benefits offered by the Company include health insurance, paid time off (PTO), retirement contributions, and other perquisites. For more information click here.
What we offer: We are curious minds that come from a broad range of backgrounds, perspectives, and life experiences. We believe that this variety drives excellence and innovation, strengthening our ability to lead in science and technology. We are committed to creating access and opportunities for all to develop and grow at your own pace. Join us in building a culture of inclusion and belonging that impacts millions and empowers everyone to work their magic and champion human progress!
Apply now and become a part of a team that is dedicated to Sparking Discovery and Elevating Humanity!

Apply