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Advanced Packaging Jobs in Arizona (NOW HIRING)

Prior experience in optimizing silicon performance and conducting tradeoff studies for advanced packaging designs. Join Intel and become an integral part of shaping tomorrow's technology today. Apply ...

Expertise in advanced packaging architectures such as EMIB and Foveros. * 5+ years of strong analytical and problem-solving skills: identifying, isolating, and debugging issues and providing creative ...

Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx)

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...

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Advanced Packaging information

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How much do advanced packaging jobs pay per hour?

As of Jun 26, 2026, the average hourly pay for advanced packaging in Arizona is $17.56, according to ZipRecruiter salary data. Most workers in this role earn between $15.24 and $18.61 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive in the Advanced Packaging position, and why are they important?

To excel in Advanced Packaging, you need a strong background in materials science, engineering, semiconductor fabrication, and process optimization, often supported by a relevant degree and industry experience. Familiarity with advanced packaging equipment, cleanroom protocols, and design software such as CAD tools or SEM analysis is typically required. Attention to detail, problem-solving abilities, and effective cross-functional communication are valuable soft skills in this role. These competencies are vital for developing innovative packaging solutions that meet stringent technical standards and support product reliability in high-tech manufacturing environments.

What are the most common challenges faced by professionals in Advanced Packaging roles?

Professionals in Advanced Packaging frequently encounter challenges related to keeping pace with rapidly evolving semiconductor technologies and strict quality control standards. The work often requires collaborating closely with R&D, process engineering, and manufacturing teams to troubleshoot issues and continuously improve packaging designs. Maintaining precision in a high-stakes, cleanroom environment and adapting to new materials or methods are also common aspects of the job. These challenges offer valuable opportunities for skill development and innovation, making the role both demanding and rewarding for those passionate about advanced manufacturing.

What is an Advanced Packaging job?

An Advanced Packaging job involves developing and implementing semiconductor packaging technologies to enhance performance, power efficiency, and miniaturization. Professionals in this role work on heterogeneous integration, 2.5D/3D packaging, wafer-level packaging, and advanced interconnect solutions. They collaborate with design, process, and manufacturing teams to optimize package reliability and scalability. This role is critical in enabling next-generation chips for applications like AI, high-performance computing, and mobile devices.

What are popular job titles related to Advanced Packaging jobs in Arizona? For Advanced Packaging jobs in Arizona, the most frequently searched job titles are:
What cities in Arizona are hiring for Advanced Packaging jobs? Cities in Arizona with the most Advanced Packaging job openings:
Infographic showing various Advanced Packaging job openings in Arizona as of June 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution, with an average salary of $36,529 per year, or $17.6 per hour.
Foundry Services Advanced Packaging Account Technical Solutions Engineer

Foundry Services Advanced Packaging Account Technical Solutions Engineer

Intel Corporation

Phoenix, AZ • On-site

Full-time

Medical, Retirement, PTO

Posted 12 days ago


Intel rating

8.7

Company rating: 8.7 out of 10

Based on 144 frontline employees who took The Breakroom Quiz

10th of 139 rated electronics manufacturers


Job description

Job Details:
Job Description:
Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.
As stewards of Moore's Law, we persistently innovate and foster collaboration within an extensive partner ecosystem to advance technologies and enable our customers to design leadership products. Our strategic investments in geographically diverse manufacturing capacities bolster the resilience of the semiconductor supply chain, particularly for advanced products. Leveraging our technological prowess, expansive manufacturing scale, and a more sustainable supply chain, Intel Foundry empowers the world to deliver essential computing, server, mobile, networking, and automotive systems for the AI era.
About the Role
Intel Foundry Services is seeking a highly experienced and collaborative Packaging and Test Account Technical Solutions Engineer to lead customer engagements for key Packaging and Test customers. This role is pivotal in enabling our foundry customers who are using Intel's advanced technology solutions, including our cutting-edge Advanced Packaging capabilities.
Key Responsibilities:
  • Own the end-to-end customer relationship as the primary interface between the customer and Intel, ensuring seamless communication, trust, and alignment across all phases of engagement.
  • Work directly with customer to understand packaging challenges and requirements and provide technical consultation on packaging solutions and processes.
  • Engage expert stakeholders across Intel Foundry to ensure customers have firsthand access to information.
  • Collaborate with cross-functional teams including Technology Development, Product Engineering, Manufacturing and Operations, and Customer Engineering teams providing feedback to influence product and technology roadmaps.
  • Lead and coordinate all internal Intel interactions related to the customer account to drive commitment to execution across schedule, quality, technical execution, qualification and volume ramp.
  • Develop and maintain the Statement of Work (SOW) documenting customer requirements, Intel Foundry commitments, technical deliverables, and schedule milestones.
  • Manage full customer engagement lifecycle from initial design award through development, ramp, high volume manufacturing (HVM), and end of life.
    • Track and drive closure of customer commitment, action items and escalations.
    • Monitor milestones, risks, dependencies and change requests.
    • Drive resolution of issues affecting qualification and delivery.
    • Provide clear status reports to both customers and leadership.
    • Serve as the Voice of the Customer inside Intel Foundry, ensuring customer priorities, risks, and expectations are clearly communicated and advocated across all internal functions.

Required Skills and Experience
  • Experience in Semiconductor Packaging
  • Strong communication, project management and customer-facing skills
  • Ability to operate across both technical and operations discussions
  • Problem-solving and analytical thinking
  • Ability to explain complex technical concepts clearly
  • Willingness to travel

Preferred Skills and Experience
  • Strong communication, project management and customer-facing skills
  • Ability to operate across both technical and operations discussions
  • Problem-solving and analytical thinking
  • Ability to explain complex technical concepts clearly
  • Willingness to travel

Qualifications:
  • Bachelors or Masters Degree in Electrical Engineering, Materials Science, Mechanical Engineering or Chemical Engineering or related field.
  • 10+ years industry experience
  • 5+ years in Semiconductor Packaging, Assembly / Test or Backend Manufacturing, Operations, Product Engineering, Field Applications or customer-facing engineering

Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
US, California, Folsom, US, California, Santa Clara, US, Oregon, Hillsboro, US, Texas, Austin
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $220,320.00-311,040.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968