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Advanced Packaging Jobs (NOW HIRING)

Eridu AI

Advanced Packaging Engineer

Saratoga, CA · On-site

$230K - $275K/yr

Position Overview We are seeking a highly experienced Advanced Package Engineer to lead system module packaging and advanced single chip Flip Chip IC integration for next-generation high-performance ...

DensityAI

Advanced Packaging Engineer

Mountain View, CA

$200K - $350K/yr

Exceptional abilities across the full advanced packaging design and tradeoffs * 10+ years of experience on very high performance designs at advanced packaging like SIP, CoWoS, EMIB and other ...

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Marvell

Advanced Packaging Design

Chandler, AZ

$133.90K/yr

Your Team, Your Impact The Marvell Advanced Packaging team is responsible for package design and technology development to meet the electrical, mechanical, thermal and system requirements for the ...

Northrop Grumman Corporation

OR · Hybrid

The Advanced Packaging team develops and deploys next-generation microelectronics packaging technologies for future defense systems. We focus on development, prototyping, maturation, and scaling of ...

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How much do advanced packaging jobs pay per hour?

As of Jun 4, 2026, the average hourly pay for advanced packaging in the United States is $18.85, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.95 per hour, depending on experience, location, and employer.

What is an Advanced Packaging job?

An Advanced Packaging job involves developing and implementing semiconductor packaging technologies to enhance performance, power efficiency, and miniaturization. Professionals in this role work on heterogeneous integration, 2.5D/3D packaging, wafer-level packaging, and advanced interconnect solutions. They collaborate with design, process, and manufacturing teams to optimize package reliability and scalability. This role is critical in enabling next-generation chips for applications like AI, high-performance computing, and mobile devices.

What are the key skills and qualifications needed to thrive in the Advanced Packaging position, and why are they important?

To excel in Advanced Packaging, you need a strong background in materials science, engineering, semiconductor fabrication, and process optimization, often supported by a relevant degree and industry experience. Familiarity with advanced packaging equipment, cleanroom protocols, and design software such as CAD tools or SEM analysis is typically required. Attention to detail, problem-solving abilities, and effective cross-functional communication are valuable soft skills in this role. These competencies are vital for developing innovative packaging solutions that meet stringent technical standards and support product reliability in high-tech manufacturing environments.

What are the most common challenges faced by professionals in Advanced Packaging roles?

Professionals in Advanced Packaging frequently encounter challenges related to keeping pace with rapidly evolving semiconductor technologies and strict quality control standards. The work often requires collaborating closely with R&D, process engineering, and manufacturing teams to troubleshoot issues and continuously improve packaging designs. Maintaining precision in a high-stakes, cleanroom environment and adapting to new materials or methods are also common aspects of the job. These challenges offer valuable opportunities for skill development and innovation, making the role both demanding and rewarding for those passionate about advanced manufacturing.
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Advanced Packaging jobs near you
Infographic showing various Advanced Packaging job openings in the United States as of May 2026, with employment types broken down into 2% Locum Tenens, 3% As Needed, 33% Full Time, 54% Part Time, 7% Contract, and 1% Nights. Highlights an 97% Physical, 1% Hybrid, and 2% Remote job distribution, with an average salary of $39,198 per year, or $18.8 per hour.
Advanced Packaging Technologist

Advanced Packaging Technologist

Advanced Micro Devices, Inc

Austin, TX • On-site

$127.19K/yr

Full-time

Posted 28 days ago

Advanced Micro Devices rating

8.4

Company rating: 8.4 out of 10

Based on 7 frontline employees who took The Breakroom Quiz

25th of 139 rated electronics manufacturers

Job description

WHAT YOU DO AT AMD CHANGES EVERYTHING
At AMD, our mission is to build great products that accelerate next-generation computing experiences-from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you'll discover the real differentiator is our culture. We push the limits of innovation to solve the world's most important challenges-striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.
THE ROLE:
In this role, you will serve as a PCB-centric Mechanical Modeling Architect responsible for defining and driving next-generation packaging-platform architectures through rigorous, model-based decision making and System-Technology Co-Optimization (STCO). You will develop, validate, and apply mechanical and multi-physics models to guide package/board-level architecture, technology selection and integration of electro-thermal and electro-optical capabilities across package, board, and cooling solutions.
THE PERSON:
The ideal candidate is a self-directed technical leader who operates with a high degree of autonomy, communicates with clarity, and collaborates effectively across silicon, package, board, thermal, optical, mechanical, manufacturing, and system architecture teams. You are comfortable owning both the modeling rigor and experimental grounding required for STCO-driven architecture & design decisions and influence product and platform roadmaps for data center and high-performance computing systems.
KEY RESPONSIBILITIES:
  • Drive model-based architecture and design decisions for development and qualification of advanced PCB technologies, including materials, stack-ups, high-layer-count designs, stiffness control and SMT & manufacturability considerations.
  • Develop and maintain mechanical and multi-physics models (structural, thermo-mechanical, electro-thermal and electro-optical) & drive validation strategies partnering with internal and external labs as required to enable STCO across silicon, package, board and platform.
  • Partner with manufacturing and operations to define, optimize, and scale SMT and mechanical assembly processes, including component attach, solder joint reliability, assembly tolerances, yield, and connector strategies.
  • Engage with PCB suppliers, EMS partners, and component vendors to align material properties, process capabilities, and modeling assumptions with architecture and STCO needs.
  • Define targets and strategic direction for mechanical and PCB technology development, assess technology readiness, and influence product roadmaps.
  • Serve as mechanical & multi-physics subject-matter expert for PCB and board-level architectures with a primary focus on data center platforms.

PREFERRED EXPERIENCE:
  • Demonstrated experience owning model-based architecture & design decisions, supported by board-, package-, and system-level mechanical and multi-physics modeling, characterization and validation.
  • Strong background in advanced PCB technologies, including materials, high-layer-count designs, warpage and stiffness control, and assembly constraints.
  • Solid foundation in Mechanics, Fracture, Materials, Design & FEA with the ability to apply first-principles understanding to multi-physics package-and-system-level design & assembly trade-offs.
  • Experience influencing SMT processes, connectors, and mechanical assembly strategies from an architecture and modeling perspective.
  • Experience integrating electro-thermal and electro-optical technologies at the board and package level, informed by modeling and experimental correlation.
  • Proven relevant industry or research experience with increasing responsibility in modeling-driven system or platform architecture roles.

ACADEMIC CREDENTIALS:
MS or PhD in relevant Engineering disciplines or physics.
LOCATION:
Austin, Texas
This role is not eligible for visa sponsorship
#LI-AJ1
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD's "Responsible AI Policy" is available here.
This posting is for an existing vacancy.

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