OR · Hybrid
The Advanced Packaging team develops and deploys next-generation microelectronics packaging technologies for future defense systems. We focus on development, prototyping, maturation, and scaling of ...
OR · Hybrid
The Advanced Packaging team develops and deploys next-generation microelectronics packaging technologies for future defense systems. We focus on development, prototyping, maturation, and scaling of ...
OR · Hybrid
The Advanced Packaging team develops and deploys next-generation microelectronics packaging technologies for future defense systems. We focus on development, prototyping, maturation, and scaling of ...
Hillsboro, OR · On-site
$60.25 - $77.50/hr
The Opportunity Join Intel Foundry Services as aSenior Technical Solutions Engineer - Advanced Packaging and become the cornerstone of customer success for our key Packaging and Test accounts. This ...
Hillsboro, OR · On-site
$60.25 - $77.50/hr
The Opportunity Join Intel Foundry Services as aSenior Technical Solutions Engineer - Advanced Packaging and become the cornerstone of customer success for our key Packaging and Test accounts. This ...
The Role and Impact Intel Foundry is seeking an exceptional Advanced Packaging Dry Etch Module Development Manager to lead our plasma etch technology development for next-generation packaging ...
The Role and Impact Intel Foundry is seeking an exceptional Advanced Packaging Dry Etch Module Development Manager to lead our plasma etch technology development for next-generation packaging ...
The Role and Impact Intel Foundry is seeking an exceptional Advanced Packaging Dry Etch Module Development Manager to lead our plasma etch technology development for next-generation packaging ...
The Role and Impact Intel Foundry is seeking an exceptional Advanced Packaging Dry Etch Module Development Manager to lead our plasma etch technology development for next-generation packaging ...
This role is pivotal in enabling our foundry customers who are using Intel's advanced technology solutions, including our cutting-edge Advanced Packaging capabilities. Key Responsibilities: * Own the ...
This role is pivotal in enabling our foundry customers who are using Intel's advanced technology solutions, including our cutting-edge Advanced Packaging capabilities. Key Responsibilities: * Own the ...
Prior experience in optimizing silicon performance and conducting tradeoff studies for advanced packaging designs. Join Intel and become an integral part of shaping tomorrow's technology today. Apply ...
Prior experience in optimizing silicon performance and conducting tradeoff studies for advanced packaging designs. Join Intel and become an integral part of shaping tomorrow's technology today. Apply ...
Hillsboro, OR · On-site
$220K - $311K/yr
Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx)
New
Hillsboro, OR · On-site
$220K - $311K/yr
Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx)
New
Your work will directly impact Intel's ability to execute advanced packaging roadmaps by delivering state-of-the-art hybrid bonding solutions with industry-leading performance, reliability, and cost ...
Your work will directly impact Intel's ability to execute advanced packaging roadmaps by delivering state-of-the-art hybrid bonding solutions with industry-leading performance, reliability, and cost ...
Your work will directly impact Intel's ability to execute advanced packaging roadmaps by delivering state-of-the-art hybrid bonding solutions with industry-leading performance, reliability, and cost ...
Your work will directly impact Intel's ability to execute advanced packaging roadmaps by delivering state-of-the-art hybrid bonding solutions with industry-leading performance, reliability, and cost ...
Hillsboro, OR · On-site
$98K - $193K/yr
Drive aspects of Advanced Packaging's inline defect data pipeline workflows, logic, New product introduction, configuration, and analysis enabling. * Work closely with partners from automation ...
Hillsboro, OR · On-site
$98K - $193K/yr
Drive aspects of Advanced Packaging's inline defect data pipeline workflows, logic, New product introduction, configuration, and analysis enabling. * Work closely with partners from automation ...
Hillsboro, OR · On-site
$98K - $193K/yr
Drive aspects of Advanced Packaging's inline defect data pipeline workflows, logic, New product introduction, configuration, and analysis enabling. * Work closely with partners from automation ...
Hillsboro, OR · On-site
$98K - $193K/yr
Drive aspects of Advanced Packaging's inline defect data pipeline workflows, logic, New product introduction, configuration, and analysis enabling. * Work closely with partners from automation ...
Experience in semiconductor manufacturing and/or advanced packaging technologies. * Experience with packaging process development, assembly equipment, or manufacturing optimization. * Knowledge of ...
Experience in semiconductor manufacturing and/or advanced packaging technologies. * Experience with packaging process development, assembly equipment, or manufacturing optimization. * Knowledge of ...
Experience in semiconductor manufacturing and/or advanced packaging technologies. * Experience with packaging process development, assembly equipment, or manufacturing optimization. * Knowledge of ...
Experience in semiconductor manufacturing and/or advanced packaging technologies. * Experience with packaging process development, assembly equipment, or manufacturing optimization. * Knowledge of ...
Hillsboro, OR · On-site
$17.25 - $20/hr
... advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments.
Hillsboro, OR · On-site
$17.25 - $20/hr
... advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments.
Advanced Packaging Planning (bump, sort, and wafer level assembly) * Back-End Planning (assembly and test) * Customer Order Management * Ensure alignment between commit plans and actual execution
Advanced Packaging Planning (bump, sort, and wafer level assembly) * Back-End Planning (assembly and test) * Customer Order Management * Ensure alignment between commit plans and actual execution
Advanced Packaging Planning (bump, sort, and wafer level assembly) * Back-End Planning (assembly and test) * Customer Order Management * Ensure alignment between commit plans and actual execution
Advanced Packaging Planning (bump, sort, and wafer level assembly) * Back-End Planning (assembly and test) * Customer Order Management * Ensure alignment between commit plans and actual execution
Additionally, you will be responsible for adapting the quality systems around the new development around advanced packaging. This position requires strong cross functional leadership and partnership ...
Additionally, you will be responsible for adapting the quality systems around the new development around advanced packaging. This position requires strong cross functional leadership and partnership ...
Additionally, you will be responsible for adapting the quality systems around the new development around advanced packaging. This position requires strong cross functional leadership and partnership ...
Additionally, you will be responsible for adapting the quality systems around the new development around advanced packaging. This position requires strong cross functional leadership and partnership ...
Hillsboro, OR · On-site
$141K - $269K/yr
Experience in advanced packaging technology development and strategic supplier management. * Hybrid Bonding Process development or Integration experience. * Experience with leading technology ...
Hillsboro, OR · On-site
$141K - $269K/yr
Experience in advanced packaging technology development and strategic supplier management. * Hybrid Bonding Process development or Integration experience. * Experience with leading technology ...
Hillsboro, OR · On-site
$141K - $269K/yr
Experience in advanced packaging technology development and strategic supplier management. * Hybrid Bonding Process development or Integration experience. * Experience with leading technology ...
Hillsboro, OR · On-site
$141K - $269K/yr
Experience in advanced packaging technology development and strategic supplier management. * Hybrid Bonding Process development or Integration experience. * Experience with leading technology ...
$13.22 - $14.63
2% of jobs
$14.63 - $16.03
9% of jobs
$17.16 is the 25th percentile. Wages below this are outliers.
$16.03 - $17.44
17% of jobs
The median wage is $18.56 / hr.
$17.44 - $18.85
27% of jobs
$18.85 - $20.26
15% of jobs
$20.69 is the 75th percentile. Wages above this are outliers.
$20.26 - $21.67
15% of jobs
$21.67 - $23.08
6% of jobs
$23.08 - $24.49
4% of jobs
$24.49 - $25.90
3% of jobs
$25.90 - $27.31
1% of jobs
$27.31 - $28.72
0% of jobs
$13
$19
$28
To excel in Advanced Packaging, you need a strong background in materials science, engineering, semiconductor fabrication, and process optimization, often supported by a relevant degree and industry experience. Familiarity with advanced packaging equipment, cleanroom protocols, and design software such as CAD tools or SEM analysis is typically required. Attention to detail, problem-solving abilities, and effective cross-functional communication are valuable soft skills in this role. These competencies are vital for developing innovative packaging solutions that meet stringent technical standards and support product reliability in high-tech manufacturing environments.
Professionals in Advanced Packaging frequently encounter challenges related to keeping pace with rapidly evolving semiconductor technologies and strict quality control standards. The work often requires collaborating closely with R&D, process engineering, and manufacturing teams to troubleshoot issues and continuously improve packaging designs. Maintaining precision in a high-stakes, cleanroom environment and adapting to new materials or methods are also common aspects of the job. These challenges offer valuable opportunities for skill development and innovation, making the role both demanding and rewarding for those passionate about advanced manufacturing.
An Advanced Packaging job involves developing and implementing semiconductor packaging technologies to enhance performance, power efficiency, and miniaturization. Professionals in this role work on heterogeneous integration, 2.5D/3D packaging, wafer-level packaging, and advanced interconnect solutions. They collaborate with design, process, and manufacturing teams to optimize package reliability and scalability. This role is critical in enabling next-generation chips for applications like AI, high-performance computing, and mobile devices.

Full-time
Medical, Life, PTO
Posted 14 days ago
8.1
Based on 337 frontline employees who took The Breakroom Quiz
104th of 515 rated manufacturers
Northrop Grumman Mission Systems (NGMS) Sector is seeking a Manager Programs 2 to join theNorthrop Grumman Microelectronics Center (NGMC)to support the Foundry, Test, and Advanced Packaging Operating Unit's Advanced Packaging team. The person hired in this position will have the option to work remotely.
For more than 70 years, Northrop Grumman's Microelectronics Center, part of Northrop Grumman Mission Systems, has pushed the boundaries in this ever-evolving field of microelectronics. Our U.S.-based, government-trusted foundries and state-of-the-art advanced packaging facilities set the standard, designing and delivering millions of defense and commercial microelectronics components each year. From innovative design to precise fabrication, our mission-tailored solutions provide unparalleled performance, ensuring our technology meets the most demanding challenges.
The Advanced Packaging team develops and deploys next-generation microelectronics packaging technologies for future defense systems. We focus on development, prototyping, maturation, and scaling of advanced packaging technologies to meet the needs of our sectors and their operating divisions.
What You'll Get To Do:
The selected candidate will be responsible for shaping, capture, and execution of advanced packaging technology development, prototyping, and maturation programs. The selected candidate will be responsible for numerous aspects of the program including: managing cost, schedule, and technical performance of the program; leading interfaces with internal and external customers, supplier partners, and company support organizations; supporting insertion of these technologies into other IRAD, CRAD, or production programs; identifying growth opportunities and play significant roles in bid and proposal activities; and interfacing with technical leadership across Northrop Grumman to identify technology needs and timelines to support next-generation systems.
The selected candidate will own the delivery of all contractual requirements on cost and on schedule, while achieving all technical requirements and creating customer intimacy to support value creation strategies and actions.
Program Managers are responsible for leading all phases of the program life cycle from inception (proposal development) through startup, execution, and completion (contract closeout). Primary responsibilities are the management of cost, schedule, and technical performance of company programs or subsystems and include, but are not limited to:
Cultivating customer relationships and intimacy to develop further opportunities within the customer community.
Developing new business opportunities through long term strategic planning, capture planning, and development of proposals and business plans.
Establishing a program organization that effectively addresses customer requirements and incorporates the necessary internal and external sub-organizations.
Leading and directing cross-functional Integrated Program Teams (IPT) to meet program cost, schedule and technical performance objectives.
Measuring and reporting program performance.
Delivering presentations to customers, executive management and other program stakeholders.
Participating in the negotiation of contracts, contract changes, specifications, operating budgets, schedule milestones, and key terms and conditions.
Establishing design concepts, criteria, and engineering efforts for product research, development, integration and test.
Creation, review and finalization of the program Statement of Work.
Identification, distribution, tracking, and completion of program requirements.
Establishment and management of the program and subordinate baselines.
Development and adherence to budget baselines utilizing Earned Value Management (EVM) or similar cost & schedule control methodologies and tools.
Identifying, allocating and managing program resources, including workforce planning.
Managing Government/customer supplied property or information (GFE, CFE, etc.)
Managing suppliers to meet program objectives.
Adherence to all internal processes, policies, and applicable industry standards.
Ensuring program team understands and adheres to contract scope, and manages change through control board activities.
Development and adherence to master plans and schedules.
Conducting thorough risk & opportunity management practices including identification, mitigation and realization.
Basic Qualifications:
Bachelor's Degree and 8+ years of relevant experience, or Master's Degree and 6+ years of relevant experience, or a PhD and 3+ year of relevant experience supporting U.S. Government contracts and customers and/or project management in commercial industry.
Demonstrated experience leading teams in the performance of tasks on schedule, at cost and achieving all requirements as either project lead, integrated program team or cost account manager.
Demonstrated technical experience supporting the research, development, production, and deployment of microelectronics and advanced packaging technologies.
Demonstrated verbal and written communication skills through development and delivery of white papers, proposals, technical presentations, customer briefings, and program reviews.
Demonstrated experience utilizing Earned Value Management (EVM), integrated schedule, and Agile methodologies to support program execution, cost/schedule performance tracking and risk management.
Ability to travel domestically as required based on program and business requirements.
U.S. Citizenship required.
Active U.S. Government Secret clearance required to be considered, the ability to obtain and maintain a Special Access Programs (SAPs), and the ability to occasionally travel on-site to work in classified areas.
Preferred Qualifications:
Master's or Ph.D. degree in a science or technology field related to microelectronics and semiconductors.
Demonstrated experience managing the research, development, and manufacturing of microelectronics and advanced packaging.
Demonstrated experience interfacing with U.S. Government, defense, and commercial customers to define technical solutions for their microelectronics fabrication and/or packaging needs.
Demonstrated knowledge of those customers' planning, program creation, and program management processes.
5+ years of experience leading semiconductor technology development or production programs, operations management, knowledge of RF & digital system products, capabilities and enabling technologies.
Familiarity with Federal Acquisition Regulations (FAR) and Defense Federal Acquisition Regulations (DFAR).
Active U.S. Government Top Secret clearance.
What We Can Offer You
Northrop Grumman provides a comprehensive benefits package and a work environment which encourages your growth and supports the mutual success of our people and our company. Northrop Grumman benefits give you the flexibility and control to choose the benefits that make the most sense for you and your family. Your benefits will include the following: Health Plan, Savings Plan, Paid Time Off and Additional Benefits including Education Assistance, Training and Development, 9/80 Work Schedule (where available), and much more!
Primary Level Salary Range: $153,800.00 - $230,800.00The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.Get the full story on Breakroom
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At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible.
Space research administration
10,000+ Employees
Falls Church, VA, US
1939