Module Development Engineer
$148K - $209K/yr
Preferred Qualifications - Experience in wafer-level assembly, epoxy, mold materials, annealing or related fields in advanced packaging. - Demonstrated expertise in leading programs from strategy ...
Module Development Engineer
$148K - $209K/yr
Preferred Qualifications - Experience in wafer-level assembly, epoxy, mold materials, annealing or related fields in advanced packaging. - Demonstrated expertise in leading programs from strategy ...
Module Development Engineer
Hillsboro, OR · On-site
$133K - $255K/yr
Preferred Qualifications - Experience in wafer-level assembly, epoxy, mold materials, annealing or related fields in advanced packaging. - Demonstrated expertise in leading programs from strategy ...
Module Development Engineer
Hillsboro, OR · On-site
$133K - $255K/yr
Preferred Qualifications - Experience in wafer-level assembly, epoxy, mold materials, annealing or related fields in advanced packaging. - Demonstrated expertise in leading programs from strategy ...
Module Development Engineer
$148K - $209K/yr
Preferred Qualifications - Experience in wafer-level assembly, epoxy, mold materials, annealing or related fields in advanced packaging. - Demonstrated expertise in leading programs from strategy ...
Module Development Engineer
$148K - $209K/yr
Preferred Qualifications - Experience in wafer-level assembly, epoxy, mold materials, annealing or related fields in advanced packaging. - Demonstrated expertise in leading programs from strategy ...
Module Development Engineer
$148K - $209K/yr
Preferred Qualifications - Experience in wafer-level assembly, epoxy, mold materials, annealing or related fields in advanced packaging. - Demonstrated expertise in leading programs from strategy ...
Module Development Engineer
$148K - $209K/yr
Preferred Qualifications - Experience in wafer-level assembly, epoxy, mold materials, annealing or related fields in advanced packaging. - Demonstrated expertise in leading programs from strategy ...
Module Development Engineer
$133K - $255K/yr
Preferred Qualifications - Experience in wafer-level assembly, epoxy, mold materials, annealing or related fields in advanced packaging. - Demonstrated expertise in leading programs from strategy ...
Module Development Engineer
$133K - $255K/yr
Preferred Qualifications - Experience in wafer-level assembly, epoxy, mold materials, annealing or related fields in advanced packaging. - Demonstrated expertise in leading programs from strategy ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
Yield Engineer
Vernonia, OR · Hybrid
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
Yield Engineer
Vernonia, OR · Hybrid
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
Yield Engineer
Portland, OR · Hybrid
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
Yield Engineer
Portland, OR · Hybrid
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
Yield Engineer
Hillsboro, OR · Hybrid
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
Yield Engineer
Hillsboro, OR · Hybrid
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
Yield Engineer
Lafayette, OR · Hybrid
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
Yield Engineer
Lafayette, OR · Hybrid
... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...
Advanced Packaging information
See Oregon salary details
$13.22 - $14.63
2% of jobs
$14.63 - $16.03
9% of jobs
$17.16 is the 25th percentile. Wages below this are outliers.
$16.03 - $17.44
17% of jobs
The median wage is $18.56 / hr.
$17.44 - $18.85
27% of jobs
$18.85 - $20.26
15% of jobs
$20.69 is the 75th percentile. Wages above this are outliers.
$20.26 - $21.67
15% of jobs
$21.67 - $23.08
6% of jobs
$23.08 - $24.49
4% of jobs
$24.49 - $25.90
3% of jobs
$25.90 - $27.31
1% of jobs
$27.31 - $28.72
0% of jobs
$13
$19
$28
How much do advanced packaging jobs pay per hour?
As of Aug 9, 2026, the average hourly pay for advanced packaging in Oregon is $19.93, according to ZipRecruiter salary data. Most workers in this role earn between $17.26 and $21.11 per hour, depending on experience, location, and employer.
What are the key skills and qualifications needed to thrive in advanced packaging?
To excel in Advanced Packaging, you need a strong background in materials science, engineering, semiconductor fabrication, and process optimization, often supported by a relevant degree and industry experience. Familiarity with advanced packaging equipment, cleanroom protocols, and design software such as CAD tools or SEM analysis is typically required. Attention to detail, problem-solving abilities, and effective cross-functional communication are valuable soft skills in this role. These competencies are vital for developing innovative packaging solutions that meet stringent technical standards and support product reliability in high-tech manufacturing environments.
What are the most common challenges faced by professionals in advanced packaging roles?
Professionals in Advanced Packaging frequently encounter challenges related to keeping pace with rapidly evolving semiconductor technologies and strict quality control standards. The work often requires collaborating closely with R&D, process engineering, and manufacturing teams to troubleshoot issues and continuously improve packaging designs. Maintaining precision in a high-stakes, cleanroom environment and adapting to new materials or methods are also common aspects of the job. These challenges offer valuable opportunities for skill development and innovation, making the role both demanding and rewarding for those passionate about advanced manufacturing.
What is an advanced packaging?
An Advanced Packaging job involves developing and implementing semiconductor packaging technologies to enhance performance, power efficiency, and miniaturization. Professionals in this role work on heterogeneous integration, 2.5D/3D packaging, wafer-level packaging, and advanced interconnect solutions. They collaborate with design, process, and manufacturing teams to optimize package reliability and scalability. This role is critical in enabling next-generation chips for applications like AI, high-performance computing, and mobile devices.
What are popular job titles related to Advanced Packaging jobs in Oregon? For Advanced Packaging jobs in Oregon, the most frequently searched job titles are:
What job categories do people searching Advanced Packaging jobs in Oregon look for? The top searched job categories for Advanced Packaging jobs in Oregon are:
What cities in Oregon are hiring for Advanced Packaging jobs? Cities in Oregon with the most Advanced Packaging job openings:
$148K - $209K/yr
Full-time
Medical, Retirement, PTO
Re-posted 4 days ago
Intel rating
8.7
Based on 147 frontline employees who took The Breakroom Quiz
19th of 156 rated electronics manufacturers
Job description
Job Description
- Strong problem-solving skills and ability to address complex technical challenges.
- Proven track record of collaboration with cross-functional teams, including yield, operations, and supplier management.
Qualifications
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.
The Role and Impact
As a Module Development Engineer, you will play a pivotal role in driving advancements in Intel's semiconductor manufacturing technologies. Your contributions will focus on developing and enabling cutting-edge processes for high-volume manufacturing while laying the groundwork for future technological innovations. By leveraging your expertise in process development, equipment optimization, and material science, you will be instrumental in creating robust, scalable solutions that align with Intel's commitment to leadership in semiconductor technology. Working cross-functionally with internal teams and external partners, you will ensure seamless integration of advanced manufacturing processes to meet product performance, yield, and reliability standards.
Key Responsibilities
- Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
- Drive technology development and enablement for both high-volume manufacturing and future technologies.
- Perform feasibility studies using simulations and engineering methodologies to meet desired device specifications.
- Conduct pathfinding activities to develop innovative process solutions for next-generation device architectures.
- Develop and implement technology roadmaps to guide future manufacturing needs.
- Collaborate with equipment and material suppliers to design and implement enabling process technologies.
- Optimize production efficiency, manufacturing techniques, and output for existing and new products.
- Utilize statistical process control and data analytics to enhance process stability and drive continuous improvements.
- Recommend and execute modifications to operational equipment to boost efficiency and manufacturing scalability.
- Partner with cross-functional teams to ensure alignment on process integration and project deliverables.
The candidate should demonstrate the following behavioral traits.
- Strong problem-solving skills and ability to address complex technical challenges.
- Proven track record of collaboration with cross-functional teams, including yield, operations, and supplier management.
Qualifications
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications
- PhD degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 1+ years of relevant experience.
- OR Master's degree in the same fields with 4+ years of experience.
Experience listed above should be a combination in the following:
- Manufacturing process development experience, statistical process control, process improvement, and data analytics.
-Hands on experience in wafer-level assembly, semiconductor processing, or advanced packaging technology development.
Preferred Qualifications
- Experience in wafer-level assembly, epoxy, mold materials, annealing or related fields in advanced packaging.
- Demonstrated expertise in leading programs from strategy formation to high-volume production.
- Familiarity with advanced packaging technologies such as hybrid bonded interconnects, RDL-based packaging, or ultra-fine pitch solder connections.
- Experience in design rule development for Manufacturability/ REL
Join Intel's team and help shape the future of semiconductor technology through innovation and excellence.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.
About Intel
Sourced by ZipRecruiter
Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
Industry
Manufacturing
Company size
10,000+ Employees
Headquarters location
Santa Clara, CA, US
Year founded
1968