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Advanced Packaging Jobs in Oregon (NOW HIRING)

Intel

Quality Operations Manager (QOM)

Hillsboro, OR · On-site

Act as a central integrator across Technology Development, Manufacturing, Advanced Packaging, and Customer-facing organizations * Drive resolution of complex, cross-organizational issues across ...

Orbotech

Product Development Engineer

Hillsboro, OR

$100K - $170K/yr

Customers from the foundry, logic, memory, automotive, MEMS, advanced packaging and other markets rely upon high-sample wafer inspection information generated by LS-SWIFT products. LS (Laser Scanning ...

Intel

Substrate Quality Engineer

Hillsboro, OR · On-site

$78K - $101K/yr

Minimum of 10 years of experience in the semiconductor industry, including experience in silicon process development and advanced packaging. * Proven experience leading and influencing cross ...

KLA Corporation

Product Development Engineer

Hillsboro, OR · On-site

$100K - $170K/yr

Customers from the foundry, logic, memory, automotive, MEMS, advanced packaging and other markets rely upon high-sample wafer inspection information generated by LS-SWIFT products. LS (Laser Scanning ...

Intel Corporation

Supply Chain Engineer

Hillsboro, OR · On-site

Preferred Qualifications: - Comprehensive understanding of semiconductor manufacturing processes and advanced packaging technologies. Shape the future of semiconductor supply chain innovation by ...

Intel

Supply Chain Engineer

Hillsboro, OR

Preferred Qualifications: - Comprehensive understanding of semiconductor manufacturing processes and advanced packaging technologies. Shape the future of semiconductor supply chain innovation by ...

Nvidia

Principal CPU Power Architect

Hillsboro, OR · On-site

Experience of advanced packaging technologies. * Strong communication skills. NVIDIA is a global leader in accelerated computing, delivering breakthroughs in AI, HPC, and advanced system design. Our ...

K2 Space

OR · On-site

$170K - $250K/yr

Experience with chip-package co-design or advanced packaging (2.5D/3D). * Familiarity with physical design service vendor management or offshore collaboration. * Experience with sign-off through TSMC.

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How much do advanced packaging jobs pay per hour?

As of Jun 13, 2026, the average hourly pay for advanced packaging in Oregon is $19.93, according to ZipRecruiter salary data. Most workers in this role earn between $17.26 and $21.11 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive in the Advanced Packaging position, and why are they important?

To excel in Advanced Packaging, you need a strong background in materials science, engineering, semiconductor fabrication, and process optimization, often supported by a relevant degree and industry experience. Familiarity with advanced packaging equipment, cleanroom protocols, and design software such as CAD tools or SEM analysis is typically required. Attention to detail, problem-solving abilities, and effective cross-functional communication are valuable soft skills in this role. These competencies are vital for developing innovative packaging solutions that meet stringent technical standards and support product reliability in high-tech manufacturing environments.

What are the most common challenges faced by professionals in Advanced Packaging roles?

Professionals in Advanced Packaging frequently encounter challenges related to keeping pace with rapidly evolving semiconductor technologies and strict quality control standards. The work often requires collaborating closely with R&D, process engineering, and manufacturing teams to troubleshoot issues and continuously improve packaging designs. Maintaining precision in a high-stakes, cleanroom environment and adapting to new materials or methods are also common aspects of the job. These challenges offer valuable opportunities for skill development and innovation, making the role both demanding and rewarding for those passionate about advanced manufacturing.

What is an Advanced Packaging job?

An Advanced Packaging job involves developing and implementing semiconductor packaging technologies to enhance performance, power efficiency, and miniaturization. Professionals in this role work on heterogeneous integration, 2.5D/3D packaging, wafer-level packaging, and advanced interconnect solutions. They collaborate with design, process, and manufacturing teams to optimize package reliability and scalability. This role is critical in enabling next-generation chips for applications like AI, high-performance computing, and mobile devices.

What are popular job titles related to Advanced Packaging jobs in Oregon? For Advanced Packaging jobs in Oregon, the most frequently searched job titles are:
What job categories do people searching Advanced Packaging jobs in Oregon look for? The top searched job categories for Advanced Packaging jobs in Oregon are:
What cities in Oregon are hiring for Advanced Packaging jobs? Cities in Oregon with the most Advanced Packaging job openings:
Advanced Packaging jobs near you
Foveros Direct Pathfinding Integration

Foveros Direct Pathfinding Integration

Intel Corporation

Hillsboro, OR • On-site

$141K - $269K/yr

Full-time

Medical, Retirement, PTO

Posted just now

Intel rating

8.8

Company rating: 8.8 out of 10

Based on 143 frontline employees who took The Breakroom Quiz

8th of 139 rated electronics manufacturers

Job description

Job Details:
Job Description:
Discover how your skills and expertise can have a lasting impact on Intel's industry-leading innovations. Apply today to become part of the team shaping the future of semiconductor packaging technology.
Some of the responsibilities will include but not be limited to:
  • You will apply scientific and engineering principles to design, develop, and qualify packaging solutions and materials used to hold, display, dispense, and safely transport all types of products.
  • Manage the packaging development process including packaging artwork development, concepts, prototypes, qualification testing, specification documentation, coordination with manufacturing, regulatory, logistics, and supply chain partners, vendor selection and qualification, manufacturing startup, and benchmarking. Identifies and implements processes to drive efficiency, cost, manufacturability, waste reduction, sustainability, logistics, and/or packaging supply chain improvement opportunities.
  • Consult cross organizational partners on product launch, branding and marketing, SKU, barcodes and labeling, scaling, packaging supply chain, logistics, regulatory and compliance, and bills of material requirements for shipments into Intel's product distribution channel.

Qualifications:
Minimum Qualifications
  • Bachelor's degree in engineering, Materials Science, Chemistry, Physics, or a related field, and 6+ years of relevant experience; or
  • Master's degree in engineering, Materials Science, Chemistry, Physics, or a related field, and 4+ years of relevant experience; or
  • PhD in Engineering, Materials Science, Chemistry, Physics, or a related field, and 4+ years of relevant experience.
  • Experience in packaging engineering, process development, and technology innovation.
  • Experience in thermal, mechanical, and electrical design concepts related to semiconductor packaging.
  • Expertise in qualification testing, specification documentation, and packaging material certification.

Preferred Qualifications
  • Experience in advanced packaging technology development and strategic supplier management.
  • Hybrid Bonding Process development or Integration experience.
  • Experience with leading technology programs and engaging with cross-functional stakeholders.
  • Experience participating in forums, task forces, or working groups driving defect reduction and process improvements.

Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
US, Arizona, Phoenix
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $141,910.00-269,100.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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