1

Advanced Packaging Jobs in Oregon (NOW HIRING)

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...

Process Development Engineer

Vernonia, OR · On-site

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...

... advanced semiconductor packaging technology development. Your efforts will contribute to the design, optimization, and enablement of cutting-edge manufacturing processes, ensuring the successful ...

Process Development Engineer

Portland, OR · On-site

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...

Senior Technologist, Hybrid Bonding Module

Hillsboro, OR · Hybrid

$113K - $156K/yr

... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...

... advanced semiconductor packaging technology development. Your efforts will contribute to the design, optimization, and enablement of cutting-edge manufacturing processes, ensuring the successful ...

... advanced semiconductor packaging technology development. Your efforts will contribute to the design, optimization, and enablement of cutting-edge manufacturing processes, ensuring the successful ...

... advanced semiconductor packaging technology development. Your efforts will contribute to the design, optimization, and enablement of cutting-edge manufacturing processes, ensuring the successful ...

... advanced semiconductor packaging technology development. Your efforts will contribute to the design, optimization, and enablement of cutting-edge manufacturing processes, ensuring the successful ...

Module Development Engineer

Portland, OR · On-site

$148K - $209K/yr

Preferred Qualifications - Experience in wafer-level assembly, epoxy, mold materials, annealing or related fields in advanced packaging. - Demonstrated expertise in leading programs from strategy ...

Showing results 21-40

Advanced Packaging information

See Oregon salary details

$13

$19

$28

How much do advanced packaging jobs pay per hour?

As of Aug 9, 2026, the average hourly pay for advanced packaging in Oregon is $19.93, according to ZipRecruiter salary data. Most workers in this role earn between $17.26 and $21.11 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive in advanced packaging?

To excel in Advanced Packaging, you need a strong background in materials science, engineering, semiconductor fabrication, and process optimization, often supported by a relevant degree and industry experience. Familiarity with advanced packaging equipment, cleanroom protocols, and design software such as CAD tools or SEM analysis is typically required. Attention to detail, problem-solving abilities, and effective cross-functional communication are valuable soft skills in this role. These competencies are vital for developing innovative packaging solutions that meet stringent technical standards and support product reliability in high-tech manufacturing environments.

What are the most common challenges faced by professionals in advanced packaging roles?

Professionals in Advanced Packaging frequently encounter challenges related to keeping pace with rapidly evolving semiconductor technologies and strict quality control standards. The work often requires collaborating closely with R&D, process engineering, and manufacturing teams to troubleshoot issues and continuously improve packaging designs. Maintaining precision in a high-stakes, cleanroom environment and adapting to new materials or methods are also common aspects of the job. These challenges offer valuable opportunities for skill development and innovation, making the role both demanding and rewarding for those passionate about advanced manufacturing.

What is an advanced packaging?

An Advanced Packaging job involves developing and implementing semiconductor packaging technologies to enhance performance, power efficiency, and miniaturization. Professionals in this role work on heterogeneous integration, 2.5D/3D packaging, wafer-level packaging, and advanced interconnect solutions. They collaborate with design, process, and manufacturing teams to optimize package reliability and scalability. This role is critical in enabling next-generation chips for applications like AI, high-performance computing, and mobile devices.

What are popular job titles related to Advanced Packaging jobs in Oregon? For Advanced Packaging jobs in Oregon, the most frequently searched job titles are:
What job categories do people searching Advanced Packaging jobs in Oregon look for? The top searched job categories for Advanced Packaging jobs in Oregon are:
What cities in Oregon are hiring for Advanced Packaging jobs? Cities in Oregon with the most Advanced Packaging job openings:
Infographic showing various Advanced Packaging job openings in Oregon as of July 2026, with employment types broken down into 1% As Needed, 78% Full Time, 18% Part Time, 2% Contract, and 1% Nights. Highlights an 81% Physical, 2% Hybrid, and 17% Remote job distribution, with an average salary of $41,444 per year, or $19.9 per hour.

Key Account Technologist, Advanced Logic

Thermo Fisher Scientific

Hillsboro, OR

Full-time

Posted 9 days ago


Thermo Fisher Scientific rating

7.7

Company rating: 7.7 out of 10

Based on 422 frontline employees who took The Breakroom Quiz

196th of 537 rated manufacturers


Job description

Work Schedule

Standard (Mon-Fri)

Environmental Conditions

Office

Job Description

As part of the Thermo Fisher Scientific team, you’ll discover meaningful work that makes a positive impact on a global scale. Join our colleagues in bringing our Mission to life every single day to enable our customers to make the world healthier, cleaner and safer. We provide our global teams with the resources needed to achieve individual career goals while helping to take science a step beyond by developing solutions for some of the world’s toughest challenges, like protecting the environment, making sure our food is safe or helping find cures for cancer.
DESCRIPTION:

The Key Account Technologist, Advanced Logic will serve as a senior technical and strategic interface between strategic semiconductor accounts, commercial teams, product marketing, and business leadership with respect to advanced logic technology. This role is responsible for translating customer technology roadmaps, market inflection points, and emerging use-case needs into actionable portfolio and growth recommendations. The successful candidate will combine strong semiconductor technology expertise with strategic marketing discipline, customer-facing credibility, and the ability to influence cross-functional teams. This individual will help ensure that the company understands where key semiconductor markets are heading, what high-value customer problems are emerging, and how the company’s portfolio should respond.

RESPONSIBILITIES

  • Assess, summarize, and disseminate technology roadmaps for advanced logic semiconductor market segments and associated key accounts.

  • Identify major technology inflection points, understand their implications, and communicate their relevance to internal stakeholders.

  • Track emerging technology opportunities, including areas such as logic scaling, advanced packaging, photonics, heterogeneous integration, and other strategic growth segments.

  • Collect and synthesize field feedback on emerging use-case needs, customer pain points, workflow gaps, and high-value problems.

  • Validate the implications of market and technology inflection points with respect to the Thermo Fisher Scientific portfolio, including current capabilities, gaps, and opportunities.

  • Organize and manage Technology Roadmap Meetings with strategic accounts, ensuring strong preparation, clear objectives, actionable outputs, and follow-through.

  • Translate customer and market insights into strategic recommendations for product management, product marketing, sales, and business leadership.

  • Partner with Product Marketing Management to shape product innovation priorities, identify high-value problems, and develop supporting collateral and business implications.

  • Support intellectual property generation by identifying novel customer problems, technology gaps, or workflow opportunities that may lead to invention disclosures or patent filings.

  • Deliver regular executive-level report-outs on roadmap trends, account insights, technology inflections, and portfolio implications.


DELIVERABLES

  • Publish quarterly updates on logic roadmap trends and major technology inflections.

  • Publish emerging technology notes as needed, including topics such as advanced packaging, photonics, and other priority market areas.

  • Organize bi-annual Technology Roadmap Meetings for strategic accounts.

  • Own TRM planning, coordination, documentation, follow-up, and action tracking.

  • Identify one to two high-value problems or portfolio gaps per planning cycle and collect the technical and commercial collateral needed to define the gap, customer impact, and business implication.

  • Partner with Product Marketing Management to drive product innovation based on validated high-value problems.

  • Support invention disclosure forms, patent filings, or related innovation documentation where appropriate.

  • Provide quarterly report-outs to leadership and cross-functional stakeholders.

REQUIREMENTS:

  • Bachelor’s degree in engineering, materials science, physics, chemistry, semiconductor technology, or a related technical discipline; advanced degree preferred.

  • Significant experience in the semiconductor industry, semiconductor equipment, process technology, metrology, failure analysis, yield improvement, or related technical markets.

  • Demonstrated understanding of semiconductor technology roadmaps, including device, process, packaging, or manufacturing transitions.

  • Experience working with strategic accounts, field sales, applications, product management, product marketing, or technical marketing teams.

  • Ability to identify customer inflection points and translate them into portfolio, commercial, and innovation implications.

  • Strong analytical and synthesis skills, with the ability to turn complex technical and market inputs into clear executive-level communication.

  • Excellent communication and stakeholder management skills, including the ability to influence senior technical and commercial leaders.

  • Proven ability to work effectively in a cross-functional, matrixed environment.


What Thermo Fisher Scientific employees say

Pay

Benefits

Hours and flexibility

Workplace

Get the full story on Breakroom