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Advanced Packaging Jobs in Portland, OR (NOW HIRING)

INTEL

Advanced Packaging Engineer

Portland, OR · On-site

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...

INTEL

Advanced Packaging Engineer

Lafayette, OR · On-site

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...

INTEL

Advanced Packaging Engineer

Vernonia, OR · On-site

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...

INTEL

Advanced Packaging Engineer

Hillsboro, OR

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...

Intel

Silicon Packaging Design Engineer

Hillsboro, OR · On-site

$148K/yr

Prior experience in optimizing silicon performance and conducting tradeoff studies for advanced packaging designs. Join Intel and become an integral part of shaping tomorrow's technology today. Apply ...

INTEL

Packaging Module Development Engineer

Portland, OR · On-site

... advanced packaging. The ideal candidate will have a strong educational foundation in Materials Science, such as Metallurgy or Polymer Science or Polymer Chemistry, with an excellent understanding of ...

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How much do advanced packaging jobs pay per hour?

As of Aug 22, 2026, the average hourly pay for advanced packaging in Portland, OR is $19.99, according to ZipRecruiter salary data. Most workers in this role earn between $17.36 and $21.15 per hour, depending on experience, location, and employer.

What is an advanced packaging?

An Advanced Packaging job involves developing and implementing semiconductor packaging technologies to enhance performance, power efficiency, and miniaturization. Professionals in this role work on heterogeneous integration, 2.5D/3D packaging, wafer-level packaging, and advanced interconnect solutions. They collaborate with design, process, and manufacturing teams to optimize package reliability and scalability. This role is critical in enabling next-generation chips for applications like AI, high-performance computing, and mobile devices.

What are the key skills and qualifications needed to thrive in advanced packaging?

To excel in Advanced Packaging, you need a strong background in materials science, engineering, semiconductor fabrication, and process optimization, often supported by a relevant degree and industry experience. Familiarity with advanced packaging equipment, cleanroom protocols, and design software such as CAD tools or SEM analysis is typically required. Attention to detail, problem-solving abilities, and effective cross-functional communication are valuable soft skills in this role. These competencies are vital for developing innovative packaging solutions that meet stringent technical standards and support product reliability in high-tech manufacturing environments.

What are the most common challenges faced by professionals in advanced packaging roles?

Professionals in Advanced Packaging frequently encounter challenges related to keeping pace with rapidly evolving semiconductor technologies and strict quality control standards. The work often requires collaborating closely with R&D, process engineering, and manufacturing teams to troubleshoot issues and continuously improve packaging designs. Maintaining precision in a high-stakes, cleanroom environment and adapting to new materials or methods are also common aspects of the job. These challenges offer valuable opportunities for skill development and innovation, making the role both demanding and rewarding for those passionate about advanced manufacturing.

Is advanced packaging a stable career?

Advanced packaging is a stable career within the electronics and semiconductor industries, as demand for miniaturized and high-performance electronic devices continues to grow. Professionals in this field often require technical skills, certifications, and familiarity with manufacturing processes, which support long-term employment opportunities.

What job categories do people searching Advanced Packaging jobs in Portland, OR look for?

The top searched job categories for Advanced Packaging jobs in Portland, OR are:

Advanced Packaging jobs near you
Infographic showing various Advanced Packaging job openings in Portland, OR as of August 2026, with employment types broken down into 1% As Needed, 80% Full Time, 16% Part Time, and 3% Contract. Highlights an 88% Physical, 2% Hybrid, and 10% Remote job distribution, with an average salary of $41,570 per year, or $20 per hour.

Advanced Packaging Engineer

INTEL

Portland, OR • On-site

$148K - $209K/yr

Full-time

Medical, Retirement, PTO

Posted 29 days ago

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

19th of 159 rated electronics manufacturers

Job description

Job Description

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions.
Key Responsibilities


- Develop and optimize plasma etch processes for advanced packaging applications
- Design experiments (DOE) to characterize process windows and optimize etch performance
- Develop and execute technology roadmaps to meet future manufacturing needs while pushing industry standards forward.
- Partner with equipment suppliers to design, test, and implement innovative process solutions.
- Monitor and optimize production efficiency, yield, and manufacturing techniques for existing products.
- Identify and implement modifications to improve equipment performance, reduce costs, and enhance production output.
- Collaborate cross-functionally to develop scalable, robust manufacturing solutions aligned with Intel's strategic objectives.


Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates

Minimum Qualifications


- Master or PhD degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.
- Master's degree with at least 4 years of experience, or PhD with at least 2 years of experience.

Experience listed above should be a combination of the following:


- Process development engineering within semiconductor manufacturing, including wafer-level assembly or advanced packaging processes.

- Design of Experiments (DOE), process development methodology, statistical process control, and/or manufacturing process improvement.
- Experience with plasma etch equipment platforms

Preferred Qualifications


- Experience in wafer-level assembly, advanced packaging, or related technologies.
- Demonstrated success in leading programs from initial strategy development through high-volume production.
- Technical leadership experience in solving complex engineering challenges and driving industry-leading solutions.
- Strong cross-functional collaboration skills with stakeholders in yield, operations, and other functional areas.
Intel is looking for forward-thinking, skilled engineers who are passionate about advancing the boundaries of semiconductor technology. Join us to help shape the future of innovation. Apply now and become a part of Intel's mission to create world-changing technologies that improve lives.


Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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