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Advanced Packaging Jobs in Portland, OR (NOW HIRING)

MKS Instruments, Inc.

Sr. Mgr, Product Marketing

Beaverton, OR · On-site

$125K - $164K/yr

Experience supporting advanced packaging, IC substrate, FC-BGA, advanced FC-BGA, heterogeneous integration, HBM, or AI-related packaging applications. Experience with semiconductor capital equipment ...

INTEL

Process Development Engineer

Vernonia, OR

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...

INTEL

Process Development Engineer

Lafayette, OR · On-site

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...

INTEL

Process Engineer

Vernonia, OR · On-site

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...

INTEL

Process Engineer

Hillsboro, OR

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...

INTEL

Process Engineer

Lafayette, OR

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...

INTEL

Process Development Engineer

Hillsboro, OR

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...

INTEL

Process Engineer

Portland, OR

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...

Intel

WATD Module Development Engineer

Hillsboro, OR · On-site

... advanced semiconductor packaging technology development. Your efforts will contribute to the design, optimization, and enablement of cutting-edge manufacturing processes, ensuring the successful ...

INTEL

Process Development Engineer

Portland, OR

$148K - $209K/yr

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...

Intel

Senior Technologist, Hybrid Bonding Module

Hillsboro, OR · On-site

$113K - $156K/yr

... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...

Intel

Senior Technologist, Hybrid Bonding Module

Hillsboro, OR · Hybrid

$113K - $156K/yr

... advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both ...

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Advanced Packaging information

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How much do advanced packaging jobs pay per hour?

As of Aug 22, 2026, the average hourly pay for advanced packaging in Portland, OR is $19.99, according to ZipRecruiter salary data. Most workers in this role earn between $17.36 and $21.15 per hour, depending on experience, location, and employer.

What is an advanced packaging?

An Advanced Packaging job involves developing and implementing semiconductor packaging technologies to enhance performance, power efficiency, and miniaturization. Professionals in this role work on heterogeneous integration, 2.5D/3D packaging, wafer-level packaging, and advanced interconnect solutions. They collaborate with design, process, and manufacturing teams to optimize package reliability and scalability. This role is critical in enabling next-generation chips for applications like AI, high-performance computing, and mobile devices.

What are the key skills and qualifications needed to thrive in advanced packaging?

To excel in Advanced Packaging, you need a strong background in materials science, engineering, semiconductor fabrication, and process optimization, often supported by a relevant degree and industry experience. Familiarity with advanced packaging equipment, cleanroom protocols, and design software such as CAD tools or SEM analysis is typically required. Attention to detail, problem-solving abilities, and effective cross-functional communication are valuable soft skills in this role. These competencies are vital for developing innovative packaging solutions that meet stringent technical standards and support product reliability in high-tech manufacturing environments.

What are the most common challenges faced by professionals in advanced packaging roles?

Professionals in Advanced Packaging frequently encounter challenges related to keeping pace with rapidly evolving semiconductor technologies and strict quality control standards. The work often requires collaborating closely with R&D, process engineering, and manufacturing teams to troubleshoot issues and continuously improve packaging designs. Maintaining precision in a high-stakes, cleanroom environment and adapting to new materials or methods are also common aspects of the job. These challenges offer valuable opportunities for skill development and innovation, making the role both demanding and rewarding for those passionate about advanced manufacturing.

Is advanced packaging a stable career?

Advanced packaging is a stable career within the electronics and semiconductor industries, as demand for miniaturized and high-performance electronic devices continues to grow. Professionals in this field often require technical skills, certifications, and familiarity with manufacturing processes, which support long-term employment opportunities.

What job categories do people searching Advanced Packaging jobs in Portland, OR look for?

The top searched job categories for Advanced Packaging jobs in Portland, OR are:

Advanced Packaging jobs near you
Infographic showing various Advanced Packaging job openings in Portland, OR as of August 2026, with employment types broken down into 1% As Needed, 80% Full Time, 16% Part Time, and 3% Contract. Highlights an 88% Physical, 2% Hybrid, and 10% Remote job distribution, with an average salary of $41,570 per year, or $20 per hour.

Packaging Module Development Engineer

INTEL

Lafayette, OR • On-site

Full-time

Medical, Retirement, PTO

Posted 9 days ago

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

19th of 159 rated electronics manufacturers

Job description

Job Description

We are seeking a highly motivated, self-driven individual to join Materials Technology Development (MTD), bringing a strong technical background and a demonstrated ability to collaborate effectively across cross-functional teams to drive materials technology development for advanced packaging. The ideal candidate will have a strong educational foundation in Materials Science, such as Metallurgy or Polymer Science or Polymer Chemistry, with an excellent understanding of structure-property-performance correlations in materials and strong functional knowledge of materials characterization tools and techniques.

The candidate must be able to apply sound technical problem-solving skills to resolve materials-process-equipment challenges in technology development and drive innovative materials solutions for advanced packaging at Intel. This role requires close collaboration with cross organizational stakeholders to deliver novel materials technologies that meet stringent quality and reliability requirements. The candidate must also be able to work effectively with external materials suppliers and possess strong communication and presentation skills, including the ability to formulate and present materials strategies and development plans in both internal and external forums

Note: This role requires regular onsite presence to fulfill essential job responsibilities.

Key Responsibilities:

  • Develops assembly materials, processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.

  • Optimizes and improves the efficiency of manufacturing of packages, developing innovative materials, processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.

  • Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.

  • Develops materials target specifications to ensure excellent integration of materials into packaging equipment and processes meeting quality and reliability targets.

  • Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.

  • Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure materials technology, quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.

  • Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging materials quality and reliability.

  • Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.

  • Leads efforts towards innovating, problem solving, developing, and continuously improving materials, equipment and processes using experimental design and statistical methods.

  • Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur.

  • Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on materials/process/technology maturity for products towards key risk areas in meeting product milestones.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • Bachelor's degree with 4+ years of experience or  Master's degree with 3+ years of experience or Ph.D in a relevant field such as Materials Science, Metallurgy, Chemical Engineering, Chemistry, Mechanical Engineering, or a related discipline.

  • 4+ years of hands-on experience in packaging module development, process characterization, or equipment optimization.

Preferred Qualifications:

  • Experience in collaborating with cross-functional teams, suppliers, and manufacturing operations to achieve shared goals.

  • Proficiency in Design of Experiments (DOE) principles and statistical data analysis tools.

  • Demonstrated expertise in packaging fundamentals, package design and development, and package testing methodologies.

  • Knowledge of reliability and quality requirements for semiconductor packaging.

  • Knowledge of materials structure-property-performance behaviors and materials characterization techniques is highly preferred.

We are excited to welcome passionate engineers who thrive on innovation, collaboration, and driving advancements in technology. If you are ready to make an impact and help shape the future of semiconductor packaging, we invite you to apply today.


Inside this Business Group
Intel makes possible the most amazing experiences of the future. You may know us for our processors. But we do so much more. Intel invents at the boundaries of technology to make amazing experiences possible for business and society, and for every person on Earth. Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. Leading on policy, diversity, inclusion, education and sustainability, we create value for our stockholders, customers, and society.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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