Advanced Packaging Engineer
Phoenix, AZ · On-site
Top Mandatory Skills: * 7+ years of advanced semiconductor packaging experience. * Hands-on experience with 2.5D & 3D packaging technologies . * Strong experience with chiplet architectures and ...
Accroid
4 jobs near Columbus, OH
Advanced Packaging Engineer
Phoenix, AZ · On-site
Top Mandatory Skills: * 7+ years of advanced semiconductor packaging experience. * Hands-on experience with 2.5D & 3D packaging technologies . * Strong experience with chiplet architectures and ...
Product Manager
Fremont, CA · On-site
RESPONSIBILITIES: * Understand and lead customer account processes across our platforms for both personal and business accounts. * Coordinate with security, legal and authentication teams to build ...
Product Manager
Fremont, CA · On-site
RESPONSIBILITIES: * Understand and lead customer account processes across our platforms for both personal and business accounts. * Coordinate with security, legal and authentication teams to build ...
Top Mandatory Skills: * BSEE/MSEE degree. * 3+ years of experience in Product Test or Hardware Verification with a focus on RF instrumentation . * Strong experience developing automated RF test ...
Top Mandatory Skills: * BSEE/MSEE degree. * 3+ years of experience in Product Test or Hardware Verification with a focus on RF instrumentation . * Strong experience developing automated RF test ...
Data Engineer
Minneapolis, MN · On-site
$119K - $143K/yr
Required Skills: * 5+ years of Python development * 5+ years of advanced SQL * 3+ years of Apache Airflow (Cloud Composer) * 3+ years of Google Cloud Platform (BigQuery, Dataflow, Pub/Sub, Cloud ...
Data Engineer
Minneapolis, MN · On-site
$119K - $143K/yr
Required Skills: * 5+ years of Python development * 5+ years of advanced SQL * 3+ years of Apache Airflow (Cloud Composer) * 3+ years of Google Cloud Platform (BigQuery, Dataflow, Pub/Sub, Cloud ...
Other
Posted 4 days ago
Job description
Top Mandatory Skills:
- 7+ years of advanced semiconductor packaging experience.
- Hands-on experience with 2.5D & 3D packaging technologies.
- Strong experience with chiplet architectures and heterogeneous integration.
- Experience with multi-die package design, silicon interposers, TSV, and advanced substrate technologies.
- Experience supporting AI/HPC semiconductor products from concept through production.
- Strong knowledge of package assembly, manufacturing, reliability, yield improvement, and qualification.
- Experience working with OSATs and semiconductor foundries.
- Solid understanding of thermal, mechanical, and electrical aspects of package design.
- Bachelor''''''''''''''''''''''''''''''''s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or related field.
Preferred Skills:
- Experience with CoWoS, Foveros, EMIB, SoIC, or similar advanced packaging technologies.
- HBM integration experience.
- Experience with Cadence Allegro or Siemens Xpedition Package Designer.
- Experience supporting AI Accelerators, GPU, CPU, or ASIC products.
- Knowledge of SI/PI analysis, JEDEC standards, and package failure analysis.